JPH03104750U - - Google Patents
Info
- Publication number
- JPH03104750U JPH03104750U JP1382490U JP1382490U JPH03104750U JP H03104750 U JPH03104750 U JP H03104750U JP 1382490 U JP1382490 U JP 1382490U JP 1382490 U JP1382490 U JP 1382490U JP H03104750 U JPH03104750 U JP H03104750U
- Authority
- JP
- Japan
- Prior art keywords
- board
- attached
- fixed
- heat sink
- chassis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1382490U JPH03104750U (un) | 1990-02-15 | 1990-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1382490U JPH03104750U (un) | 1990-02-15 | 1990-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104750U true JPH03104750U (un) | 1991-10-30 |
Family
ID=31517213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1382490U Pending JPH03104750U (un) | 1990-02-15 | 1990-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104750U (un) |
-
1990
- 1990-02-15 JP JP1382490U patent/JPH03104750U/ja active Pending