JPH03103911U - - Google Patents
Info
- Publication number
- JPH03103911U JPH03103911U JP1115190U JP1115190U JPH03103911U JP H03103911 U JPH03103911 U JP H03103911U JP 1115190 U JP1115190 U JP 1115190U JP 1115190 U JP1115190 U JP 1115190U JP H03103911 U JPH03103911 U JP H03103911U
- Authority
- JP
- Japan
- Prior art keywords
- heat shield
- shield plate
- view
- figures
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
Landscapes
- Building Environments (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1115190U JPH03103911U (me) | 1990-02-07 | 1990-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1115190U JPH03103911U (me) | 1990-02-07 | 1990-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03103911U true JPH03103911U (me) | 1991-10-29 |
Family
ID=31514685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1115190U Pending JPH03103911U (me) | 1990-02-07 | 1990-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03103911U (me) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004263933A (ja) * | 2003-02-28 | 2004-09-24 | Rinnai Corp | 防熱板 |
| JP2004271009A (ja) * | 2003-03-07 | 2004-09-30 | Rinnai Corp | 防熱板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242782B2 (me) * | 1972-02-28 | 1977-10-26 | ||
| JPS6021625B2 (ja) * | 1977-07-13 | 1985-05-28 | 松下電器産業株式会社 | 半導電性高分子組成物 |
-
1990
- 1990-02-07 JP JP1115190U patent/JPH03103911U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242782B2 (me) * | 1972-02-28 | 1977-10-26 | ||
| JPS6021625B2 (ja) * | 1977-07-13 | 1985-05-28 | 松下電器産業株式会社 | 半導電性高分子組成物 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004263933A (ja) * | 2003-02-28 | 2004-09-24 | Rinnai Corp | 防熱板 |
| JP2004271009A (ja) * | 2003-03-07 | 2004-09-30 | Rinnai Corp | 防熱板 |