JPH03101558U - - Google Patents
Info
- Publication number
- JPH03101558U JPH03101558U JP922390U JP922390U JPH03101558U JP H03101558 U JPH03101558 U JP H03101558U JP 922390 U JP922390 U JP 922390U JP 922390 U JP922390 U JP 922390U JP H03101558 U JPH03101558 U JP H03101558U
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- transmission hole
- airtight terminal
- element part
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Sensors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図乃至第６図は本考案の実施例を説明する
ためのもので、第１図は第１の実施例の気密端子
の断面図、第２図は第１図の気密端子における金
属外環の要部の拡大平面図、第３図は第１図の気
密端子における金属外環のメツキ処理後の部分拡
大断面図、第４図は第２の実施例の気密端子の断
面図、第５図は第３の実施例の気密端子の部分断
面図、第６図は第４の実施例の気密端子の部分断
面図である。第７図は従来の圧力センサ用気密端
子の断面図、第８図は第７図の気密端子の平面図
である。 ２０……金属外環、２１……圧力伝達穴、２２
……凹凸面、２３，２３′……圧力素子部。
ためのもので、第１図は第１の実施例の気密端子
の断面図、第２図は第１図の気密端子における金
属外環の要部の拡大平面図、第３図は第１図の気
密端子における金属外環のメツキ処理後の部分拡
大断面図、第４図は第２の実施例の気密端子の断
面図、第５図は第３の実施例の気密端子の部分断
面図、第６図は第４の実施例の気密端子の部分断
面図である。第７図は従来の圧力センサ用気密端
子の断面図、第８図は第７図の気密端子の平面図
である。 ２０……金属外環、２１……圧力伝達穴、２２
……凹凸面、２３，２３′……圧力素子部。
Claims (1)
- 内外の圧力差に感応する圧力素子部で塞がれる
圧力伝達穴を有する金属外環の、前記圧力素子部
が固定される圧力伝達穴の周辺部を凹凸面に形成
したことを特徴とする圧力センサ用気密端子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP922390U JPH03101558U (ja) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP922390U JPH03101558U (ja) | 1990-01-31 | 1990-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101558U true JPH03101558U (ja) | 1991-10-23 |
Family
ID=31512827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP922390U Pending JPH03101558U (ja) | 1990-01-31 | 1990-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101558U (ja) |
-
1990
- 1990-01-31 JP JP922390U patent/JPH03101558U/ja active Pending