JPH03104773U - - Google Patents
Info
- Publication number
- JPH03104773U JPH03104773U JP1271090U JP1271090U JPH03104773U JP H03104773 U JPH03104773 U JP H03104773U JP 1271090 U JP1271090 U JP 1271090U JP 1271090 U JP1271090 U JP 1271090U JP H03104773 U JPH03104773 U JP H03104773U
- Authority
- JP
- Japan
- Prior art keywords
- board
- electrolytic capacitor
- aluminum electrolytic
- vent hole
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1271090U JPH03104773U (zh) | 1990-02-14 | 1990-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1271090U JPH03104773U (zh) | 1990-02-14 | 1990-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104773U true JPH03104773U (zh) | 1991-10-30 |
Family
ID=31516168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1271090U Pending JPH03104773U (zh) | 1990-02-14 | 1990-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104773U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9730334B2 (en) | 2015-04-28 | 2017-08-08 | Fanuc Corporation | Mounting structure of leaded electronic component which reduces occurrence of blow hole |
-
1990
- 1990-02-14 JP JP1271090U patent/JPH03104773U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9730334B2 (en) | 2015-04-28 | 2017-08-08 | Fanuc Corporation | Mounting structure of leaded electronic component which reduces occurrence of blow hole |
| DE102016107597B4 (de) * | 2015-04-28 | 2019-08-14 | Fanuc Corporation | Aufbau zur Anbringung einer mit Leitungen versehenen elektronischen Komponente |
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