JPH03110885U - - Google Patents
Info
- Publication number
- JPH03110885U JPH03110885U JP1990019671U JP1967190U JPH03110885U JP H03110885 U JPH03110885 U JP H03110885U JP 1990019671 U JP1990019671 U JP 1990019671U JP 1967190 U JP1967190 U JP 1967190U JP H03110885 U JPH03110885 U JP H03110885U
- Authority
- JP
- Japan
- Prior art keywords
- lsi package
- heat dissipation
- dissipation structure
- cover
- leaf spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990019671U JPH03110885U (US20070167544A1-20070719-C00007.png) | 1990-02-27 | 1990-02-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990019671U JPH03110885U (US20070167544A1-20070719-C00007.png) | 1990-02-27 | 1990-02-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03110885U true JPH03110885U (US20070167544A1-20070719-C00007.png) | 1991-11-13 |
Family
ID=31522776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990019671U Pending JPH03110885U (US20070167544A1-20070719-C00007.png) | 1990-02-27 | 1990-02-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03110885U (US20070167544A1-20070719-C00007.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020087971A (ja) * | 2018-11-15 | 2020-06-04 | 株式会社デンソー | 半導体部品の放熱構造 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62219598A (ja) * | 1986-03-19 | 1987-09-26 | 富士通株式会社 | 素子の放熱方法 |
-
1990
- 1990-02-27 JP JP1990019671U patent/JPH03110885U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62219598A (ja) * | 1986-03-19 | 1987-09-26 | 富士通株式会社 | 素子の放熱方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020087971A (ja) * | 2018-11-15 | 2020-06-04 | 株式会社デンソー | 半導体部品の放熱構造 |