JPH03106795U - - Google Patents
Info
- Publication number
- JPH03106795U JPH03106795U JP1427190U JP1427190U JPH03106795U JP H03106795 U JPH03106795 U JP H03106795U JP 1427190 U JP1427190 U JP 1427190U JP 1427190 U JP1427190 U JP 1427190U JP H03106795 U JPH03106795 U JP H03106795U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- frequency amplifier
- high frequency
- forced air
- exhaust fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Amplifiers (AREA)
Description
第１図及び第２図は本考案の一実施例の斜視図
及び分解斜視図、第３図は本実施例の動作状態を
示す側面図、第４図は高周波増幅器１台の従来構
造を示す側面図、第５図及び第６図は通風ダクト
を兼ねたケースを有する従来構造の二例を示す側
面図である。
１……筒状ヒートシンク、２，１１……空洞部
、３，１３……吸気フアン、４，１４……排気フ
アン、５……回路基板、６……半導体、７，１７
……カバー、８……電源盤、１２……増幅器ユニ
ツト、１５，１６……ケース。
Figures 1 and 2 are a perspective view and an exploded perspective view of one embodiment of the present invention, Figure 3 is a side view showing the operating state of this embodiment, and Figure 4 shows the conventional structure of one high frequency amplifier. 5 and 6 are side views showing two examples of conventional structures having cases that also serve as ventilation ducts. DESCRIPTION OF SYMBOLS 1... Cylindrical heat sink, 2, 11... Cavity part, 3, 13... Intake fan, 4, 14... Exhaust fan, 5... Circuit board, 6... Semiconductor, 7, 17
...Cover, 8...Power supply panel, 12...Amplifier unit, 15, 16...Case.
Claims (1)
ヒートシンクと、このヒートシンクの対向する２
面に設けられた凹状部と、この凹状部にそれぞれ
設けられ回路基板・半導体等からなる２台の高周
波増幅器本体と、この高周波増幅器本体を覆つて
高周波シールドするカバーと、前記ヒートシンク
の両端開口部にそれぞれ設けられた吸気フアン及
び排気フアンとを備えることを特徴とする２台を
１体とした強制空冷式高周波増幅器。 ２ 前記ヒートシンクの前記２面と直交する他の
２面にそれぞれ設けられた２組の電源盤を備える
ことを特徴とする請求項１記載の２台を１体とし
た強制空冷式高周波増幅器。[Claims for Utility Model Registration] 1. A cylindrical heat sink having a hollow part with fins inside, and 2 opposing parts of this heat sink.
A concave portion provided on the surface, two high frequency amplifier bodies each made of a circuit board, semiconductor, etc. provided in each of the concave portions, a cover that covers the high frequency amplifier body for high frequency shielding, and openings at both ends of the heat sink. 1. A forced air-cooled high-frequency amplifier that is made up of two units, characterized in that it is equipped with an intake fan and an exhaust fan, each provided with an intake fan and an exhaust fan. 2. The forced air-cooled high-frequency amplifier as set forth in claim 1, further comprising two sets of power supply panels respectively provided on two other surfaces orthogonal to the two surfaces of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1427190U JPH03106795U (en) | 1990-02-16 | 1990-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1427190U JPH03106795U (en) | 1990-02-16 | 1990-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106795U true JPH03106795U (en) | 1991-11-05 |
Family
ID=31517640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1427190U Pending JPH03106795U (en) | 1990-02-16 | 1990-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106795U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140970A (en) * | 1997-07-17 | 1999-02-12 | Yaesu Musen Co Ltd | Cooling method for electronic device |
| JP2015213123A (en) * | 2014-05-02 | 2015-11-26 | 三菱電機株式会社 | High-frequency amplifying device |
-
1990
- 1990-02-16 JP JP1427190U patent/JPH03106795U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140970A (en) * | 1997-07-17 | 1999-02-12 | Yaesu Musen Co Ltd | Cooling method for electronic device |
| JP2015213123A (en) * | 2014-05-02 | 2015-11-26 | 三菱電機株式会社 | High-frequency amplifying device |