JPH03106099A - Automatic mounting device for electronic component - Google Patents

Abstract

PURPOSE:To facilitate the set of a heating temperature of a heater block and the change of a setup at the switch of metal boards in type by a method wherein the heating set temperature of a heater block which fuses solder previously applied onto the metal board by heating is controlled basing on data stored according to the types of the metal boards. CONSTITUTION:The heating set temperatures of heater blocks 3A-3C which fuse solder previously applied onto a metal board P by heating are controlled by temperature controllers 7A-7C basing on data stored in a storage means according to the types of the metal boards P. By this setup, when the heating temperatures of the heater blocks 3A-3C are set for each type of the metal boards P, it can be easily carried out without depending on the memory of an operator, so that the mounting failure of electronic components can be prevented from occurring due to a temperature mis-setting by an operator. By this setup, the change of a setup can be easily done at the switch of metal boards in type, so that workability can be improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an automatic electronic component mounting device for mounting electronic components such as resistors, capacitors, or transistors at predetermined positions on a metal substrate. be.

[Prior Art] Conventionally, in this type of automatic mounting device for electronic components, solder is applied in advance to the attachment position of the electronic component on a metal substrate using an appropriate coating device, and then the metal substrate is transferred by a substrate conveying means. A metal substrate is intermittently transported to a heater block for heating, and electronic components are attached to the solder of a metal substrate via a bonder via a bonder. be.

However, with such conventional equipment, when changing the type of metal substrate, especially the size, the operator must remember the heating temperature of the heater block each time. Currently, temperature controllers are set to the heating set temperature for each heating.

[Problem to be solved by the invention] For this reason, when setting the heating temperature of the heater block for each type of metal substrate, the operator relies solely on his or her own memory, which makes it difficult for the operator to make mistakes in setting the heating temperature. This can easily occur, leading to poor installation of electronic components.

Moreover, because the setup changes when switching between metal substrates are cumbersome, the time required for setup changes becomes long, resulting in poor workability. [Object of the Invention] An object of the present invention is to provide an automatic mounting device for electronic components, which allows easy and convenient setting of the heating temperature of the heater block and change of setup when changing the type of metal substrate. Our goal is to provide the following.

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention provides a board transport means for intermittently transporting a metal board to which solder has been applied in advance to the attachment position of an electronic component; A heater block installed on the conveyance path of the substrate conveyance means and having a built-in heater for heating the metal substrate, and an electronic component attached and mounted on the solder of the metal substrate heated and melted by the heater block. In the automatic mounting device for electronic components, the device includes a bonder, a temperature detecting means for detecting the heating temperature of the heater block, a temperature controller for controlling a heater built in the heater block by the temperature detecting means, and a temperature controller for controlling the heater built in the heater block by the temperature detecting means. and storage means for storing the heating set temperature of the heater block to be controlled according to the rice variety of each metal substrate, and the heater of the heater block is controlled by the temperature controller based on the contents of the storage means. The structure is as follows.

[Function] That is, the present invention allows the temperature controller to set the heating set temperature of the heater block that melts and heats the solder applied in advance to the metal substrate, based on the contents of the storage means stored according to the type of each metal substrate. Since the heating temperature of the heater block can be easily set for each type of metal substrate without relying on the operator's own memory, it is also possible to easily set the heating temperature of the heater block for each type of metal substrate. It can also be done easily.

[Example] Hereinafter, the present invention will be described in detail with reference to an illustrated example.

FIG. 1 shows the overall configuration of an automatic mounting device for electronic components according to the present invention, and numeral 1 in the figure is a pedestal.

On this pedestal 1, a comper 2 as a substrate conveying means is installed, and on this conveyor 2, a metal substrate P is coated with solder H at predetermined locations where electronic components are to be attached by a coating device (not shown). The substrates are transported intermittently at a pitch corresponding to the length of the substrate.

On the conveyance path of the conveyor 2, first and second
and third heater blocks 3A, 3B, and 3C are installed adjacent to each other in the conveyance direction, and each of these heater blocks 3A. Heaters 4A, 4B and 4C are installed in 3B and 3C.
is built-in.

The heater blocks 3A, 3B and 3C are heaters 4A
, 4B and 4C heats the metal substrate P that is intermittently conveyed on the conveyor 2, and heats and melts the solder H applied to the metal substrate P. The heating temperature is controlled by the heater block 3.
Temperature detection sensors 5A, 5B and 5C as temperature detection means installed in A, 3B and 3C, respectively, and the heaters 4A, 4B and 4C are controlled according to the outputs of these temperature detection sensors 5A, 5B and 5C. A temperature controller 7A provided on the front panel of the control box 6 to
7B and 7C.

In the figure, 8 is a heater power switch provided on the front panel of the control box 6, 9 is a temperature setting confirmation switch, and 10 is a power indicator lamp.

In addition, 11A and IIB in the figure are first heater blocks installed correspondingly above the first and second heater blocks 3A and 3B.
and a second bonder. Each of these bonders 11
A and IIB are bonding heads 12A and 12B movable in the X-Y-Z directions, and suction nozzles 13A and 1 attached to the bonding heads 12A and 12B.
3B, and the suction nozzles 13A and 13B are used to take out electronic components (not shown) one by one from a supply device (not shown), that is, electronic components (not shown) with pellets mounted on a round plate, which is a heat sink, and transfer them to the bonding head. By controlling the movement of 12A and 12B, it can be positioned and placed on the molten solder H on the metal substrate P heated by the first and second heater blocks 3A and 3B. be.

Furthermore, in the figure, 14A and 14B are a horn head 1 which is movable in the x-y-z directions and is installed above the third heater blower 3C.
5A and 15B and this horn head 15A and 15B
and vibrators 16A and 16B provided at the tip of the
The first and second bonders 11A and IIB apply vibration to electronic components (not shown) positioned and mounted on the molten solder H on the metal substrate P, thereby transferring electrons onto the metal substrate P. Parts are now being installed.

Further, 20 in the figure is a CRT as a screen display device.

FIG. 2 shows a control block that controls the heating set temperatures of the heater blocks 3A, 3B, and 3C, and is connected to the bus line 30.
A CPU 3l that controls the entire device, a ROM 32 that stores a given program related to all operations in the device, a RAM 33 that stores a set temperature, a mechanical interface 34, and a CRT interface 35 are connected to each. .

The I/O interface 34 has a heater driver 40A. 4
Temperature controller 7A controlled via 0B, 40C,
7B, 7C and this temperature controller 7A, 7B, 7C
Temperature detection sensors 5A, 5B, and 5C are connected to control the temperature detection sensors 5A, 5B, and 5C, and an operation section 50 consisting of a keyboard 51 as an input device and a start key 52 for starting the operation is connected to each of them.

That is, when setting the heating set temperature of the heater blocks 3A, 3B, and 3C according to the type of each metal substrate, the CRT 20 has an rpRoGRA as shown in FIG.
The M OPERATIONJ screen is initially displayed.

In this state, the cursor instruction key 51A of the keyboard 5l
using Il. on the screen. Select T-C SET DATAJ and enter rT-C SET DA as shown in Figure 4.
Call up the TAJ screen, that is, the temperature setting screen corresponding to the first type of metal substrate.

Next, on this temperature setting screen, use the cursor instruction key 51A to press the numeric key 51B of the keyboard 51.
By inputting, change the set temperature to the specified value and input it.
By completing the input with the rsETJ key 51G of the keyboard 5l, the set temperature corresponding to the type of the }th metal substrate is set and stored in the RAM 33.

Furthermore, the rT-C SET DATAJ key as shown in FIG.
, that is, the temperature setting screen corresponding to the second metal substrate type, and similarly set the temperature setting corresponding to the second metal substrate type and store it in the RAM 33. After making these settings depending on the number of metal boards, press ``Press the RTNJ key 51E to finish the settings.''

On the other hand, when changing the setup of the metal substrate, use the cursor instruction key 51A of the keyboard 51 on the rPROGRAM OPERATION screen as shown in FIG.
r2 on the screen. Select TYPE C}IENGJ,
By calling the rENTRY TYPEJ screen as shown in Figure 5 and selecting the fourth metal substrate type rSTK 1290J, the type of the fourth metal substrate is selected as shown in Figure 6. The corresponding r
Call the temperature setting screen of T-CSET DATAJ.

In this state, when the start key 52 of the operation unit 50 is operated, the heaters 4A, 3B, and 3C of the heater blocks 3A, 3B, and 3C are activated.
When 4B and 4C are energized and heated to a predetermined set temperature, the conveyor 2 is driven and the metal substrates are intermittently conveyed toward the respective heater blocks 3A, 3B, and 3C.

By the way, the temperature controllers 7A, 7B, and 7C operate heater drivers 40A, 40B, 4. 0
Each of the heaters 4A.G built in the heater blocks 3A, 3B, and 3C is Turn on 4B and 4C. OFF
As a result, the surface temperatures of the heater blocks 3A, 3B, and 3C are controlled to a predetermined set temperature by, for example, a CPU (not shown) dedicated to a temperature controller.

FIG. 7 shows another embodiment according to the present invention, in which the temperature setting by each temperature controller 7A, 7B, and 7C is controlled by a dial 70A. 70B and 70G, and as shown in Figure 6, the temperature setting screen of rT-C SET DATAJ corresponding to the fourth metal substrate type is
When calling RT20, the operator, while looking at this screen, controls each temperature controller 7A. 7B and 7C temperature setting dials 70A, 70B and 70C, for example 2
05°C, 200°C, and 215°C, and then by pressing the temperature setting confirmation switch 9 of the control box 6, the heater driver 40A. It has a configuration in which each heater 4A, 4B, 4C built in the heater blocks 3A, 3B, 3C is controlled via 40B, 40C.

In this case, when the temperature setting confirmation switch 9 is pressed,
Each heater 4A, 4B. The set temperature of 4C is stored in the RAM 33 to enable operation, and if the temperature setting confirmation switch 9 is not pressed,
No driving will take place.

[Effects of the Invention] As is clear from the above description, the present invention can store data based on the contents of the storage means stored in accordance with the frequency of each metal substrate.
Since the heating temperature of the heater block, which melts and heats the solder pre-applied to the metal substrate, is controlled by a temperature controller, it is difficult for the operator to set the heating temperature of the heater block for each type of metal substrate. This can be easily done without relying on one's own memory, and it is possible to reliably prevent electronic component mounting failures caused by human temperature setting errors as in the past.

Furthermore, this allows for easy setup changes when switching metal substrates, thereby improving work efficiency.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing one embodiment of the automatic mounting device for electronic components according to the present invention, FIG. 2 is a control block diagram, and FIGS. 3 to 6 are explanatory diagrams showing the CRT screen display state. , FIG. 7 is a control block diagram showing another embodiment according to the present invention. 2...Substrate transport means (conveyor), 3A. 3B, 3C... Heater block, 4A, 4B,
4C...Heater, 5A, 5B, 5C...Temperature detection means, 6...Control box, 7A, 7B. 7G...Temperature controller, 11A, I
IB...Bonder 14A. 14B...Oscillating device, 20...CRT. 30...Bus line, 31...CPU, 32
・ ・ ・ROM, 33 ・ ・ ・RAM
．． 34...Interface, 35...Interface, 40A, 40B, 40C...Dry nozzle for heater, 5
0...Input device, P...Metal board, H...Solder.

Claims (1)

[Claims] (1) A built-in board transport means for intermittently transporting a metal board to which solder has been applied in advance to the attachment position of electronic components, and a heater installed in the transport path of this board transport means to heat the metal board. In an automatic electronic component mounting device comprising a heater block and a bonder that attaches and attaches electronic components onto the solder of the metal substrate heated and melted by the heater block, the heating temperature of the heater block is detected. a temperature detecting means for controlling a heater built in the heater block, a temperature controller for controlling a heater built in the heater block by the temperature detecting means, and a heating set temperature of the heater block controlled by the temperature controller, which is stored in accordance with the type of each metal substrate. 1. An automatic mounting apparatus for electronic parts, comprising: a storage means for storing electronic components; and the temperature controller is configured to control a heater of a heater block based on the contents of the storage means.