JPH0298678U - - Google Patents

Info

Publication number

JPH0298678U

JPH0298678U JP678489U JP678489U JPH0298678U JP H0298678 U JPH0298678 U JP H0298678U JP 678489 U JP678489 U JP 678489U JP 678489 U JP678489 U JP 678489U JP H0298678 U JPH0298678 U JP H0298678U

Authority

JP

Japan

Prior art keywords

printed wiring

wiring board

closed

electronic component

utility

Prior art date

1989-01-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 238000010586 diagram Methods 0.000 description 2
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000007747 plating Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1