JPH03106759U - - Google Patents
Info
- Publication number
- JPH03106759U JPH03106759U JP1990015336U JP1533690U JPH03106759U JP H03106759 U JPH03106759 U JP H03106759U JP 1990015336 U JP1990015336 U JP 1990015336U JP 1533690 U JP1533690 U JP 1533690U JP H03106759 U JPH03106759 U JP H03106759U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- lead pins
- external lead
- external
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990015336U JPH03106759U (enExample) | 1990-02-19 | 1990-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990015336U JPH03106759U (enExample) | 1990-02-19 | 1990-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106759U true JPH03106759U (enExample) | 1991-11-05 |
Family
ID=31518647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990015336U Pending JPH03106759U (enExample) | 1990-02-19 | 1990-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106759U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023047108A (ja) * | 2021-09-24 | 2023-04-05 | ラピステクノロジー株式会社 | 半導体装置、及び半導体モジュール |
-
1990
- 1990-02-19 JP JP1990015336U patent/JPH03106759U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023047108A (ja) * | 2021-09-24 | 2023-04-05 | ラピステクノロジー株式会社 | 半導体装置、及び半導体モジュール |