JPH03110841U - - Google Patents
Info
- Publication number
- JPH03110841U JPH03110841U JP1908190U JP1908190U JPH03110841U JP H03110841 U JPH03110841 U JP H03110841U JP 1908190 U JP1908190 U JP 1908190U JP 1908190 U JP1908190 U JP 1908190U JP H03110841 U JPH03110841 U JP H03110841U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- semiconductor chip
- opposing
- leads
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
- H01L2924/10158—Shape being other than a cuboid at the passive surface
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1908190U JPH03110841U (bs) | 1990-02-27 | 1990-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1908190U JPH03110841U (bs) | 1990-02-27 | 1990-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110841U true JPH03110841U (bs) | 1991-11-13 |
Family
ID=31522218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1908190U Pending JPH03110841U (bs) | 1990-02-27 | 1990-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110841U (bs) |
-
1990
- 1990-02-27 JP JP1908190U patent/JPH03110841U/ja active Pending
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