JPH03101541U - - Google Patents

Info

Publication number
JPH03101541U
JPH03101541U JP1990009189U JP918990U JPH03101541U JP H03101541 U JPH03101541 U JP H03101541U JP 1990009189 U JP1990009189 U JP 1990009189U JP 918990 U JP918990 U JP 918990U JP H03101541 U JPH03101541 U JP H03101541U
Authority
JP
Japan
Prior art keywords
integrated circuit
heat sink
hybrid integrated
thick film
film substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990009189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990009189U priority Critical patent/JPH03101541U/ja
Publication of JPH03101541U publication Critical patent/JPH03101541U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/5363—

Landscapes

  • Die Bonding (AREA)
JP1990009189U 1990-02-01 1990-02-01 Pending JPH03101541U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009189U JPH03101541U (cg-RX-API-DMAC10.html) 1990-02-01 1990-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009189U JPH03101541U (cg-RX-API-DMAC10.html) 1990-02-01 1990-02-01

Publications (1)

Publication Number Publication Date
JPH03101541U true JPH03101541U (cg-RX-API-DMAC10.html) 1991-10-23

Family

ID=31512794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009189U Pending JPH03101541U (cg-RX-API-DMAC10.html) 1990-02-01 1990-02-01

Country Status (1)

Country Link
JP (1) JPH03101541U (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110071088A (zh) * 2018-01-22 2019-07-30 松下知识产权经营株式会社 半导体装置
JP2019129311A (ja) * 2018-01-22 2019-08-01 パナソニックＩｐマネジメント株式会社 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110071088A (zh) * 2018-01-22 2019-07-30 松下知识产权经营株式会社 半导体装置
JP2019129311A (ja) * 2018-01-22 2019-08-01 パナソニックＩｐマネジメント株式会社 半導体装置
CN110071088B (zh) * 2018-01-22 2023-03-17 松下知识产权经营株式会社 半导体装置

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