JPH0310548U - - Google Patents

Info

Publication number
JPH0310548U
JPH0310548U JP1989071921U JP7192189U JPH0310548U JP H0310548 U JPH0310548 U JP H0310548U JP 1989071921 U JP1989071921 U JP 1989071921U JP 7192189 U JP7192189 U JP 7192189U JP H0310548 U JPH0310548 U JP H0310548U
Authority
JP
Japan
Prior art keywords
semiconductor chip
lid
semiconductor
cooling
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989071921U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0648868Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989071921U priority Critical patent/JPH0648868Y2/ja
Publication of JPH0310548U publication Critical patent/JPH0310548U/ja
Application granted granted Critical
Publication of JPH0648868Y2 publication Critical patent/JPH0648868Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
JP1989071921U 1989-06-20 1989-06-20 半導体装置の冷却構造 Expired - Lifetime JPH0648868Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989071921U JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989071921U JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPH0310548U true JPH0310548U (fr) 1991-01-31
JPH0648868Y2 JPH0648868Y2 (ja) 1994-12-12

Family

ID=31609388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989071921U Expired - Lifetime JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPH0648868Y2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012091044A1 (fr) * 2010-12-27 2012-07-05 株式会社ザイキューブ Structure de conditionnement pour composant électronique/dispositif à semi-conducteurs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012091044A1 (fr) * 2010-12-27 2012-07-05 株式会社ザイキューブ Structure de conditionnement pour composant électronique/dispositif à semi-conducteurs

Also Published As

Publication number Publication date
JPH0648868Y2 (ja) 1994-12-12

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