JPH0310698B2 - - Google Patents

Info

Publication number
JPH0310698B2
JPH0310698B2 JP57038680A JP3868082A JPH0310698B2 JP H0310698 B2 JPH0310698 B2 JP H0310698B2 JP 57038680 A JP57038680 A JP 57038680A JP 3868082 A JP3868082 A JP 3868082A JP H0310698 B2 JPH0310698 B2 JP H0310698B2
Authority
JP
Japan
Prior art keywords
alloy
conductivity
strength
heat resistance
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57038680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58155746A (ja
Inventor
Kozo Yamato
Kiichi Akasaka
Shigeo Shinozaki
Taku Kuroyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP57038680A priority Critical patent/JPS58155746A/ja
Publication of JPS58155746A publication Critical patent/JPS58155746A/ja
Publication of JPH0310698B2 publication Critical patent/JPH0310698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
JP57038680A 1982-03-11 1982-03-11 半導体機器のリ−ド材用銅合金 Granted JPS58155746A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57038680A JPS58155746A (ja) 1982-03-11 1982-03-11 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57038680A JPS58155746A (ja) 1982-03-11 1982-03-11 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS58155746A JPS58155746A (ja) 1983-09-16
JPH0310698B2 true JPH0310698B2 (cs) 1991-02-14

Family

ID=12531989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57038680A Granted JPS58155746A (ja) 1982-03-11 1982-03-11 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS58155746A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2501305B2 (ja) * 1994-06-06 1996-05-29 株式会社東芝 半導体装置
CN113755714B (zh) * 2021-06-22 2022-08-19 上海交通大学 一种适合于铸造工艺的高导热铜合金及其制备方法

Also Published As

Publication number Publication date
JPS58155746A (ja) 1983-09-16

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