JPH0311148B2 - - Google Patents
Info
- Publication number
- JPH0311148B2 JPH0311148B2 JP55098041A JP9804180A JPH0311148B2 JP H0311148 B2 JPH0311148 B2 JP H0311148B2 JP 55098041 A JP55098041 A JP 55098041A JP 9804180 A JP9804180 A JP 9804180A JP H0311148 B2 JPH0311148 B2 JP H0311148B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- spark
- spark electrode
- manufacturing
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
- H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
- H04N3/16—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by deflecting electron beam in cathode-ray tube, e.g. scanning corrections
- H04N3/18—Generation of supply voltages, in combination with electron beam deflecting
- H04N3/19—Arrangements or assemblies in supply circuits for the purpose of withstanding high voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Details Of Television Scanning (AREA)
Description
【発明の詳細な説明】
本発明はテレビジヨン受像機等の陰極線管に発
生する異常電圧を消滅する為に用いられる混成集
積回路用スパーク電極製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a spark electrode for a hybrid integrated circuit used to eliminate abnormal voltage generated in a cathode ray tube of a television receiver or the like.
従来、混成集積回路を使用した陰極線管ユニツ
トでは第１図に示すように陰極線管のピンが嵌合
する嵌合部ａと外部接続部ｂとスパークギヤツプ
電極片ｃが一体に形成されたソケツト金具Ａの前
記電極片ｃに対し、アース用金属体Ｂの電極片ｄ
を対向配置せしめた状態で複数のソケツト金具Ａ
と一枚のアース用金属体Ｂを樹脂Ｅで固定したも
のがスパークギヤツプ電極として用いられてい
た。しかるに、この要求を満たすのは前記の如き
スパーク電極を用いる場合、陰極線管ソケツトの
小型化、組立て工程での工数削減等を考えると困
難な為、プリント基板上の銅等の金属箔によるス
パーク電極形成方法が行なわれることがあるが、
スパーク回数が多くなると前記金属箔にへたりが
生じ正常なスパーク放電が行われなくなり好まし
くなかつた。 Conventionally, in a cathode ray tube unit using a hybrid integrated circuit, as shown in Fig. 1, a socket fitting A is integrally formed with a fitting part a into which a pin of the cathode ray tube fits, an external connection part b, and a spark gap electrode piece c. The electrode piece d of the grounding metal body B is
A plurality of socket fittings A are arranged facing each other.
A piece of earthing metal body B fixed with resin E was used as a spark gap electrode. However, it is difficult to meet this requirement when using the spark electrode as described above, considering the miniaturization of the cathode ray tube socket and the reduction of man-hours in the assembly process, so a spark electrode made of metal foil such as copper on a printed circuit board is used. Formation methods may be used,
If the number of sparks increases, the metal foil will become stale and normal spark discharge will not occur, which is not preferable.
本発明は上述のような点を鑑みなされたもの
で、取り付けが容易で場所をとらず、且つ電極消
耗の極めて少ないスパーク電極の製造方法を提供
しようとするものである。 The present invention has been made in view of the above-mentioned points, and it is an object of the present invention to provide a method for manufacturing a spark electrode that is easy to install, does not take up much space, and has extremely low electrode wear.
以下図面に従つて本発明の実施例を説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第２図は燐青銅板をプレス加工で打ち抜いたス
パーク電極外形体の平面図を示しており、プレス
加工時に透孔１及びスパーク電極固定用小孔２を
設け、外形としては、プリント基板への挿入突片
３と不要部分剥離用突片４が形成され、更に破線
を施こしたところには前記プレス加工時と同時に
第２図のＡ−A′での断面図である第３図に示す
ようなＶ字型の溝５を形成している。第４図はス
パーク電極形成工程の次の段階として両面エツチ
ングにより斜線を施した部分を削除することによ
りスパークギヤツプ６と該スパークギヤツプ６を
形成する対向電極であるところの第１スパーク電
極７と第２スパーク電極８を設けている。前記第
４図の製造過程に於いて第１スパーク電極７、第
２スパーク電極８及びスパークギヤツプ６部分を
プレス加工によらなかつたのは、プレス加工で
は、エツヂのバリ等でスパークギヤツプ６間の距
離に精度が出ず、放電開始電圧にばらつきが生じ
るからである。 Figure 2 shows a plan view of the outer shape of the spark electrode punched out of a phosphor bronze plate by press working. A through hole 1 and a small hole 2 for fixing the spark electrode are formed during the press working, and the outer shape is similar to that of the printed circuit board. An insertion protrusion 3 and an unnecessary part peeling protrusion 4 are formed, and the area indicated by the broken line is shown in Fig. 3, which is a cross-sectional view taken along line A-A' in Fig. 2, at the same time as the press working. A V-shaped groove 5 is formed. FIG. 4 shows the spark gap 6 and the first spark electrode 7 and the second spark electrode, which are the opposing electrodes that form the spark gap 6, by removing the hatched areas by double-sided etching as the next step in the spark electrode forming process. An electrode 8 is provided. The reason why the first spark electrode 7, second spark electrode 8, and spark gap 6 portions were not press-worked in the manufacturing process shown in FIG. This is because accuracy is poor and variations occur in the discharge starting voltage.
第５図はエツチング終了後のスパーク電極外形
体を示す斜視図であり前記プリント基板への挿入
突片３を折曲し、該突片３を第６図に示すプリン
ト基板９に設けられた挿入孔１０に挿入すると共
に第１スパーク電極固定用小孔２と第２スパーク
電極固定用小孔２′に対応するプリント基板上の
位置に印刷焼成された銅箔１１を設け、該銅箔１
１に塗布されたハンダペースト１２により固定さ
れる。第７図は、前記スパーク電極７，８が前記
ハンダペースト１２等によりプリント基板９に固
定された状態を示しており、第８図はハンダペー
スト１２による装着状態を更に詳細に示した側面
図である。 FIG. 5 is a perspective view showing the outer shape of the spark electrode after etching. A printed and fired copper foil 11 is inserted into the hole 10 and provided at a position on the printed circuit board corresponding to the first spark electrode fixing hole 2 and the second spark electrode fixing hole 2'.
It is fixed by solder paste 12 applied to 1. FIG. 7 shows the spark electrodes 7, 8 fixed to the printed circuit board 9 with the solder paste 12, etc., and FIG. be.
最終工程では、前記不要部分剥離用突片４を引
つ張ることにより不要部分を剥離して第９図に示
すような第１スパーク電極７、第２スパーク電極
８とスパークギヤツプ６が形成される。 In the final step, the unnecessary portions are peeled off by pulling the unnecessary portion peeling protrusion 4 to form the first spark electrode 7, the second spark electrode 8, and the spark gap 6 as shown in FIG.
斯る本発明の製造方法に依ればスパークギヤツ
プ間の距離をスパーク電極取り付けの際に変動す
ることなく設置でき、精度の良いスパーク電極が
得られる。 According to the manufacturing method of the present invention, the distance between the spark gaps can be installed without changing when installing the spark electrode, and a highly accurate spark electrode can be obtained.
更に第９図に示した本発明を実施した電極構造
ではスパーク回数の多さによる第１スパーク電極
７と第２スパーク電極８の劣化による放電開始電
圧のばらつきがなく、またプリント基板のスパー
クギヤツプ６のある位置に凹所１３を設けること
により異常な放電を防いでいる為信頼性の極めて
良いスパーク電極となる。本発明を実施すること
により、陰極線管ソケツト及び混成集積回路を組
み込んだプリント基板を小型化出来るのは勿論の
ことである。 Furthermore, in the electrode structure according to the present invention shown in FIG. 9, there is no variation in the discharge starting voltage due to deterioration of the first spark electrode 7 and the second spark electrode 8 due to the large number of sparks, and there is no variation in the discharge starting voltage due to deterioration of the first spark electrode 7 and the second spark electrode 8 due to the large number of sparks. By providing the recess 13 at a certain position, abnormal discharge is prevented, resulting in an extremely reliable spark electrode. Of course, by implementing the present invention, a printed circuit board incorporating a cathode ray tube socket and a hybrid integrated circuit can be miniaturized.
第１図は従来の陰極線管ソケツト内蔵型スパー
ク電極を示す斜視図である。第２図は本発明の製
造方法に係るスパーク電極外形体を示す平面図で
ある。第３図は、第２図のＡ−A′間での断面図
である。第４図は第２図に示したスパーク電極外
形体のエツチング工程図を示す平面図である。第
５図はエツチング終了後のスパーク電極外形体の
挿入突片を折曲したときの斜視図であり、第６図
はプリント基板を示す斜視図である。第７図はス
パーク電極外形体をプリント基板に接着した状態
を示す平面図であり、第８図は接着状態を示す断
面図である。第９図は本発明によつて完成したス
パークギヤツプ電極を示す斜視図である。
１……透孔、２，２′……小孔、３，４……突
片、５……溝、６……ギヤツプ、７……第１スパ
ーク電極、８……第２スパーク電極、９……プリ
ント基板、１０……孔、１１……銅箔、１２……
ハンダペースト、１３……凹所。
FIG. 1 is a perspective view showing a conventional spark electrode built into a cathode ray tube socket. FIG. 2 is a plan view showing the outer shape of the spark electrode according to the manufacturing method of the present invention. FIG. 3 is a sectional view taken along line A-A' in FIG. 2. FIG. 4 is a plan view showing an etching process diagram of the outer shape of the spark electrode shown in FIG. FIG. 5 is a perspective view of the spark electrode outer body after etching, with the insertion protrusion bent, and FIG. 6 is a perspective view of the printed circuit board. FIG. 7 is a plan view showing the spark electrode outer shape bonded to the printed circuit board, and FIG. 8 is a sectional view showing the bonded state. FIG. 9 is a perspective view showing a spark gap electrode completed according to the present invention. 1...Through hole, 2, 2'...Small hole, 3, 4...Protrusion piece, 5...Groove, 6...Gap, 7...First spark electrode, 8...Second spark electrode, 9 ...Printed circuit board, 10...hole, 11...copper foil, 12...
Solder paste, 13... recess.
Claims (1)
て有すると共に第２電極側部分の電極部分から外
方に突出する第１突片３とこの第２電極側部分の
不要部分から外方に突出する第２突片４とが具備
された形状のスパーク電極外形体をエツチング可
能な金属板からプレスにより取り出すと共に前記
第２電極側部分の前記電極部分と前記不要部分間
に溝５を形成し、折曲された前記第１突片３をプ
リント基板９の挿通孔１０に挿入して前記スパー
ク電極外形体をこのプリント基板９に取り付け、
しかる後前記第２突片４を引張ることにより前記
溝５に沿つて前記第２電極側部分の前記不要部分
を取り除くことを特徴とする混成集積回路用スパ
ーク電極製造方法。 ２ 前記金属板は、燐青銅であることを特徴とす
る特許請求の範囲第１項記載の混成集積回路用ス
パーク電極製造方法。 ３ 前記第１、第２突片は、複数個存することを
特徴とする特許請求の範囲第１項記載の混成集積
回路用スパーク電極製造方法。 ４ 前記エツチングは両面エツチングであること
を特徴とする特許請求の範囲第１項記載の混成集
積回路用スパーク電極製造方法。[Claims] 1. A first projecting piece 3 having a continuous first electrode side portion and a second electrode side portion and protruding outward from the electrode portion of the second electrode side portion, and this second electrode side. A spark electrode outer shape having a second projecting piece 4 protruding outward from an unnecessary part of the part is taken out from an etching metal plate by pressing, and the electrode part of the second electrode side part and the unnecessary part are removed from the etched metal plate. forming a groove 5 between the parts, inserting the bent first projecting piece 3 into the insertion hole 10 of the printed circuit board 9 and attaching the spark electrode external body to the printed circuit board 9;
A method for manufacturing a spark electrode for a hybrid integrated circuit, characterized in that the unnecessary portion of the second electrode side portion is removed along the groove 5 by pulling the second projecting piece 4. 2. The method of manufacturing a spark electrode for a hybrid integrated circuit according to claim 1, wherein the metal plate is made of phosphor bronze. 3. The method of manufacturing a spark electrode for a hybrid integrated circuit according to claim 1, wherein there are a plurality of the first and second projecting pieces. 4. The method of manufacturing a spark electrode for a hybrid integrated circuit according to claim 1, wherein the etching is double-sided etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9804180A JPS5723364A (en) | 1980-07-16 | 1980-07-16 | Spark electrode for hybrid integrated circuit and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9804180A JPS5723364A (en) | 1980-07-16 | 1980-07-16 | Spark electrode for hybrid integrated circuit and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5723364A JPS5723364A (en) | 1982-02-06 |
| JPH0311148B2 true JPH0311148B2 (en) | 1991-02-15 |
Family
ID=14209005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9804180A Granted JPS5723364A (en) | 1980-07-16 | 1980-07-16 | Spark electrode for hybrid integrated circuit and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5723364A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4328730Y1 (en) * | 1965-06-03 | 1968-11-26 |
-
1980
- 1980-07-16 JP JP9804180A patent/JPS5723364A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4328730Y1 (en) * | 1965-06-03 | 1968-11-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5723364A (en) | 1982-02-06 |
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