JPH0298655U - - Google Patents

Info

Publication number
JPH0298655U
JPH0298655U JP1989008059U JP805989U JPH0298655U JP H0298655 U JPH0298655 U JP H0298655U JP 1989008059 U JP1989008059 U JP 1989008059U JP 805989 U JP805989 U JP 805989U JP H0298655 U JPH0298655 U JP H0298655U
Authority
JP
Japan
Prior art keywords
power supply
semiconductor package
supply lead
semiconductor
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989008059U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989008059U priority Critical patent/JPH0298655U/ja
Priority to US07/468,612 priority patent/US4989066A/en
Priority to KR2019900000855U priority patent/KR930001754Y1/ko
Publication of JPH0298655U publication Critical patent/JPH0298655U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W70/421—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H10W72/5449—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1989008059U 1989-01-26 1989-01-26 Pending JPH0298655U (cg-RX-API-DMAC10.html)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1989008059U JPH0298655U (cg-RX-API-DMAC10.html) 1989-01-26 1989-01-26
US07/468,612 US4989066A (en) 1989-01-26 1990-01-23 Semiconductor package
KR2019900000855U KR930001754Y1 (ko) 1989-01-26 1990-01-25 반도체 패키지(package)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989008059U JPH0298655U (cg-RX-API-DMAC10.html) 1989-01-26 1989-01-26

Publications (1)

Publication Number Publication Date
JPH0298655U true JPH0298655U (cg-RX-API-DMAC10.html) 1990-08-06

Family

ID=11682765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989008059U Pending JPH0298655U (cg-RX-API-DMAC10.html) 1989-01-26 1989-01-26

Country Status (3)

Country Link
US (1) US4989066A (cg-RX-API-DMAC10.html)
JP (1) JPH0298655U (cg-RX-API-DMAC10.html)
KR (1) KR930001754Y1 (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0371546U (cg-RX-API-DMAC10.html) * 1989-11-15 1991-07-19
US5214845A (en) * 1992-05-11 1993-06-01 Micron Technology, Inc. Method for producing high speed integrated circuits
US5939781A (en) * 1996-09-26 1999-08-17 Texas Instruments Incorporated Thermally enhanced integrated circuit packaging system
US7009282B2 (en) * 2003-09-26 2006-03-07 Agere Systems Inc. Packaged integrated circuit providing trace access to high-speed leads
KR100639948B1 (ko) * 2005-08-22 2006-11-01 삼성전자주식회사 이원 리드 배치 형태를 가지는 리드프레임 패키지
KR100635386B1 (ko) * 2004-11-12 2006-10-18 삼성전자주식회사 고속 신호 처리가 가능한 반도체 칩 패키지
WO2007125939A1 (ja) * 2006-04-27 2007-11-08 Neomax Materials Co., Ltd. 配線接続用クラッド材及びそのクラッド材から加工された配線接続部材
US10541194B2 (en) * 2017-03-23 2020-01-21 Texas Instruments Incorporated Semiconductor package with interconnected leads

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164548A (en) * 1981-04-02 1982-10-09 Nec Corp Semiconductor device
KR940006585B1 (ko) * 1985-02-28 1994-07-22 소니 가부시키가이샤 반도체 회로장치
JPS6443246A (en) * 1987-08-12 1989-02-15 Toshiba Corp Detection system for magnetic resonance imaging apparatus

Also Published As

Publication number Publication date
US4989066A (en) 1991-01-29
KR900014991U (ko) 1990-08-02
KR930001754Y1 (ko) 1993-04-12

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