JPH03111542U - - Google Patents

Info

Publication number
JPH03111542U
JPH03111542U JP2059890U JP2059890U JPH03111542U JP H03111542 U JPH03111542 U JP H03111542U JP 2059890 U JP2059890 U JP 2059890U JP 2059890 U JP2059890 U JP 2059890U JP H03111542 U JPH03111542 U JP H03111542U
Authority
JP
Japan
Prior art keywords
tape
metal layer
conductive adhesive
conductive
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2059890U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2059890U priority Critical patent/JPH03111542U/ja
Publication of JPH03111542U publication Critical patent/JPH03111542U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Communication Cables (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Insulated Conductors (AREA)
JP2059890U 1990-03-01 1990-03-01 Pending JPH03111542U (US20020051482A1-20020502-M00012.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2059890U JPH03111542U (US20020051482A1-20020502-M00012.png) 1990-03-01 1990-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2059890U JPH03111542U (US20020051482A1-20020502-M00012.png) 1990-03-01 1990-03-01

Publications (1)

Publication Number Publication Date
JPH03111542U true JPH03111542U (US20020051482A1-20020502-M00012.png) 1991-11-14

Family

ID=31523689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2059890U Pending JPH03111542U (US20020051482A1-20020502-M00012.png) 1990-03-01 1990-03-01

Country Status (1)

Country Link
JP (1) JPH03111542U (US20020051482A1-20020502-M00012.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002279831A (ja) * 2001-03-19 2002-09-27 Dainippon Printing Co Ltd フラットケーブル用シールド材及びシールド付きフラットケーブル
JP2002541291A (ja) * 1999-04-01 2002-12-03 ビール エンジニアリング ビー．ブイ． 導電性の形成糊
JP2014019959A (ja) * 2012-07-13 2014-02-03 Daio Paper Corp テープ用基材及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002541291A (ja) * 1999-04-01 2002-12-03 ビール エンジニアリング ビー．ブイ． 導電性の形成糊
JP2002279831A (ja) * 2001-03-19 2002-09-27 Dainippon Printing Co Ltd フラットケーブル用シールド材及びシールド付きフラットケーブル
JP2014019959A (ja) * 2012-07-13 2014-02-03 Daio Paper Corp テープ用基材及びその製造方法

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