JPH03101554U - - Google Patents

Info

Publication number
JPH03101554U
JPH03101554U JP922290U JP922290U JPH03101554U JP H03101554 U JPH03101554 U JP H03101554U JP 922290 U JP922290 U JP 922290U JP 922290 U JP922290 U JP 922290U JP H03101554 U JPH03101554 U JP H03101554U
Authority
JP
Japan
Prior art keywords
glass
sealing hole
lead wire
lead
dielectric component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP922290U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP922290U priority Critical patent/JPH03101554U/ja
Publication of JPH03101554U publication Critical patent/JPH03101554U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP922290U 1990-01-31 1990-01-31 Pending JPH03101554U (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP922290U JPH03101554U (es) 1990-01-31 1990-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP922290U JPH03101554U (es) 1990-01-31 1990-01-31

Publications (1)

Publication Number Publication Date
JPH03101554U true JPH03101554U (es) 1991-10-23

Family

ID=31512826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP922290U Pending JPH03101554U (es) 1990-01-31 1990-01-31

Country Status (1)

Country Link
JP (1) JPH03101554U (es)

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