JPH03101015U - - Google Patents

Info

Publication number
JPH03101015U
JPH03101015U JP886090U JP886090U JPH03101015U JP H03101015 U JPH03101015 U JP H03101015U JP 886090 U JP886090 U JP 886090U JP 886090 U JP886090 U JP 886090U JP H03101015 U JPH03101015 U JP H03101015U
Authority
JP
Japan
Prior art keywords
ground layer
connection
transmission lines
transmission line
dielectric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP886090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP886090U priority Critical patent/JPH03101015U/ja
Publication of JPH03101015U publication Critical patent/JPH03101015U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は第1の考案の実施例の伝送線路接続構
造を示す伝送線路の構造図、第2図は従来の伝送
線路接続構造を示す構造図、第3図は従来のマイ
クロストリツプライン型の伝送線路を示す構成図
、第4図は従来のコプレーナ型の伝送線路の構成
図、第5図は第1図のA−A線断面図、第6図a
,bは第1図における単一の伝送線路の伝送線路
の要部構成図、第7図は第6図bの裏面からみた
平面図、第8図は第1図のB−B線断面図、第9
図は第2の考案の実施例の伝送線路接続構造を示
す伝送線路の構造図、第10図は第9図のC−C
線断面図、第11図は第9図における単一の伝送
線路の要部構成図、第12図は第9図のD−D線
断面図である。 伝送線路……21,22,23,41,42,
43、接続領域……22a,23a,42a,4
3a、誘電体基板……24,28,44,48、
導体……25,29,45、グランド層……26
,30,46、誘電体層……27,31,47,
51、突起領域……30a。
Fig. 1 is a structural diagram of a transmission line showing a transmission line connection structure according to an embodiment of the first invention, Fig. 2 is a structural diagram showing a conventional transmission line connection structure, and Fig. 3 is a structural diagram of a conventional transmission line connection structure. FIG. 4 is a configuration diagram of a conventional coplanar transmission line, FIG. 5 is a cross-sectional view taken along line A-A in FIG. 1, and FIG. 6 a
, b is a configuration diagram of the main parts of the single transmission line in FIG. 1, FIG. 7 is a plan view seen from the back side of FIG. 6 b, and FIG. , No. 9
The figure is a structural diagram of a transmission line showing the transmission line connection structure of the embodiment of the second invention, and Figure 10 is C-C in Figure 9.
11 is a line sectional view of the single transmission line in FIG. 9, and FIG. 12 is a sectional view taken along the line DD in FIG. 9. Transmission line...21, 22, 23, 41, 42,
43, connection area...22a, 23a, 42a, 4
3a, dielectric substrate...24, 28, 44, 48,
Conductor...25, 29, 45, ground layer...26
, 30, 46, dielectric layer...27, 31, 47,
51, protrusion area...30a.

Claims (1)

【実用新案登録請求の範囲】 1 誘電体基板の上面にストライプ状の導体が形
成されると共に、該誘電体基板の下面にグランド
層が形成された第1及び第2の伝送線路を用い、 前記第1及び第2の伝送線路の端部に位置する
第1及び第2の接続領域における各導体を面接続
する伝送線路接続構造において、 前記第1及び第2の接続領域以外の前記導体を
前記誘電体基板の上面に設けた誘電体層で被覆し
、 前記第1の接続領域において前記グランド層は
突起状に形成し、 前記第1及び第2の接続領域を円筒状に湾曲さ
せて、前記突起状のグランド層と、前記第2の接
続領域のグランド層とを接続することを特徴とす
る伝送線路接続構造。 2 ストライプ状の導体及びストライプ状のグラ
ンド層が誘電体基板の上面に設けられた第1及び
第2の伝送線路を用い、 前記第1及び第2の伝送線路の端部に位置する
第1及び第2の接続領域における各導体を面接続
する伝送線路接続構造において、 前記第1及び第2の接続領域以外の前記導体と
前記グランド層を前記誘電体基板の上面に設けた
誘電体層で被覆し、 前記第1及び第2の接続領域を円筒状に湾曲さ
せ、前記第1及び第2の伝送線路の前記誘電体基
板の下面を互いに対向させて接合することを特徴
とする伝送線路接続構造。
[Claims for Utility Model Registration] 1. Using first and second transmission lines in which a striped conductor is formed on the upper surface of a dielectric substrate and a ground layer is formed on the lower surface of the dielectric substrate, In a transmission line connection structure in which conductors in first and second connection areas located at ends of first and second transmission lines are surface-connected, the conductors other than the first and second connection areas are connected to the a dielectric layer provided on an upper surface of a dielectric substrate, the ground layer is formed in a protrusion shape in the first connection region, the first and second connection regions are curved into a cylindrical shape, and the ground layer is formed in a protrusion shape in the first connection region; A transmission line connection structure, characterized in that a protruding ground layer and a ground layer of the second connection area are connected. 2. Using first and second transmission lines in which a striped conductor and a striped ground layer are provided on the upper surface of a dielectric substrate, the first and second transmission lines are located at the ends of the first and second transmission lines. In a transmission line connection structure in which each conductor in a second connection area is surface-connected, the conductors other than the first and second connection areas and the ground layer are covered with a dielectric layer provided on the upper surface of the dielectric substrate. A transmission line connection structure characterized in that the first and second connection regions are curved into a cylindrical shape, and the lower surfaces of the dielectric substrates of the first and second transmission lines are joined so as to face each other. .
JP886090U 1990-01-31 1990-01-31 Pending JPH03101015U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP886090U JPH03101015U (en) 1990-01-31 1990-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP886090U JPH03101015U (en) 1990-01-31 1990-01-31

Publications (1)

Publication Number Publication Date
JPH03101015U true JPH03101015U (en) 1991-10-22

Family

ID=31512476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP886090U Pending JPH03101015U (en) 1990-01-31 1990-01-31

Country Status (1)

Country Link
JP (1) JPH03101015U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006232344A (en) * 2005-02-25 2006-09-07 Kotobuki Seihan Printing Co Ltd Giveaway holder for can container
WO2014002592A1 (en) * 2012-06-29 2014-01-03 株式会社 村田製作所 Structure for affixing cable to wiring board, cable, and method for manufacturing cable

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006232344A (en) * 2005-02-25 2006-09-07 Kotobuki Seihan Printing Co Ltd Giveaway holder for can container
WO2014002592A1 (en) * 2012-06-29 2014-01-03 株式会社 村田製作所 Structure for affixing cable to wiring board, cable, and method for manufacturing cable
JP5900766B2 (en) * 2012-06-29 2016-04-06 株式会社村田製作所 Fixing structure or fixing method of cable to circuit board
JPWO2014002592A1 (en) * 2012-06-29 2016-05-30 株式会社村田製作所 Fixing structure or fixing method of cable to circuit board
US9647312B2 (en) 2012-06-29 2017-05-09 Murata Manufacturing Co., Ltd. Fixing structure of cable to wiring substrate, and cable, and manufacturing method of cable

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