JPH03104462A - Portable telephone set - Google Patents

Portable telephone set

Info

Publication number
JPH03104462A
JPH03104462A JP24371289A JP24371289A JPH03104462A JP H03104462 A JPH03104462 A JP H03104462A JP 24371289 A JP24371289 A JP 24371289A JP 24371289 A JP24371289 A JP 24371289A JP H03104462 A JPH03104462 A JP H03104462A
Authority
JP
Japan
Prior art keywords
case
printed circuit
circuit board
grip
reflowed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24371289A
Other languages
Japanese (ja)
Other versions
JP2629376B2 (en
Inventor
Keigo Matsuura
圭吾 松浦
Hiroki Kobayashi
小林 敬樹
Kazuhiro Konishi
一弘 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP24371289A priority Critical patent/JP2629376B2/en
Publication of JPH03104462A publication Critical patent/JPH03104462A/en
Application granted granted Critical
Publication of JP2629376B2 publication Critical patent/JP2629376B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the weight and to make the size small by fixing a transmission section, a reception section and a grip to a case comprising case halves and incorporating a printed circuit board in the inside of the case. CONSTITUTION:A speaker 1, a microphone 2 and a printed circuit board 8 are accommodated in the inside of a case 21 comprising two case halves 12A, 12B in a portable telephone set 20, and further, a transmission section 11 and a reception section 12 corresponding to the microphone 2 and the speaker 1 respectively, and a grip 13 offering ease of grip for the user are provided to an outer side face 21b of the case half 21A.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は薄型、軽量、小型な携帯用電話機に関する。[Detailed description of the invention] Industrial applications The present invention relates to a thin, lightweight, and small portable telephone.

従来の技術 近年、電話機業界における携帯用電話機の需要は目覚ま
しく、自動車電話の将来の姿とまで言われている。この
種の携帯用電話機は益々薄型、軽量、小型で操作しやす
いことが望まれている。
BACKGROUND OF THE INVENTION In recent years, the demand for portable telephones in the telephone industry has been remarkable, and they are even said to be the future of automobile telephones. It is increasingly desired that this type of mobile phone be thinner, lighter, smaller, and easier to operate.

従来の携帯用電話機の一例を第3図に基づいて説明する
。第3図において、10は携帯用電話機であり、メイン
プリント基板5a.5b,及びプリント基板5Cをそれ
ぞれダイレクトコネクタ6a,6bにより接続した基板
本体5と、この基板本体5を電磁的にシールドするシー
ルドケース4と、スビーカ1と、マイクロホン2とを本
体ケース3により収容するように構成されている。
An example of a conventional portable telephone will be explained based on FIG. 3. In FIG. 3, reference numeral 10 indicates a mobile phone, and main printed circuit boards 5a. 5b and a printed circuit board 5C connected by direct connectors 6a and 6b, respectively, a shield case 4 that electromagnetically shields the board main body 5, a speaker 1, and a microphone 2 are housed in the main body case 3. It is configured as follows.

前記メインプリント基板5a,5bには半田リフローで
きる電子部品9(たとえば抵抗等)が実装され、プリン
ト基板5bには、半田リフローできない電子部品7(た
とえば発振体等)が実装されている。
Electronic components 9 (eg, resistors) that can be soldered reflowed are mounted on the main printed circuit boards 5a, 5b, and electronic components 7 (eg, oscillators, etc.) that cannot be soldered reflowed are mounted on the printed circuit board 5b.

発明が解決しようとする課題 しかしながら、上記の携帯用電話機10では、メインプ
リント基板5a,5bやシールドケース4等の大きい構
威部品が本体ケース3内に収容されているので、本体ケ
ース3自体の厚みが厚くなったり、メインプリント基板
5a,5bとシールドケース4の重量分重くなるという
問題点がある。また、メインプリント基板5a,5bと
シールドケース4の部品があるために、組付工数がかか
るという問題点があった。
Problems to be Solved by the Invention However, in the mobile phone 10 described above, large components such as the main printed circuit boards 5a and 5b and the shield case 4 are housed within the main body case 3, so that the main body case 3 itself is damaged. There are problems in that the thickness is increased and the weight of the main printed circuit boards 5a, 5b and the shield case 4 is increased. Furthermore, since there are parts such as the main printed circuit boards 5a and 5b and the shield case 4, there is a problem in that it takes many man-hours for assembly.

本発明はこのような従来の問題点を解決するものであり
、メインプリント基板やシールドケース等の大きい構成
部品の点数を減少して組付工数の低減ができる、薄型、
軽量、小型な携帯用電話機を提供するものである。
The present invention solves these conventional problems, and is a thin, thin design that can reduce the number of large components such as the main printed circuit board and shield case, thereby reducing assembly man-hours.
The present invention provides a lightweight and compact mobile phone.

課題を解決するための手段 本発明に係る携帯用電話機は上記の目的を達成するため
に、 半田リフローできない電子部品を組込んだプリント基板
と、金属プリント基板の鋼箔形成面を内側にして紋り込
んで半田リフローできる電子部品を組込んだ2つのケー
ス本体とを備え、前記ケース本体を合わせて戒るケース
に送話部と受話部とグリップとを固定すると共にケース
内に前記プリント基板を組込んで構威してある。
Means for Solving the Problems In order to achieve the above object, the mobile phone according to the present invention includes a printed circuit board incorporating electronic components that cannot be reflowed by soldering, and a metal printed circuit board with the steel foil forming side inside. The transmitting part, the receiving part, and the grip are fixed to the case, and the printed circuit board is placed inside the case. It has been incorporated and configured.

作用 従って、本発明に係る携帯用電話機は、金属プリント基
板の銅箔形成面を内側にして絞り込んでケース本体とし
てあるので、メイン基板及びシールドケース等の大きい
構成部品の点数を省略することができる。
Accordingly, in the mobile phone according to the present invention, the case body is formed by narrowing down the metal printed circuit board with the copper foil forming surface inside, so that the number of large components such as the main board and the shield case can be omitted. .

実施例 以下、本発明を第1図及び第2図に基づいて説明する。Example Hereinafter, the present invention will be explained based on FIGS. 1 and 2.

第1図及び第2図は、本発明に係る携帯用電話機の一実
施例の構戒を示すものである。
FIGS. 1 and 2 show the structure of an embodiment of a portable telephone according to the present invention.

第1図において、20は携帯用電話機であり、この携帯
用電話機20は2つのケース本体2lA.21Bを合わ
せて成るケース21の内側にスビーカ1とマイクロホン
2と、プリント基板8とを収容し、さらに、ケース本体
21Aの外側面2lbには、マイクロホン2、スビーカ
1に対応する送話部11、受話部12と、使用者が握り
ゃすくするためのグリップ13を備えて構成されている
In FIG. 1, 20 is a mobile phone, and this mobile phone 20 includes two case bodies 2lA. The speaker 1, the microphone 2, and the printed circuit board 8 are housed inside the case 21, which is made up of the speaker 21B, and the microphone 2, the transmitter 11 corresponding to the speaker 1, It is comprised of a receiver part 12 and a grip 13 for the user to grip and hold.

第2図に示すケース本体21A.21Bは金属プリント
基板21cの鋼箔パターン21dを備える銅箔形成面2
1a.2lbを内側にして絞り込むことにより一体で成
形される。金属プリント基板21cは、アルミ板の表面
にエポキシで絶縁層を戒し、この絶縁層の表面に銅箔パ
ターン21dが形威されている。この′rルミ板は絶縁
体であり、従来例のシールドケースを成すとともに、ケ
ース21を成している。ケース21を威す一方のケース
本体21Aの鋼箔形成面21aの鋼箔パターン21dに
は、半田リフローできるリードレスの電子部品9が組込
まれ、且つ、スビ一カ1とマイクロホン2とが組込まれ
る。他方のケース本体21Bの鋼箔形成面2lbの銅箔
パターン21dにも同様に半田リフローできるリードレ
スの電子部品9が組込まれる。
Case body 21A shown in FIG. 21B is a copper foil forming surface 2 provided with a steel foil pattern 21d of a metal printed circuit board 21c.
1a. It is molded in one piece by squeezing the 2lb inside. The metal printed circuit board 21c has an insulating layer formed of epoxy on the surface of an aluminum plate, and a copper foil pattern 21d formed on the surface of this insulating layer. This 'rluminium plate is an insulator, and forms the shield case of the conventional example, as well as the case 21. The steel foil pattern 21d on the steel foil forming surface 21a of the case body 21A, which dominates the case 21, incorporates a leadless electronic component 9 that can be reflowed with solder, and also incorporates the slot 1 and the microphone 2. . Similarly, a leadless electronic component 9 that can be reflowed with solder is incorporated into the copper foil pattern 21d on the steel foil forming surface 2lb of the other case body 21B.

プリント基板8は半田リフローできない電子部品7が組
込まれており、このプリント基板8と金属プリント基板
21Cとの導通はケーブル8aで行われる。なお、プリ
ント基板8と金属プリント基板21Cとの導通はケーブ
ル8aでなくても、図示しないフレキシブルプリント基
板やラバーコネクタでも行える。
The printed circuit board 8 incorporates an electronic component 7 that cannot be reflowed with solder, and conduction between the printed circuit board 8 and the metal printed circuit board 21C is performed by a cable 8a. Note that the electrical connection between the printed circuit board 8 and the metal printed circuit board 21C can be achieved not only by the cable 8a but also by a flexible printed circuit board or a rubber connector (not shown).

送話部11は音声をマイクロホン2へ集音するためのも
のであり、ケース本体21の内側面21aに組込まれた
マイクロホン2に対向する外側面2lbに固設されてい
る。受話部12は、スビーカ1から発せられる音声が聞
き手に聞き易いように外部の雑音を遮断するものであり
、内側面21aに組込まれたスビーカ1に対向する外側
面21bに固設されている。なおグリップ13は、送話
、受話を行う際に電話機であるケースを持ち易くするた
めのものであり、送話部l1と、受話部12との中間に
位置する外側面2lbに固設される。
The transmitter 11 is for collecting sound to the microphone 2, and is fixed on the outer surface 2lb facing the microphone 2 incorporated in the inner surface 21a of the case body 21. The receiving part 12 blocks external noise so that the sound emitted from the speaker 1 can be easily heard by the listener, and is fixed on the outer surface 21b facing the speaker 1 incorporated in the inner surface 21a. The grip 13 is for making it easier to hold the phone case when sending and receiving calls, and is fixed to the outer surface 2lb located between the sending part l1 and the receiving part 12. .

次に上記実施例の作用について説明する。上記実施例に
おいて、ケース本体21は金属プリント基板21cの銅
箔形成面21aを内側にして絞り込んで一体で形成され
るので、銅箔パターン21dは切れずに従来例のような
メインプリント基板5a,5bとシールドケース4を本
体ケース21に置換することができ、ケース本体2lの
厚みが薄くなるとともに、重量を軽くして小型にするこ
とができる。
Next, the operation of the above embodiment will be explained. In the above embodiment, the case body 21 is integrally formed with the copper foil forming surface 21a of the metal printed circuit board 21c inside, so that the copper foil pattern 21d is not cut, and the main printed circuit board 5a, as in the conventional example, 5b and the shield case 4 can be replaced with the main body case 21, the thickness of the case main body 2l can be reduced, the weight can be reduced, and the size can be reduced.

発明の効果 以上のように本発明による携帯用電話機では、半田リフ
ローできない電子部品を組込んだプリント基板と、金属
プリント基板の鋼箔形成面を内側にして絞り込んで半田
リフローできる電子部品を組込んだ2つのケース本体と
を備え、前記ケース本体を合わせて成るケースに送話部
と受話部とグリップとを固定すると共にケース内に前記
プリント基板を組込んで構成されているので、ケースの
厚みを薄くすることができるとともに、メイン基板及び
シールドケース等の構戒部品を減らすことができるので
、重量を軽くして小型にすることができる。また、構成
部品が減ることにより、組付工数の低減が可能となる。
Effects of the Invention As described above, the mobile phone according to the present invention incorporates a printed circuit board incorporating electronic components that cannot be reflowed with solder, and an electronic component that can be reflowed with solder by squeezing the metal printed circuit board with the steel foil forming side inside. The case has two case bodies, and the transmitting part, the receiving part, and the grip are fixed to the case made by combining the case bodies, and the printed circuit board is incorporated into the case, so that the thickness of the case is small. The device can be made thinner, and the number of structural components such as the main board and shield case can be reduced, so the weight can be reduced and the device can be made smaller. Furthermore, by reducing the number of component parts, it is possible to reduce the number of assembly steps.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る携帯用電話機の一実施例の構成を
示す側面断面図、第2図は同携帯用電話機のケース本体
を示す斜視図、第3図は従来の携帯用電話機の構成を示
す側面断面図である。 7・・・半田リフローできない電子部品、8・・・プリ
ント基板、9・・・半田リフローできる電子部品、11
・・・送話部、12・・・受話部、13・・・グリップ
、20・・・携帯用電話機、21・・・ケース本体、2
1a・・・鋼箔形威面、21c・・・金属プリント基板
FIG. 1 is a side cross-sectional view showing the configuration of an embodiment of the mobile phone according to the present invention, FIG. 2 is a perspective view showing the case body of the mobile phone, and FIG. 3 is the configuration of a conventional mobile phone. FIG. 7...Electronic components that cannot be soldered reflowed, 8...Printed circuit board, 9...Electronic components that can be soldered reflowed, 11
...Talking unit, 12...Receiving unit, 13...Grip, 20...Mobile phone, 21...Case body, 2
1a... Steel foil type surface, 21c... Metal printed circuit board.

Claims (1)

【特許請求の範囲】[Claims] 半田リフローできない電子部品を組込んだプリント基板
と、金属プリント基板の銅箔形成面を内側にして絞り込
んで半田リフローできる電子部品を組込んだ2つのケー
ス本体とを備え、前記ケース本体を合わせて成るケース
に送話部と受話部とグリップとを固定すると共にケース
内に前記プリント基板を組込んで構成されたことを特徴
とする携帯用電話機。
A printed circuit board that incorporates electronic components that cannot be reflowed with solder, and two case bodies that incorporate electronic components that can be squeezed with the copper foil forming side of the metal printed circuit board inside and can be reflowed with solder, and when the case bodies are combined, 1. A portable telephone, characterized in that a transmitting part, a receiving part, and a grip are fixed to a case, and the printed circuit board is incorporated into the case.
JP24371289A 1989-09-19 1989-09-19 Mobile phone Expired - Fee Related JP2629376B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24371289A JP2629376B2 (en) 1989-09-19 1989-09-19 Mobile phone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24371289A JP2629376B2 (en) 1989-09-19 1989-09-19 Mobile phone

Publications (2)

Publication Number Publication Date
JPH03104462A true JPH03104462A (en) 1991-05-01
JP2629376B2 JP2629376B2 (en) 1997-07-09

Family

ID=17107865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24371289A Expired - Fee Related JP2629376B2 (en) 1989-09-19 1989-09-19 Mobile phone

Country Status (1)

Country Link
JP (1) JP2629376B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030018344A (en) * 2001-08-28 2003-03-06 현대자동차주식회사 Wheel garnish fixing instrument for car
JP2011066065A (en) * 2009-09-15 2011-03-31 Casio Computer Co Ltd Electronic apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030018344A (en) * 2001-08-28 2003-03-06 현대자동차주식회사 Wheel garnish fixing instrument for car
JP2011066065A (en) * 2009-09-15 2011-03-31 Casio Computer Co Ltd Electronic apparatus

Also Published As

Publication number Publication date
JP2629376B2 (en) 1997-07-09

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