JPH03102745U - - Google Patents
Info
- Publication number
- JPH03102745U JPH03102745U JP1155490U JP1155490U JPH03102745U JP H03102745 U JPH03102745 U JP H03102745U JP 1155490 U JP1155490 U JP 1155490U JP 1155490 U JP1155490 U JP 1155490U JP H03102745 U JPH03102745 U JP H03102745U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor device
- support
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155490U JPH03102745U (ko) | 1990-02-09 | 1990-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1155490U JPH03102745U (ko) | 1990-02-09 | 1990-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102745U true JPH03102745U (ko) | 1991-10-25 |
Family
ID=31515077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1155490U Pending JPH03102745U (ko) | 1990-02-09 | 1990-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102745U (ko) |
-
1990
- 1990-02-09 JP JP1155490U patent/JPH03102745U/ja active Pending