JPH03112501A - Manufacture of hollow ring pipe for decoration - Google Patents
Manufacture of hollow ring pipe for decorationInfo
- Publication number
- JPH03112501A JPH03112501A JP25288289A JP25288289A JPH03112501A JP H03112501 A JPH03112501 A JP H03112501A JP 25288289 A JP25288289 A JP 25288289A JP 25288289 A JP25288289 A JP 25288289A JP H03112501 A JPH03112501 A JP H03112501A
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- tape material
- tape
- acid
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000005034 decoration Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 35
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 28
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052737 gold Inorganic materials 0.000 claims abstract description 14
- 239000010931 gold Substances 0.000 claims abstract description 14
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 14
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 13
- 239000010951 brass Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 12
- 239000000956 alloy Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000010306 acid treatment Methods 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 10
- 239000002253 acid Substances 0.000 abstract description 6
- 239000011259 mixed solution Substances 0.000 abstract description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract description 4
- 229910017604 nitric acid Inorganic materials 0.000 abstract description 4
- 239000007800 oxidant agent Substances 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 abstract 3
- 238000005304 joining Methods 0.000 abstract 1
- 238000003754 machining Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Adornments (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
ネックレス、イヤリングまたはブレスレット等の装飾品
の製造方法に関するもので、より詳しくは該装飾品の材
料となる中空リングパイプの製造方法に関するものであ
る。[Detailed Description of the Invention] (Industrial Application Field) This invention relates to a method for manufacturing ornaments such as necklaces, earrings, or bracelets, and more specifically to a method for manufacturing hollow ring pipes that are used as materials for the ornaments. .
（従来技術とその問題点）
従来、ネックレス、イヤリングまたはブレスレット等の
装飾品に用いる金および白金またはこれらの合金の中空
リングパイプの製造方法として、ダイス引きによる加工
方法があるが、板厚が０．２ｍｍ以下の薄い平板テープ
材、平板テープを打抜き加工したテープ材或いはメツシ
ュ状のテープ材を加工する場合、ダイス引き加工に耐え
る十分な引っ張り強度がないため容易に破断してしまう
という欠点があった。(Prior art and its problems) Conventionally, as a method for manufacturing hollow ring pipes made of gold, platinum, or their alloys for use in decorative items such as necklaces, earrings, or bracelets, there is a die-drawing method. .When processing thin flat tape materials of 2 mm or less, tape materials made by punching flat tapes, or mesh-like tape materials, there is a drawback that they easily break because they do not have sufficient tensile strength to withstand die processing. Ta.
（発明の目的）
本発明は、薄い平板テープ材、打抜き加工したテープ材
或いはメツシュ状のテープ材を簡便なダイス引き加工に
より板厚の薄い中空リングパイプから成るデザインのネ
ックレス、イヤリングまたはブレスレットの装飾品の製
造方法を提供することを目的とするものである。(Object of the Invention) The present invention is a method of decorating necklaces, earrings, or bracelets with a design consisting of a thin hollow ring pipe by using a thin flat tape material, punched tape material, or mesh-like tape material by simple die processing. The purpose is to provide a method for manufacturing products.
（問題点を解・決するための手段）
本発明は、金および白金またはこれらの合金の中空リン
グパイプを平板テープ材、打抜き加工したテープ材また
はメツシュテープ材よりダイス引き加工によって成形す
る際に、銅または真鍮テ−プを前記テープ材両側或いは
片側に当て、パイプ形状に加工した後、銅または真鍮の
当て金を酸処理によって剥離することを特徴とする装飾
用中空リングパイプの製造方法である。(Means for Solving the Problems) The present invention provides a method for forming hollow ring pipes of gold, platinum, or their alloys by die drawing from flat tape material, punched tape material, or mesh tape material. Alternatively, there is a method for manufacturing a decorative hollow ring pipe, which comprises applying brass tape to both sides or one side of the tape material, processing it into a pipe shape, and then peeling off the copper or brass padding by acid treatment.
本発明は金および白金またはこれらの合金のように引っ
張り強度の弱いテープ材を引き抜き加工する際に、金お
よび白金またはこれらの合金を溶解す゛ることがない酸
に容易に溶解し、展延性に富むと同時に必要な引っ張り
強度を有する銅または真鍮のテープ材を当て金として、
該金および白金またはこれらの合金の平板テープ材、打
抜き加工したテープ材またはメツシュテープ材の両側或
いはダイスと接触するパイプの外側に当てて同時に加工
し、中空パイプを得るものである。When drawing a tape material with low tensile strength such as gold, platinum, or an alloy thereof, the present invention can be easily dissolved in an acid that does not dissolve gold, platinum, or an alloy thereof, and is highly malleable. At the same time, a copper or brass tape material with the necessary tensile strength is used as a backing.
A hollow pipe is obtained by applying the flat tape material, punched tape material, or mesh tape material of gold and platinum or their alloys to both sides or the outside of the pipe in contact with the die and processing them at the same time.
得られたパイプは硫酸と酸化剤の混合溶液または硝酸等
の酸で処理することにより、当て金を溶解した後、必要
に応じ接合部を溶接或いはろう付は加工した後、カット
し、端部に止め金をろう付けし装飾品となすものである
。The obtained pipe is treated with a mixed solution of sulfuric acid and an oxidizing agent or an acid such as nitric acid to dissolve the metal fitting, and the joints are welded or brazed as necessary, then cut and the ends are It is made into a decorative item by brazing a stopper to it.
当て金に銅または真鍮テープ材を用いる理由は上記のよ
うに適度の展延性に富むと同時に必要な引っ張り強度を
有すると共に、金および白金またはこれらの合金を溶解
することがない硫酸と酸化剤の混合溶液または硝酸等の
酸に容易に溶解させることができるからである。The reason why copper or brass tape material is used for the padding is that it has appropriate malleability and the necessary tensile strength as mentioned above, and it is free of sulfuric acid and oxidizing agents that do not dissolve gold, platinum, or their alloys. This is because it can be easily dissolved in a mixed solution or in an acid such as nitric acid.
また、当て金に用いる銅または真鍮テープ材の厚みは金
および白金またはこれらの合金のテープ材の厚みや成形
するパイプ径により異なるが、おおむね０．０５ｍｍ以
上であればよ（、好ましくは０．１ｍｍ〜０．３ｍｍで
ある。The thickness of the copper or brass tape material used for the padding varies depending on the thickness of the tape material of gold, platinum, or their alloys and the diameter of the pipe to be formed, but it should be approximately 0.05 mm or more (preferably 0.05 mm or more). It is 1 mm to 0.3 mm.
以下、本発明に係わる実施例を記載するが、該実施例は
本発明を限定するものではない。Examples related to the present invention will be described below, but the examples are not intended to limit the present invention.
（実施例１）
第１図に示す如（厚みＯ，１５ｍｍＸ幅３０ｍｍの金７
５ｗｔ％、銀１２．５ｗｔ％、銅１２，５ｗｔ％の金合
金のテープ材に直径０．５ｍｍの穴をメツシュ状に打抜
き加工を全面に施したものを、厚み０．１ｍｍＸ幅３０
ｍｍの銅のテープ材ｌを２枚上記打抜き加工した金合金
のテープ材２の両側に当て、ダイス３にて引き加工をし
て直径１０ｎｍの中空パイプ４を得た。(Example 1) As shown in Fig. 1 (thickness O, 15 mm x width 30 mm gold 7
5 wt%, silver 12.5 wt%, copper 12.5 wt% gold alloy tape material with holes of 0.5 mm in diameter punched out in a mesh shape on the entire surface, 0.1 mm thick x 30 mm wide.
Two pieces of copper tape material 1 mm in diameter were applied to both sides of the punched gold alloy tape material 2 and drawn using a die 3 to obtain a hollow pipe 4 with a diameter of 10 nm.
次いで、前記中空パイプをブレスレット用の長さ一周分
カットし、３Ｎ硫酸と１％過酸化水素の混合溶液中に浸
漬して銅を溶解した後、接合部をトーチろう付けし、端
部に止め金をろう付けしブレスレットを得た。Next, the hollow pipe was cut around the length for the bracelet, dipped in a mixed solution of 3N sulfuric acid and 1% hydrogen peroxide to dissolve the copper, and the joints were torch-brazed and fixed at the ends. I soldered the gold and made a bracelet.
（実施例２）
第１図に示す如く厚み０．１５ｍｍＸ幅３０ｎ＋ｍの白
金メツシュ５を、厚み０．１ｍｍＸ幅３０ｍｍの真鍮の
テープ材６を２枚上記白金メツシュ５の両側に当て、ダ
イス３にて引き加工をして直径１０ｍｍの中空パイプ７
を得た。(Example 2) As shown in FIG. 1, a platinum mesh 5 with a thickness of 0.15 mm and a width of 30 nm+m is applied to both sides of the platinum mesh 5, and two pieces of brass tape material 6 with a thickness of 0.1 mm and a width of 30 mm are placed on the die 3. Hollow pipe 7 with a diameter of 10 mm
I got it.
次いで、前記中空パイプをブレスレット用の長さ一周分
カットし２０％の硝酸溶液中に浸漬して真鍮を溶解した
後、接合部をトーチろう付けし、端部に止め金をろう付
けしブレスレットを得た。Next, the hollow pipe was cut to the length for the bracelet, immersed in a 20% nitric acid solution to melt the brass, the joints were torch-brazed, and a stopper was brazed to the end to form the bracelet. Obtained.
（実施例３）
第２図に示す如（厚み０．０８ｍｍＸ幅９ｍｍの白金テ
ープ材８に厚み０．３ｍｍＸ幅１０ｍｍの真鍮のテープ
材９を１枚上記白金テープ８の片側に重ね、ダイス３に
て引き加工をして直径３ｍｍの中空パイプｌＯを得た。(Example 3) As shown in FIG. A hollow pipe 10 with a diameter of 3 mm was obtained by drawing.
次いで、前記中空パイプをイヤリングにするため一周分
カットし、３Ｎ硫酸と１％過酸化水素混合溶液中に浸漬
して真鍮を溶解した後、端部に止め金をろう付けしイヤ
リングを得た。Next, the hollow pipe was cut one round to make earrings, and after being immersed in a mixed solution of 3N sulfuric acid and 1% hydrogen peroxide to melt the brass, a stopper was brazed to the end to obtain earrings.
（発明の効果）
以上、説明したように、本発明の製造方法によれば従来
法では得られない、簡便なダイス引き加工により金ある
いは白金またはこれらの合金の薄い平板テープ材、平板
テープを打抜き加工したテープ材またはメツシュテープ
材を中空リングパイプ材に成形することが可能となり、
極めて効果大なるものである。(Effects of the Invention) As explained above, according to the manufacturing method of the present invention, a thin flat tape material or flat tape made of gold or platinum or an alloy thereof can be punched out by a simple die drawing process that cannot be obtained by conventional methods. It is now possible to form processed tape material or mesh tape material into hollow ring pipe material,
This is extremely effective.
第１図は本発明の実施例！、２におけるダイス引き加工
を示す斜視図、第２図は本発明の実施例３におけるダイ
ス引き加工を示す斜視図である。Figure 1 is an example of the present invention! FIG. 2 is a perspective view showing the die drawing process in Example 3 of the present invention.
Claims (1)
イプを平板テープ材、打抜き加工したテープ材またはメ
ッシュテープ材よりダイス引き加工によって成形する際
に、銅または真鍮テープを前記テープ材両側或いは片側
に当て、パイプ形状に加工した後、銅または真鍮の当て
金を酸処理によって剥離することを特徴とする装飾用中
空リングパイプの製造方法。(1) When forming a hollow ring pipe of gold, platinum, or an alloy thereof by die drawing from a flat tape material, punched tape material, or mesh tape material, a copper or brass tape is applied to both sides or one side of the tape material. A method for manufacturing a decorative hollow ring pipe, which comprises removing the copper or brass padding by acid treatment after processing it into a pipe shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25288289A JPH03112501A (en) | 1989-09-28 | 1989-09-28 | Manufacture of hollow ring pipe for decoration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25288289A JPH03112501A (en) | 1989-09-28 | 1989-09-28 | Manufacture of hollow ring pipe for decoration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03112501A true JPH03112501A (en) | 1991-05-14 |
Family
ID=17243475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25288289A Pending JPH03112501A (en) | 1989-09-28 | 1989-09-28 | Manufacture of hollow ring pipe for decoration |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03112501A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002065325A (en) * | 2000-08-29 | 2002-03-05 | Jewelry Aiwa:Kk | Method for processing trinket part |
| JP2008307273A (en) * | 2007-06-15 | 2008-12-25 | Namiki Seisakusho:Kk | Accessory chain clasp manufacturing method |
| CN104000357A (en) * | 2014-06-05 | 2014-08-27 | 东莞市金叶珠宝有限公司 | Manufacturing process for bracelet |
| CN109822300A (en) * | 2019-02-23 | 2019-05-31 | 杭州航民百泰首饰有限公司 | A kind of time immemorial gold bracelet production method |
-
1989
- 1989-09-28 JP JP25288289A patent/JPH03112501A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002065325A (en) * | 2000-08-29 | 2002-03-05 | Jewelry Aiwa:Kk | Method for processing trinket part |
| JP2008307273A (en) * | 2007-06-15 | 2008-12-25 | Namiki Seisakusho:Kk | Accessory chain clasp manufacturing method |
| JP4637874B2 (en) * | 2007-06-15 | 2011-02-23 | 株式会社並木製作所 | Method for manufacturing a stopper for a jewelry chain |
| CN104000357A (en) * | 2014-06-05 | 2014-08-27 | 东莞市金叶珠宝有限公司 | Manufacturing process for bracelet |
| CN109822300A (en) * | 2019-02-23 | 2019-05-31 | 杭州航民百泰首饰有限公司 | A kind of time immemorial gold bracelet production method |
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