JPH03101541U - - Google Patents
Info
- Publication number
- JPH03101541U JPH03101541U JP918990U JP918990U JPH03101541U JP H03101541 U JPH03101541 U JP H03101541U JP 918990 U JP918990 U JP 918990U JP 918990 U JP918990 U JP 918990U JP H03101541 U JPH03101541 U JP H03101541U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat sink
- hybrid integrated
- thick film
- film substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP918990U JPH03101541U (en18) | 1990-02-01 | 1990-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP918990U JPH03101541U (en18) | 1990-02-01 | 1990-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101541U true JPH03101541U (en18) | 1991-10-23 |
Family
ID=31512794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP918990U Pending JPH03101541U (en18) | 1990-02-01 | 1990-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101541U (en18) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110071088A (zh) * | 2018-01-22 | 2019-07-30 | 松下知识产权经营株式会社 | 半导体装置 |
| JP2019129311A (ja) * | 2018-01-22 | 2019-08-01 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
-
1990
- 1990-02-01 JP JP918990U patent/JPH03101541U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110071088A (zh) * | 2018-01-22 | 2019-07-30 | 松下知识产权经营株式会社 | 半导体装置 |
| JP2019129311A (ja) * | 2018-01-22 | 2019-08-01 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
| CN110071088B (zh) * | 2018-01-22 | 2023-03-17 | 松下知识产权经营株式会社 | 半导体装置 |