JPH0298148A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH0298148A JPH0298148A JP25038888A JP25038888A JPH0298148A JP H0298148 A JPH0298148 A JP H0298148A JP 25038888 A JP25038888 A JP 25038888A JP 25038888 A JP25038888 A JP 25038888A JP H0298148 A JPH0298148 A JP H0298148A
- Authority
- JP
- Japan
- Prior art keywords
- state
- value
- adhesive
- coating
- dispenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims abstract description 35
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は１半導体装置の製造方法に関し・、とくに、グ
イボンディング用接着剤の被ボンデイング材（こ対する
塗布状態の維持に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and in particular, to maintaining the state of application of a bonding adhesive to a material to be bonded.
従来の技術
従来塗布装置によって被ボンデイング材に塗布されるグ
イボンディング用接着剤の塗布条件は、一定とされてい
た。たとえば、グイボンディング用接着剤として銀ペー
ストなどの流動性導体ペーストを用い、塗布装置として
流動性導体ペーストを収容した注射器状のデイスペンサ
ーと称する装置を用いた場合の塗布条件は、流動性導体
ペーストの吐出圧、吐出時間、吐出ノズルの内径、吐出
ノズル先端と被ボンデイング材のクリアランス量が全て
一定とされていたり
発明が解決しようとする課題
しかしながら上記の従来の構成では、吐出用ノズル中に
グイボンディング用接着剤が付着し、吐出回数や動作時
間の増加にともなって吐出ノズルの内径が縮少されるな
どにより、実質的な塗布条件が変動し、塗布状態を決定
する状態量、ｔコとえば、塗布１塗布形状などが変動し
ていた。そのタメニ、塗布状態を一定に維持することが
できず、ダイボンディングの品質が安定しないという問
題があった。また、従来は、塗布状態を安定させるため
に、オペレーターの判断（こよって塗布状態を管理して
いたので、オペレーターが変わることによって塗布状態
の良否の判断基準が個人によって変化するという問題が
あった。2. Description of the Related Art Conventionally, the coating conditions for a bonding adhesive applied to a material to be bonded using a coating apparatus were constant. For example, if a fluid conductor paste such as silver paste is used as the glue bonding adhesive and a syringe-shaped dispenser containing the fluid conductor paste is used as the application device, the application conditions are as follows: However, in the conventional configuration described above, the discharge pressure, discharge time, inner diameter of the discharge nozzle, and clearance amount between the tip of the discharge nozzle and the material to be bonded are all fixed. As the bonding adhesive adheres and the inner diameter of the discharge nozzle decreases as the number of discharges and operation time increases, the actual coating conditions change, and the state quantity, t, that determines the coating state changes. For example, the shape of the first coating varied. There was a problem in that the coating state could not be maintained constant due to the damage, and the quality of die bonding was unstable. In addition, in the past, in order to stabilize the coating condition, the coating condition was managed by the operator's judgment (therefore, there was a problem that the criteria for judging whether the coating condition was good or bad would change depending on the individual as the operator changed). .
本発明は、上記課題を解決するもので、ダイボンディン
グ用接着剤を用いたダイボンディングの品質を安定させ
ることが出来る半導体装置の製造方法を提供することを
目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a semiconductor device that can stabilize the quality of die bonding using a die bonding adhesive.
課題を解決するための手段
上記課題を解決するために、本発明の半導体装置の製造
方法は、被ボンデイング材Ｉこ塗布装置によってダイボ
ンディング用の接着剤を塗布し、塗布された接着剤の塗
布状態を認識用カメラで撮像し、撮像された画像を画像
処理装置で分析して塗布状態を表わす状態量の値を検知
し、かつ検知された状態量の値とあらかじめ画像処理装
置に設定された前記状態量の基準値とを比較して前記状
態量の変化値を算出し、算出された変化値をデータ処理
装置に送り、データ処理装置において前記変化値に基づ
いた塗布装置の制御指示値を算出し、算出された制御指
示値を塗布装置にフィードバックして接着剤の塗布状態
が所定状態となるように塗布装置の動作量を修正制御す
る構成としたものである。Means for Solving the Problems In order to solve the above problems, the method for manufacturing a semiconductor device of the present invention includes applying an adhesive for die bonding using a coating device for a material to be bonded, and coating the applied adhesive. The state is imaged with a recognition camera, the captured image is analyzed by an image processing device, the value of the state quantity representing the application state is detected, and the value of the detected state quantity and the value of the state quantity set in advance in the image processing device are A change value of the state quantity is calculated by comparing it with a reference value of the state quantity, the calculated change value is sent to a data processing device, and the data processing device generates a control instruction value for the coating device based on the change value. The calculated control instruction value is fed back to the coating device to correct and control the amount of operation of the coating device so that the adhesive coating state is in a predetermined state.
作用
上記構成により、接着剤の塗布状態の良否判断が状態量
による数量値の比較として行われるので、塗布状態が常
に一定の客観的な基準をもって判定される。そして、状
態量の変化値に基づいて塗布装置の制御指示値を算出す
ることにより、塗布装置の動作量が、塗布状態を所定状
態とするための適格なものとする。このことによって、
ダイボンディング用の接着剤の塗布状態が常に一定の状
態に維持され、接着剤を用いたダイボンドの状態が安定
する。Effects With the above configuration, the quality of the applied state of the adhesive is determined by comparing numerical values based on state quantities, so that the applied state is always determined based on a constant objective standard. Then, by calculating a control instruction value for the coating device based on the change value of the state quantity, the operation amount of the coating device is made suitable for bringing the coating state into a predetermined state. By this,
The application state of the adhesive for die bonding is always maintained in a constant state, and the state of die bonding using the adhesive is stabilized.
実施例
以下、本発明の一実施例を図面に基づいて説明する。第
１図において、搬送レール１の上には搬送台２が配置さ
れており、この搬送台２の上に被ボンデイング材３が載
置されている。そして、搬送レール１の上方には塗布装
置としてのデイスペンサー４が配置されており、このデ
イスペンサー４は注射器状をなし、被ボンデイング材３
にダイボンディング用の接着剤５を吐出するものである
。EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings. In FIG. 1, a conveyance table 2 is arranged on a conveyance rail 1, and a bonding target material 3 is placed on this conveyance table 2. A dispenser 4 as a coating device is arranged above the conveyance rail 1, and this dispenser 4 is shaped like a syringe, and the material to be bonded 3
Adhesive 5 for die bonding is discharged to the adhesive 5 for die bonding.
また、デイスペンサー４は、接着剤５の吐出圧、吐出時
間、および吐出ノズル６の先端と被ボンデイング材３と
のクリアランス量などの動作量を調節可能になされてお
り、接着剤５としては流動性導体ペーストが用いられて
いる。そして、搬送レール１の上方でデイスペンサー４
よりも搬送先側に位置して認識用カメラ７が配置されて
おり、この認識用カメラ７は被ボンディング材３上に配
置された接着剤５の塗布状態を撮像するようになされて
いる。また、認識用カメラ７は画像処理装置８に電気的
に接続されている。そして、画像処理装置１８は認識用
カメラ７から送られてくる画像を回折して塗布状態を表
わす状態量、たとえば塗布量、塗布領、域、などを検知
し、かつ検知された状態量の値とあらかじめ画像処理装
置８に設定された状態量の基準値とを比較して前記状態
量の変化値を算出するようになされている。また、画像
処理装置８はデータ処理袋＠９に電気的に接続されてい
る。そして、データ処理装置９は、画像処理装置８で算
出された変化値に基づいてデイスペンサー４の制御指示
値を算出するようになされており、データ処理装置９は
デイスペンサー４に電気的に接続されている。また、デ
イスペンサー４は、データ処理装置９から送られてくる
制御指示値に基づいて動作量を制御するようになされて
いる。Further, the dispenser 4 is configured to be able to adjust operating amounts such as the discharge pressure and discharge time of the adhesive 5 and the amount of clearance between the tip of the discharge nozzle 6 and the material to be bonded 3. A conductive paste is used. Then, the dispenser 4 is placed above the conveyor rail 1.
A recognition camera 7 is disposed closer to the conveyance destination, and this recognition camera 7 is configured to take an image of the application state of the adhesive 5 placed on the bonding target material 3. Further, the recognition camera 7 is electrically connected to the image processing device 8 . Then, the image processing device 18 diffracts the image sent from the recognition camera 7 and detects state quantities representing the application state, such as application amount, application area, area, etc., and also detects the value of the detected state quantity. The change value of the state quantity is calculated by comparing the state quantity with a reference value of the state quantity set in advance in the image processing device 8. Further, the image processing device 8 is electrically connected to the data processing bag @9. The data processing device 9 is configured to calculate a control instruction value for the dispenser 4 based on the change value calculated by the image processing device 8, and the data processing device 9 is electrically connected to the dispenser 4. has been done. Further, the dispenser 4 is configured to control the amount of operation based on a control instruction value sent from the data processing device 9.
以下、上記構成における作用について説明する。The effects of the above configuration will be explained below.
デイスペンサー４によって被ボンデイング材３の上に塗
布された接着剤５の塗布状態を認識用カメラで撮像し、
撮像された画像を画像処理装置８で分析して塗布状態の
変化を状態量の変化値として算出する。そして、データ
処理装置９が状態量の変化値に基づいて算出した制御指
示値がデイスペン→ノ゛−４にフィードバックされ、デ
イスペンサー４の動作量が修正制御されて、接着剤５の
塗布状態が所定状態に維持される。したがって、接着剤
の塗布状態の良否判断が状態量による数量値の比較とし
て行われるので、塗布状態が常に一定の客観的な基準を
もって判定される。そして、状態量の変化値に基づいて
デイスペンサー４の制御指示値が算出されるので、デイ
スペンサー４の動作量が、塗布状態を所定状態とするた
めの適格なものとなる。このことによって、ダイボンデ
ィング用の接着剤の塗布状態が常に一定の状態に維持さ
れ、接着剤を用いたダイボンドの状態が安定する。なを
、画像処理装置８における処理は二次元処理でも三次元
処理でもよい。また、塗布装置はデイスペンサー４に・
限らない。A recognition camera captures an image of the application state of the adhesive 5 applied to the bonding target material 3 by the dispenser 4,
The captured image is analyzed by the image processing device 8 and the change in the application state is calculated as a change value of the state quantity. Then, the control instruction value calculated by the data processing device 9 based on the change value of the state quantity is fed back to the dispenser→no-4, the operation amount of the dispenser 4 is corrected and controlled, and the application state of the adhesive 5 is adjusted. It is maintained in a predetermined state. Therefore, since the quality of the applied state of the adhesive is determined by comparing the numerical values of the state quantities, the applied state is always determined based on a certain objective standard. Since the control instruction value for the dispenser 4 is calculated based on the change value of the state quantity, the operation amount of the dispenser 4 becomes suitable for bringing the application state into a predetermined state. As a result, the application state of the adhesive for die bonding is always maintained in a constant state, and the state of die bonding using the adhesive is stabilized. Furthermore, the processing in the image processing device 8 may be two-dimensional processing or three-dimensional processing. In addition, the coating device is attached to the dispenser 4.
Not exclusively.
発明の効果
以上述べたように、本発明によれば、客観的な基準に基
づいて接着剤の塗布状態の変化を判断することができ、
しかも、塗布状態の変化に応じて塗布装置を制御するこ
とができる。したがって、塗布状態を理想の所定状態に
維持してダイボンディングの品質を安定させることがで
きる。Effects of the Invention As described above, according to the present invention, changes in the application state of adhesive can be determined based on objective criteria.
Moreover, the coating device can be controlled according to changes in the coating state. Therefore, the coating state can be maintained at an ideal predetermined state and the quality of die bonding can be stabilized.
第１図は本発明の一実施例を示す全体構成図である。
１・・・搬送レール、３・・・被ボンデイング材、４・
・デイスペンサー ５・・・接着剤、７・・・認識用カ
メラ、８・・・画像処理装置、９・・・データ処理装置
。FIG. 1 is an overall configuration diagram showing an embodiment of the present invention. 1... Conveyance rail, 3... Bonded material, 4...
- Dispenser 5...Adhesive, 7...Recognition camera, 8...Image processing device, 9...Data processing device.
Claims (1)
ング用の接着剤を塗布し、塗布された接着剤の塗布状態
を認識用カメラで撮像し、撮像された画像を画像処理装
置で分析して塗布状態を表わす状態量の値を検知し、か
つ検知された状態量の値とあらかじめ画像処理装置に設
定された前記状態量の基準値とを比較して前記状態量の
変化値を算出し、算出された変化値をデータ処理装置に
送り、データ処理装置において前記変化値に基づいた塗
布装置の制御指示値を算出し、算出された制御指示値を
塗布装置にフィードバックして、接着剤の塗布状態が所
定状態となるように塗布装置の動作量を修正制御する半
導体装置の製造方法。1. Apply adhesive for die bonding to the material to be bonded using a coating device, take an image of the application state of the applied adhesive with a recognition camera, analyze the taken image with an image processing device, and apply it. Detecting the value of a state quantity representing a state, and comparing the detected value of the state quantity with a reference value of the state quantity set in advance in an image processing device to calculate a change value of the state quantity. The data processing device calculates a control instruction value for the coating device based on the variation value, and feeds back the calculated control instruction value to the coating device to determine the adhesive application state. A method for manufacturing a semiconductor device that corrects and controls the amount of operation of a coating device so that the amount of the coating device reaches a predetermined state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25038888A JPH0298148A (en) | 1988-10-04 | 1988-10-04 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25038888A JPH0298148A (en) | 1988-10-04 | 1988-10-04 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298148A true JPH0298148A (en) | 1990-04-10 |
Family
ID=17207177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25038888A Pending JPH0298148A (en) | 1988-10-04 | 1988-10-04 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298148A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0515423U (en) * | 1991-08-06 | 1993-02-26 | 鹿児島日本電気株式会社 | Die bonding equipment |
| US5423889A (en) * | 1994-06-24 | 1995-06-13 | Harris Corporation | Process for manufacturing a multi-port adhesive dispensing tool |
-
1988
- 1988-10-04 JP JP25038888A patent/JPH0298148A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0515423U (en) * | 1991-08-06 | 1993-02-26 | 鹿児島日本電気株式会社 | Die bonding equipment |
| US5423889A (en) * | 1994-06-24 | 1995-06-13 | Harris Corporation | Process for manufacturing a multi-port adhesive dispensing tool |
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