JPH03101213A - Etching of aluminium foil for electrolytic capacitor - Google Patents
Etching of aluminium foil for electrolytic capacitorInfo
- Publication number
- JPH03101213A JPH03101213A JP9740390A JP9740390A JPH03101213A JP H03101213 A JPH03101213 A JP H03101213A JP 9740390 A JP9740390 A JP 9740390A JP 9740390 A JP9740390 A JP 9740390A JP H03101213 A JPH03101213 A JP H03101213A
- Authority
- JP
- Japan
- Prior art keywords
- ions
- etching
- aluminum foil
- electrolyte
- metal element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 44
- 239000003990 capacitor Substances 0.000 title claims description 7
- 239000005030 aluminium foil Substances 0.000 title 1
- 239000011888 foil Substances 0.000 claims abstract description 34
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 29
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 150000002500 ions Chemical class 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 17
- -1 germanium ions Chemical class 0.000 claims abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 6
- 229910001432 tin ion Inorganic materials 0.000 claims abstract description 5
- 239000008151 electrolyte solution Substances 0.000 claims description 22
- 229910002651 NO3 Inorganic materials 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 239000000460 chlorine Substances 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 24
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 22
- 239000003792 electrolyte Substances 0.000 abstract description 14
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 11
- 229910001431 copper ion Inorganic materials 0.000 abstract description 11
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 14
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 12
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 238000003486 chemical etching Methods 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 238000000866 electrolytic etching Methods 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 235000006408 oxalic acid Nutrition 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- RLJMLMKIBZAXJO-UHFFFAOYSA-N lead nitrate Chemical compound [O-][N+](=O)O[Pb]O[N+]([O-])=O RLJMLMKIBZAXJO-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- IEXRMSFAVATTJX-UHFFFAOYSA-N tetrachlorogermane Chemical compound Cl[Ge](Cl)(Cl)Cl IEXRMSFAVATTJX-UHFFFAOYSA-N 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は電解コンデンサ用アルミニウム箔のエツチン
グ方法に関し、さらに詳しく言えば、中高圧用のアルミ
ニウム電解コンデンサ用電極箔のエツチング方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of etching aluminum foil for electrolytic capacitors, and more specifically, to a method of etching electrode foils for medium-high voltage aluminum electrolytic capacitors.
この種の電極箔には、電極体となるアルミニウム箔を電
気的もしくは化学的にエツチング処理して実効表面積を
拡大したものが使用される。This type of electrode foil uses an aluminum foil serving as an electrode body that has been electrically or chemically etched to enlarge its effective surface area.
拡面率を上げる方法は種々提案されているが、−船釣に
は、アルミニウム箔を硫酸、蓚酸、燐酸などの皮膜を形
成する酸を添加した塩化物水溶液中で電気的にエツチン
グを行い、ピットを多数形成する前段エツチングと、塩
素イオン、硫酸イオン、硝酸イオンの少なくとも１種類
以上を含む水溶液中で電気的もしくは化学的エツチング
を行い、ピットの内壁に沿ってアルミニウムを溶解し、
ビット径を目的の太さにする後段エツチングとを組合せ
て行うようにしている。Various methods have been proposed to increase the area expansion ratio, but for boat fishing, aluminum foil is electrically etched in an aqueous chloride solution containing a film-forming acid such as sulfuric acid, oxalic acid, or phosphoric acid. Pre-etching to form a large number of pits, and electrical or chemical etching in an aqueous solution containing at least one of chlorine ions, sulfate ions, and nitrate ions to dissolve aluminum along the inner walls of the pits,
This is done in combination with post-etching to adjust the bit diameter to the desired thickness.
アルミニウム箔には、不純物として銅がｌＯ〜５０ｐｐ
ｍ含まれている。したがって、工業的に連続エツチング
を行うと、前段、後段のそれぞれの電解液中に銅が一定
量増加していく。Aluminum foil contains 10~50pp of copper as an impurity.
Contains m. Therefore, when continuous etching is carried out industrially, a certain amount of copper increases in each of the electrolytes in the first and second stages.
電解液中に銅イオンが存在すると、アルミニウム箔の表
面溶解が促進される。これは銅イオンの存在量に比例し
、その量が多くなるとピット内径の溶解よりも箔表面の
溶解が起こりやすくなり、大幅な拡面率の低下をもたら
すことになる。The presence of copper ions in the electrolyte promotes surface dissolution of the aluminum foil. This is proportional to the amount of copper ions present, and as the amount increases, dissolution of the foil surface is more likely to occur than dissolution of the inner diameter of the pit, resulting in a significant reduction in area expansion ratio.
このため、従来では定期的に電解液を更新したり、特殊
な処理設備を設置して綱イオンを除去するようにしてい
るが、コストアップの問題が生ずる。また、電解液を更
新する際には、その都度ラインを止める必要があるため
、生産性にも悪影響を及ぼすことになる。For this reason, in the past, the electrolyte solution was periodically renewed or special treatment equipment was installed to remove the ions, but this resulted in the problem of increased costs. Furthermore, since it is necessary to stop the line each time the electrolyte is replaced, productivity is also adversely affected.
〔課題を解決するための手段］ 上記課題を解決するため、この発明においては。[Means to solve the problem] In order to solve the above problems, in this invention.
アルミニウム箔を所定の電解液中において電気的にエツ
チングして多数のビットを形成する第１のエツチング工
程と、同工程で形成されたピットの径を目的とする太さ
にするため、塩素イオン、硫酸イオン、硝酸イオンの少
なくとも１種以上を含む電解液中において電気的もしく
は化学的なエツチングを行う第２のエツチング工程とを
有する電解コンデンサ用アルミニウム箔のエツチング方
法において、第２のエツチング工程に用いる電解液中に
炭素族金属元素イオンを所定量添加することを特徴とし
ている。この場合において、炭素族金属元素イオンは好
ましくはゲルマニウムイオン、スズイオン、鉛イオンか
ら選ばれる。また、その添加量は好適には０．０１〜１
０００ｐｐｅＩの範囲とされる。The first etching step involves electrically etching the aluminum foil in a predetermined electrolytic solution to form a large number of bits, and in order to make the pits formed in the same step have the desired diameter, chlorine ions, Used in the second etching step in an etching method for aluminum foil for electrolytic capacitors, which comprises a second etching step of electrically or chemically etching in an electrolytic solution containing at least one of sulfate ions and nitrate ions. It is characterized by adding a predetermined amount of carbon group metal element ions to the electrolyte. In this case, the carbon group metal element ions are preferably selected from germanium ions, tin ions, and lead ions. Further, the amount added is preferably 0.01 to 1
The range is 000ppeI.
なお、ビットを多数発生させる第１のエツチング工程に
おける電気的エツチングは直流電解エツチングが特に有
効であり、その電解液としては塩酸水溶液に添加物とし
て硫酸、燐酸、蓚酸などを１％以下の濃度で添加するの
が好適である。また、硫酸水溶液に添加物として塩酸を
０．５〜ｌＯ％添加することも好ましい、さらに、この
第１の工７チング工程を２段に分割し、上述の塩酸系電
解エツチングを行ったのち、硫酸系電解エツチングを行
ってもよい。また、第１のエツチング工程の前に、化学
的ソフトエツチングを行ってもよい。Note that DC electrolytic etching is particularly effective for the electrical etching in the first etching step that generates a large number of bits, and the electrolyte used is a hydrochloric acid aqueous solution with additives such as sulfuric acid, phosphoric acid, oxalic acid, etc. at a concentration of 1% or less. It is preferable to add it. It is also preferable to add 0.5 to 10% of hydrochloric acid as an additive to the sulfuric acid aqueous solution. Furthermore, after dividing this first etching step into two stages and performing the above-mentioned hydrochloric acid electrolytic etching, Sulfuric acid-based electrolytic etching may also be performed. Also, chemical soft etching may be performed before the first etching step.
ピット径を太くする第２のエツチング工程には。In the second etching process, which increases the pit diameter.
化学エツチングと電解エツチングの２つの方法があるが
、前者の場合、硝酸水溶液に燐酸または蓚酸を１％以下
の濃度で添加したもの、塩酸水溶液に添加物として硫酸
、燐酸、蓚酸などを１％以下の濃度で添加したもの、ま
たは硫酸水溶液に添加物として塩酸を０．５〜１０％添
加したものを電解液として用いるのが好適である。なお
、この電解液は、電解エツチングにも使用することがで
きる。There are two methods: chemical etching and electrolytic etching.In the case of the former, phosphoric acid or oxalic acid is added to an aqueous nitric acid solution at a concentration of 1% or less, and sulfuric acid, phosphoric acid, oxalic acid, etc. are added to an aqueous hydrochloric acid solution at a concentration of 1% or less. It is preferable to use, as the electrolyte, an aqueous sulfuric acid solution containing 0.5 to 10% of hydrochloric acid as an additive. Note that this electrolytic solution can also be used for electrolytic etching.
第２のエツチング工程の電解液中に炭素族金属元素イオ
ンを添加することにより、銅イオンによるアルミニウム
箔の表面溶解が抑制される。By adding carbon group metal element ions to the electrolytic solution in the second etching step, surface dissolution of the aluminum foil by copper ions is suppressed.
以下、この発明の実施例を従来例と比較しながら説明す
る。Hereinafter, embodiments of the present invention will be described while comparing them with conventional examples.
■使用したアルミニウム箔；厚さ１０４μ論、純度９９
．９９％
■第１のエッチング工程；塩酸５ｗｔ％、硫酸０．０２
ｗｔ％を含む液温８０℃の電解液にアルミニウム箔を浸
漬し、電流密度２００ｍＡ／ａ＃の直流電流にて６０秒
間通電する。■Aluminum foil used; thickness 104μ, purity 99
．． 99% ■First etching step: Hydrochloric acid 5wt%, sulfuric acid 0.02
An aluminum foil is immersed in an electrolytic solution containing 80° C. wt% and energized for 60 seconds with a direct current having a current density of 200 mA/a#.
■第２のエッチング工程；前のコニ程でピットを形成し
たアルミニウム箔を硝酸７ｗｔ％、燐酸０．１ｖｔ％を
含む液温８５℃の電解液に１５分間浸漬して化学エツチ
ングを行う。(2) Second etching step: Chemical etching is performed by immersing the aluminum foil with pits formed in the previous process in an electrolytic solution containing 7 wt% nitric acid and 0.1 vt% phosphoric acid at a temperature of 85° C. for 15 minutes.
まず、上記アルミニウム箔を第１のエツチング工程でエ
ツチングしてその表面にビットを形成し。First, the aluminum foil is etched in a first etching step to form bits on its surface.
次いで第２のエツチング工程の電解液中の銅イオン濃度
をそれぞれ０．２，０．４，０．６．Ｑ、８，１．０ｐ
ｐｒａとしてエツチングを行い、銅イオンの存在しない
ものを含め従来例として６種類のエツチング処理済みの
アルミニウム箔を得た。そして、これらのアルミニウム
箔を硼酸８％水溶液（液温８５℃）中において２００ｖ
の化成電圧で化成し、その化威容量を測定した結果を次
の表１に示す、また、そのグラフを第２図に示す。Next, the copper ion concentrations in the electrolyte in the second etching step were set to 0.2, 0.4, and 0.6, respectively. Q, 8, 1.0p
Six types of etched aluminum foils were obtained as conventional examples, including one without copper ions. Then, these aluminum foils were heated at 200V in an 8% boric acid aqueous solution (liquid temperature: 85°C).
Table 1 shows the results of the chemical conversion and measurement of the chemical conversion capacity, and a graph thereof is shown in FIG.
（表１） 果を次の表２に示す。(Table 1) The results are shown in Table 2 below.
（表２）
〔実施例１〕アルミニウム箔、第１および第２のエツチ
ング条件は同じとして、上記従来例中容最低下の著しい
銅イオン濃度が１．０ρｐａ＋の電解液中に硝酸鉛を用
いて鉛（ｐｂ）イオンをそれぞれ０．０１，０．１゜１
．０．１０．１００． ｔｏｏｏｐｐ履添加してエツチ
ングした箔の鉛イオンの添加量とその２００ｖ化成容最
の測定績〔実施例２〕実施例１の鉛イオンに代え、塩化
第一スズを用いてスズ（Ｓｎ）イオンをそれぞれ０．０
１゜０．１，１．０，１０，１００，１００ＯＰｐ園添
加してエツチングした箔のスズイオンの添加量とその２
００ｖ化威容量の測定結果を次頁の表３に示す。(Table 2) [Example 1] Assuming that the aluminum foil and the first and second etching conditions were the same, lead nitrate was used in an electrolytic solution with a significant copper ion concentration of 1.0 ρpa+, which was the lowest in the conventional example. Lead (pb) ions are 0.01 and 0.1゜1, respectively.
．． 0.10.100. Amount of lead ions added to etched foil with tooopp added and its best measurement results at 200V [Example 2] In place of the lead ions in Example 1, tin (Sn) ions were added using stannous chloride. 0.0 each
1゜Amount of tin ions added to etched foil with 0.1, 1.0, 10, 100, 100 OPp added and part 2
The measurement results of the 00v conversion capacity are shown in Table 3 on the next page.
（表３）
（表４）
〔実施例３〕実施例１の鉛イオンに代え、塩化ゲルマニ
ウムを用いてゲルマニウム（Ｇｅ）イオンをそれぞれ０
．０１．０．１．１．０．１０．１００．１０００ｐｐ
醜添加してエツチングした箔のゲルマニウムイオンの添
加量とその２００ｖ化威容量の測定結果を次頁の表４に
示す。(Table 3) (Table 4) [Example 3] Germanium chloride was used in place of the lead ion in Example 1, and germanium (Ge) ions were
．． 01.0.1.1.0.10.100.1000pp
Table 4 on the next page shows the amount of germanium ions added and the 200V conversion capacity of the etched foil.
また、上記実施例１〜３の炭素族金属元素イオン添加量
対箔の２００ｖ化成容量の特性グラフを第１図に示す、
上記の表２〜４および第１図のグラフから明らかなよう
に、Ｐｂ、Ｓｎ、Ｇｏのいずれもその有効添加量は約ｏ
、ｏｉ〜１１０００ｐｐであるが、より好ましい添加量
は０．１〜１１００ｐｐである。Further, a characteristic graph of the amount of carbon group metal element ion added versus the 200V conversion capacity of the foil in Examples 1 to 3 is shown in FIG.
As is clear from the above Tables 2 to 4 and the graph in Figure 1, the effective amounts of Pb, Sn, and Go added are approximately o.
, oi to 11,000 pp, but a more preferable addition amount is 0.1 to 1,100 pp.
〔実施例４〕まず第１のエツチング工程において、上記
と同じアルミニウム箔を塩酸７％、燐酸０．０１％を含
む液温８０℃の電解液に浸漬し、電流密度３００ｍＡ／
ｃｄの直流通電を行った０次に、第２のエツチング工程
として、塩酸７％、硫酸３０％を含む液温８０℃の電解
液中で電流密度２５０■Ａ／１ｆｆｌの直流通電を行っ
た。さらに、第３のエツチング工程として、塩酸７％、
燐酸０．０１％を含む液温８０℃の電解液に第２のエツ
チング工程を経たアルミニウム箔を浸漬し、化学エツチ
ングを行った。その際、電解液中の綱イオン濃度が０．
５ｐｐｍである電解液に硝酸鉛水溶液をその電解液中の
含量が５ ｐｐｍとなるように添加した。[Example 4] In the first etching step, the same aluminum foil as above was immersed in an electrolytic solution containing 7% hydrochloric acid and 0.01% phosphoric acid at a temperature of 80°C, and a current density of 300 mA/
Then, as a second etching step, direct current was applied at a current density of 250 A/1 ffl in an electrolytic solution containing 7% hydrochloric acid and 30% sulfuric acid at a temperature of 80°C. Furthermore, as a third etching step, 7% hydrochloric acid,
The aluminum foil that had undergone the second etching step was immersed in an electrolytic solution containing 0.01% phosphoric acid at a temperature of 80° C. to perform chemical etching. At that time, the ion concentration in the electrolyte is 0.
An aqueous lead nitrate solution was added to the electrolytic solution at a concentration of 5 ppm so that the content in the electrolytic solution was 5 ppm.
このようにして得たエツチドアルミニウム箔を２００ｖ
にて化成し、その静電容量を測定したところ、 ２．０
４μＦ／ｃｄであった。ちなみに、鉛無添加時の静電容
量は、１．３μＦｅｄであった。The etched aluminum foil obtained in this way was
When the capacitance was measured, it was 2.0.
It was 4 μF/cd. Incidentally, the capacitance when no lead was added was 1.3 μFed.
〔実施例５〕まず第１のエツチング工程において。[Example 5] First, in the first etching step.
上記と同じアルミニウム箔を硫酸３０％、塩酸１．５％
を含む液温７０℃の電解液に浸漬し、電流密度２５０ｍ
＾／−の直流通電を行った１次に、第２のエツチング工
程として、硫酸３０％、塩酸２％を含む液温８５℃の電
解液中にアルミニウム箔を浸漬し、化学エツチングを行
った。その際、電解液中の綱イオン濃度が０．５ｐｐｗ
ｅである電解液に硝酸鉛水溶液をその電解液中の含量が
ａＰＰ■となるように添加した。The same aluminum foil as above was mixed with 30% sulfuric acid and 1.5% hydrochloric acid.
Immersed in an electrolytic solution containing liquid temperature 70℃, current density 250m
After applying a direct current of ^/-, as a second etching step, the aluminum foil was immersed in an electrolytic solution containing 30% sulfuric acid and 2% hydrochloric acid at a temperature of 85 DEG C. to perform chemical etching. At that time, the ion concentration in the electrolyte was 0.5 ppw.
An aqueous lead nitrate solution was added to the electrolytic solution (e) so that the content of the electrolytic solution was aPP■.
このようにして得たエツチドアルミニウム箔を２００ｖ
にて化成し、その静電容量を測定したところ、 ２．６
２μＦ／ａ＃であった。これに対して、鉛無添゛加時の
静電容量は、１．４μＦ／ａＪであった。The etched aluminum foil obtained in this way was
When the capacitance was measured, it was found to be 2.6.
It was 2μF/a#. On the other hand, the capacitance when no lead was added was 1.4 μF/aJ.
以上説明したように、この発明によれば、塩素イオン、
硫酸イオン、硝酸イオンの少なくとも１種以上を含み、
ビット径を目的の太さにする最終段のエツチング工程に
用いられる電解液中に炭素族金属元素イオン、とりわけ
船イオン、スズイオン、ゲルマニウムイオンを０．０１
〜１００ＯＰＰ■添加することにより、銅イオンによる
アルミニウム箔の表面溶解が抑制される。したがって、
電解液の定期的な更新や、銅イオンを除去する処理設備
などが不要となる。As explained above, according to the present invention, chloride ions,
Contains at least one of sulfate ions and nitrate ions,
Carbon group metal element ions, especially ship ions, tin ions, and germanium ions, are added at 0.01% in the electrolytic solution used in the final etching process to make the bit diameter the desired thickness.
By adding ~100 OPP■, surface dissolution of the aluminum foil by copper ions is suppressed. therefore,
There is no need to regularly update the electrolyte or to require treatment equipment to remove copper ions.
第１図はこの発明による炭素族金属元素イオン添加量対
化成容量の関係を示したグラフ、第２図は電解液中の銅
イオン対化成容量の関係を示したグラフである。FIG. 1 is a graph showing the relationship between the amount of carbon group metal element ions added and the conversion capacity according to the present invention, and FIG. 2 is a graph showing the relationship between the copper ions in the electrolytic solution and the conversion capacity.
Claims (3)
的にエッチングして多数のピットを形成する第１のエッ
チング工程と、同工程で形成されたピットの径を目的と
する太さにするため、塩素イオン、硫酸イオン、硝酸イ
オンの少なくとも１種以上を含む電解液中において電気
的もしくは化学的なエッチングを行う第２のエッチング
工程とを有する電解コンデンサ用アルミニウム箔のエッ
チング方法において、 上記第２のエッチング工程に用いる電解液中に炭素族金
属元素イオンを所定量添加することを特徴とする電解コ
ンデンサ用アルミニウム箔のエッチング方法。(1) A first etching step in which aluminum foil is electrically etched in a predetermined electrolytic solution to form a large number of pits, and in order to make the diameter of the pits formed in the same step the desired thickness, and a second etching step of electrically or chemically etching in an electrolytic solution containing at least one of chlorine ions, sulfate ions, and nitrate ions, the method comprising: A method for etching aluminum foil for an electrolytic capacitor, the method comprising adding a predetermined amount of carbon group metal element ions to an electrolytic solution used in the etching process.
ン、スズイオン、鉛イオンから選ばれる請求項１に記載
の電解コンデンサ用アルミニウム箔のエッチング方法。(2) The method of etching aluminum foil for an electrolytic capacitor according to claim 1, wherein the carbon group metal element ions are selected from germanium ions, tin ions, and lead ions.
〜１０００ｐｐｍである請求項１または２に記載の電解
コンデンサ用アルミニウム箔のエッチング方法。(3) The amount of the above carbon group metal element ion added is 0.01
The method for etching aluminum foil for electrolytic capacitors according to claim 1 or 2, wherein the etching amount is 1000 ppm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1-140900 | 1989-06-02 | ||
| JP14090089 | 1989-06-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03101213A true JPH03101213A (en) | 1991-04-26 |
| JPH0775215B2 JPH0775215B2 (en) | 1995-08-09 |
Family
ID=15279410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2097403A Expired - Lifetime JPH0775215B2 (en) | 1989-06-02 | 1990-04-12 | Method for etching aluminum foil for electrolytic capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0775215B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5439565A (en) * | 1993-03-19 | 1995-08-08 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing electrode foil for aluminium electrolytic capacitors |
| CN103451713A (en) * | 2013-08-28 | 2013-12-18 | 广西贺州市桂东电子科技有限责任公司 | Corrosion pretreatment method for anode oxidation deposited zinc/tin crystal nucleus of middle-high voltage electronic aluminum foil |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62216211A (en) * | 1986-03-17 | 1987-09-22 | 昭和電工株式会社 | Solid electrolytic capacitor |
-
1990
- 1990-04-12 JP JP2097403A patent/JPH0775215B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62216211A (en) * | 1986-03-17 | 1987-09-22 | 昭和電工株式会社 | Solid electrolytic capacitor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5439565A (en) * | 1993-03-19 | 1995-08-08 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing electrode foil for aluminium electrolytic capacitors |
| CN103451713A (en) * | 2013-08-28 | 2013-12-18 | 广西贺州市桂东电子科技有限责任公司 | Corrosion pretreatment method for anode oxidation deposited zinc/tin crystal nucleus of middle-high voltage electronic aluminum foil |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0775215B2 (en) | 1995-08-09 |
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