JPH03110848U - - Google Patents
Info
- Publication number
- JPH03110848U JPH03110848U JP2076790U JP2076790U JPH03110848U JP H03110848 U JPH03110848 U JP H03110848U JP 2076790 U JP2076790 U JP 2076790U JP 2076790 U JP2076790 U JP 2076790U JP H03110848 U JPH03110848 U JP H03110848U
- Authority
- JP
- Japan
- Prior art keywords
- diameter
- cavity
- flow path
- resin flow
- opening diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 3
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2076790U JPH03110848U (nl) | 1990-02-28 | 1990-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2076790U JPH03110848U (nl) | 1990-02-28 | 1990-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110848U true JPH03110848U (nl) | 1991-11-13 |
Family
ID=31523853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2076790U Pending JPH03110848U (nl) | 1990-02-28 | 1990-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110848U (nl) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62122136A (ja) * | 1985-11-08 | 1987-06-03 | Hitachi Ltd | レジンモールド半導体の製造方法および装置 |
| JPS6313723A (ja) * | 1986-07-04 | 1988-01-21 | Hitachi Ltd | モ−ルド金型 |
| JPS63162208A (ja) * | 1986-12-26 | 1988-07-05 | Hitachi Ltd | 成形装置 |
| JPS63199619A (ja) * | 1987-02-16 | 1988-08-18 | Hitachi Ltd | 半導体装置のためのトランスファ成形方法 |
-
1990
- 1990-02-28 JP JP2076790U patent/JPH03110848U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62122136A (ja) * | 1985-11-08 | 1987-06-03 | Hitachi Ltd | レジンモールド半導体の製造方法および装置 |
| JPS6313723A (ja) * | 1986-07-04 | 1988-01-21 | Hitachi Ltd | モ−ルド金型 |
| JPS63162208A (ja) * | 1986-12-26 | 1988-07-05 | Hitachi Ltd | 成形装置 |
| JPS63199619A (ja) * | 1987-02-16 | 1988-08-18 | Hitachi Ltd | 半導体装置のためのトランスファ成形方法 |