JPH03109376U - - Google Patents

Info

Publication number

JPH03109376U

JPH03109376U JP1694390U JP1694390U JPH03109376U JP H03109376 U JPH03109376 U JP H03109376U JP 1694390 U JP1694390 U JP 1694390U JP 1694390 U JP1694390 U JP 1694390U JP H03109376 U JPH03109376 U JP H03109376U

Authority

JP

Japan

Prior art keywords

printed wiring

wiring board

copper foil

foil pattern

resin material

Prior art date

1990-02-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
• 239000011889 copper foil Substances 0.000 claims description 11
• 239000011347 resin Substances 0.000 claims description 7
• 229920005989 resin Polymers 0.000 claims description 7
• 239000000463 material Substances 0.000 claims description 5
• 239000002184 metal Substances 0.000 claims description 4
• 229910052751 metal Inorganic materials 0.000 claims description 4
• 239000002023 wood Substances 0.000 claims 1
• 239000000758 substrate Substances 0.000 description 4
• 238000010586 diagram Methods 0.000 description 2

Cited By (3)