JPH03102798U - - Google Patents
Info
- Publication number
- JPH03102798U JPH03102798U JP1201090U JP1201090U JPH03102798U JP H03102798 U JPH03102798 U JP H03102798U JP 1201090 U JP1201090 U JP 1201090U JP 1201090 U JP1201090 U JP 1201090U JP H03102798 U JPH03102798 U JP H03102798U
- Authority
- JP
- Japan
- Prior art keywords
- board
- bonding head
- transfer
- head
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1201090U JPH03102798U (hu) | 1990-02-09 | 1990-02-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1201090U JPH03102798U (hu) | 1990-02-09 | 1990-02-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03102798U true JPH03102798U (hu) | 1991-10-25 |
Family
ID=31515511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1201090U Pending JPH03102798U (hu) | 1990-02-09 | 1990-02-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03102798U (hu) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62179795A (ja) * | 1986-02-03 | 1987-08-06 | ティーディーケイ株式会社 | 電子部品の取り付け方法 |
JPH01254000A (ja) * | 1988-04-04 | 1989-10-11 | Hitachi Ltd | プリント板部品挿入位置補正装置 |
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1990
- 1990-02-09 JP JP1201090U patent/JPH03102798U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62179795A (ja) * | 1986-02-03 | 1987-08-06 | ティーディーケイ株式会社 | 電子部品の取り付け方法 |
JPH01254000A (ja) * | 1988-04-04 | 1989-10-11 | Hitachi Ltd | プリント板部品挿入位置補正装置 |