JPH03101015U - - Google Patents
Info
- Publication number
- JPH03101015U JPH03101015U JP886090U JP886090U JPH03101015U JP H03101015 U JPH03101015 U JP H03101015U JP 886090 U JP886090 U JP 886090U JP 886090 U JP886090 U JP 886090U JP H03101015 U JPH03101015 U JP H03101015U
- Authority
- JP
- Japan
- Prior art keywords
- ground layer
- connection
- transmission lines
- transmission line
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 6
Description
第1図は第1の考案の実施例の伝送線路接続構
造を示す伝送線路の構造図、第2図は従来の伝送
線路接続構造を示す構造図、第3図は従来のマイ
クロストリツプライン型の伝送線路を示す構成図
、第4図は従来のコプレーナ型の伝送線路の構成
図、第5図は第1図のA−A線断面図、第6図a
,bは第1図における単一の伝送線路の伝送線路
の要部構成図、第7図は第6図bの裏面からみた
平面図、第8図は第1図のB−B線断面図、第9
図は第2の考案の実施例の伝送線路接続構造を示
す伝送線路の構造図、第10図は第9図のC−C
線断面図、第11図は第9図における単一の伝送
線路の要部構成図、第12図は第9図のD−D線
断面図である。
伝送線路……21,22,23,41,42,
43、接続領域……22a,23a,42a,4
3a、誘電体基板……24,28,44,48、
導体……25,29,45、グランド層……26
,30,46、誘電体層……27,31,47,
51、突起領域……30a。
Fig. 1 is a structural diagram of a transmission line showing a transmission line connection structure according to an embodiment of the first invention, Fig. 2 is a structural diagram showing a conventional transmission line connection structure, and Fig. 3 is a structural diagram of a conventional transmission line connection structure. FIG. 4 is a configuration diagram of a conventional coplanar transmission line, FIG. 5 is a cross-sectional view taken along line A-A in FIG. 1, and FIG. 6 a
, b is a configuration diagram of the main parts of the single transmission line in FIG. 1, FIG. 7 is a plan view seen from the back side of FIG. 6 b, and FIG. , No. 9
The figure is a structural diagram of a transmission line showing the transmission line connection structure of the embodiment of the second invention, and Figure 10 is C-C in Figure 9.
11 is a line sectional view of the single transmission line in FIG. 9, and FIG. 12 is a sectional view taken along the line DD in FIG. 9. Transmission line...21, 22, 23, 41, 42,
43, connection area...22a, 23a, 42a, 4
3a, dielectric substrate...24, 28, 44, 48,
Conductor...25, 29, 45, ground layer...26
, 30, 46, dielectric layer...27, 31, 47,
51, protrusion area...30a.
Claims (1)
成されると共に、該誘電体基板の下面にグランド
層が形成された第1及び第2の伝送線路を用い、 前記第1及び第2の伝送線路の端部に位置する
第1及び第2の接続領域における各導体を面接続
する伝送線路接続構造において、 前記第1及び第2の接続領域以外の前記導体を
前記誘電体基板の上面に設けた誘電体層で被覆し
、 前記第1の接続領域において前記グランド層は
突起状に形成し、 前記第1及び第2の接続領域を円筒状に湾曲さ
せて、前記突起状のグランド層と、前記第2の接
続領域のグランド層とを接続することを特徴とす
る伝送線路接続構造。 2 ストライプ状の導体及びストライプ状のグラ
ンド層が誘電体基板の上面に設けられた第1及び
第2の伝送線路を用い、 前記第1及び第2の伝送線路の端部に位置する
第1及び第2の接続領域における各導体を面接続
する伝送線路接続構造において、 前記第1及び第2の接続領域以外の前記導体と
前記グランド層を前記誘電体基板の上面に設けた
誘電体層で被覆し、 前記第1及び第2の接続領域を円筒状に湾曲さ
せ、前記第1及び第2の伝送線路の前記誘電体基
板の下面を互いに対向させて接合することを特徴
とする伝送線路接続構造。[Claims for Utility Model Registration] 1. Using first and second transmission lines in which a striped conductor is formed on the upper surface of a dielectric substrate and a ground layer is formed on the lower surface of the dielectric substrate, In a transmission line connection structure in which conductors in first and second connection areas located at ends of first and second transmission lines are surface-connected, the conductors other than the first and second connection areas are connected to the a dielectric layer provided on an upper surface of a dielectric substrate, the ground layer is formed in a protrusion shape in the first connection region, the first and second connection regions are curved into a cylindrical shape, and the ground layer is formed in a protrusion shape in the first connection region; A transmission line connection structure, characterized in that a protruding ground layer and a ground layer of the second connection area are connected. 2. Using first and second transmission lines in which a striped conductor and a striped ground layer are provided on the upper surface of a dielectric substrate, the first and second transmission lines are located at the ends of the first and second transmission lines. In a transmission line connection structure in which each conductor in a second connection area is surface-connected, the conductors other than the first and second connection areas and the ground layer are covered with a dielectric layer provided on the upper surface of the dielectric substrate. A transmission line connection structure characterized in that the first and second connection regions are curved into a cylindrical shape, and the lower surfaces of the dielectric substrates of the first and second transmission lines are joined so as to face each other. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP886090U JPH03101015U (en) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP886090U JPH03101015U (en) | 1990-01-31 | 1990-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03101015U true JPH03101015U (en) | 1991-10-22 |
Family
ID=31512476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP886090U Pending JPH03101015U (en) | 1990-01-31 | 1990-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03101015U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006232344A (en) * | 2005-02-25 | 2006-09-07 | Kotobuki Seihan Printing Co Ltd | Giveaway holder for can container |
WO2014002592A1 (en) * | 2012-06-29 | 2014-01-03 | 株式会社 村田製作所 | Structure for affixing cable to wiring board, cable, and method for manufacturing cable |
-
1990
- 1990-01-31 JP JP886090U patent/JPH03101015U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006232344A (en) * | 2005-02-25 | 2006-09-07 | Kotobuki Seihan Printing Co Ltd | Giveaway holder for can container |
WO2014002592A1 (en) * | 2012-06-29 | 2014-01-03 | 株式会社 村田製作所 | Structure for affixing cable to wiring board, cable, and method for manufacturing cable |
JP5900766B2 (en) * | 2012-06-29 | 2016-04-06 | 株式会社村田製作所 | Fixing structure or fixing method of cable to circuit board |
JPWO2014002592A1 (en) * | 2012-06-29 | 2016-05-30 | 株式会社村田製作所 | Fixing structure or fixing method of cable to circuit board |
US9647312B2 (en) | 2012-06-29 | 2017-05-09 | Murata Manufacturing Co., Ltd. | Fixing structure of cable to wiring substrate, and cable, and manufacturing method of cable |