JPH03109335U - - Google Patents
Info
- Publication number
- JPH03109335U JPH03109335U JP1990016165U JP1616590U JPH03109335U JP H03109335 U JPH03109335 U JP H03109335U JP 1990016165 U JP1990016165 U JP 1990016165U JP 1616590 U JP1616590 U JP 1616590U JP H03109335 U JPH03109335 U JP H03109335U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- adhesive
- substrate support
- adhesive application
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0113—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016165U JPH03109335U (enExample) | 1990-02-22 | 1990-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990016165U JPH03109335U (enExample) | 1990-02-22 | 1990-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109335U true JPH03109335U (enExample) | 1991-11-11 |
Family
ID=31519450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990016165U Pending JPH03109335U (enExample) | 1990-02-22 | 1990-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109335U (enExample) |
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1990
- 1990-02-22 JP JP1990016165U patent/JPH03109335U/ja active Pending