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Filing date
Publication date
Application filedfiledCritical
Priority to JP1990009482UpriorityCriticalpatent/JP2525353Y2/ja
Publication of JPH03101529UpublicationCriticalpatent/JPH03101529U/ja
Application grantedgrantedCritical
Publication of JP2525353Y2publicationCriticalpatent/JP2525353Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
H01L2224/732—Location after the connecting process
H01L2224/73251—Location after the connecting process on different surfaces