JPH0298665U - - Google Patents
Info
- Publication number
- JPH0298665U JPH0298665U JP652389U JP652389U JPH0298665U JP H0298665 U JPH0298665 U JP H0298665U JP 652389 U JP652389 U JP 652389U JP 652389 U JP652389 U JP 652389U JP H0298665 U JPH0298665 U JP H0298665U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting element
- lead portion
- reflective surface
- transmitting material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989006523U JP2567157Y2 (ja) | 1989-01-25 | 1989-01-25 | 発光ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989006523U JP2567157Y2 (ja) | 1989-01-25 | 1989-01-25 | 発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0298665U true JPH0298665U (bs) | 1990-08-06 |
JP2567157Y2 JP2567157Y2 (ja) | 1998-03-30 |
Family
ID=31210776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989006523U Expired - Fee Related JP2567157Y2 (ja) | 1989-01-25 | 1989-01-25 | 発光ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2567157Y2 (bs) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118681A (en) * | 1979-03-07 | 1980-09-11 | Marantz Japan Inc | Light emitting diode with reflecting mirror |
JPS5824180A (ja) * | 1981-08-06 | 1983-02-14 | キムラ電機株式会社 | 平板状表示装置の製造法 |
JPS62212U (bs) * | 1985-06-13 | 1987-01-06 | ||
JPS6343465U (bs) * | 1986-09-03 | 1988-03-23 |
-
1989
- 1989-01-25 JP JP1989006523U patent/JP2567157Y2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118681A (en) * | 1979-03-07 | 1980-09-11 | Marantz Japan Inc | Light emitting diode with reflecting mirror |
JPS5824180A (ja) * | 1981-08-06 | 1983-02-14 | キムラ電機株式会社 | 平板状表示装置の製造法 |
JPS62212U (bs) * | 1985-06-13 | 1987-01-06 | ||
JPS6343465U (bs) * | 1986-09-03 | 1988-03-23 |
Also Published As
Publication number | Publication date |
---|---|
JP2567157Y2 (ja) | 1998-03-30 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |