JPH0296797U - - Google Patents

Info

Publication number
JPH0296797U
JPH0296797U JP589189U JP589189U JPH0296797U JP H0296797 U JPH0296797 U JP H0296797U JP 589189 U JP589189 U JP 589189U JP 589189 U JP589189 U JP 589189U JP H0296797 U JPH0296797 U JP H0296797U
Authority
JP
Japan
Prior art keywords
noise suppression
suppression core
core
lead
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP589189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP589189U priority Critical patent/JPH0296797U/ja
Publication of JPH0296797U publication Critical patent/JPH0296797U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案のノイズ抑制コアの１実施例
を示す斜視図である。第２図は、従来のノイズ抑
制コアを示す斜視図である。 符号の説明、１，１１……ノイズ抑制コア、２
……非晶質磁性合金薄板、３……貫通孔、２０…
…電子部品。 FIG. 1 is a perspective view showing one embodiment of the noise suppression core of the present invention. FIG. 2 is a perspective view showing a conventional noise suppression core. Explanation of symbols, 1, 11...Noise suppression core, 2
...Amorphous magnetic alloy thin plate, 3...Through hole, 20...
...Electronic parts.

Claims (1)

【実用新案登録請求の範囲】 (1) 電子部品のリードに挿通し、この電子部品
から漏洩するか、あるいはこの電子部品に侵入す
るノイズを抑制するためのノイズ抑制コアであつ
て、非晶質磁性合金薄板を有し、この薄板の厚さ
方向に貫通する前記リード挿通用の貫通孔を有す
ることを特徴とするノイズ抑制コア。 (2) 前記貫通孔を複数有する請求項１に記載の
ノイズ抑制コア。 (3) 前記非晶質磁性合金薄板を積層一体化した
ものである請求項１または２に記載のノイズ抑制
コア。[Scope of Claim for Utility Model Registration] (1) A noise suppression core inserted into the lead of an electronic component to suppress noise leaking from or entering the electronic component, which is an amorphous core. 1. A noise suppression core comprising a magnetic alloy thin plate and a through hole for passing the lead through the thin plate in the thickness direction. (2) The noise suppression core according to claim 1, having a plurality of said through holes. (3) The noise suppression core according to claim 1 or 2, wherein the amorphous magnetic alloy thin plates are laminated and integrated.
JP589189U 1989-01-20 1989-01-20 Pending JPH0296797U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP589189U JPH0296797U (en) 1989-01-20 1989-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP589189U JPH0296797U (en) 1989-01-20 1989-01-20

Publications (1)

Publication Number Publication Date
JPH0296797U true JPH0296797U (en) 1990-08-01

Family

ID=31209657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP589189U Pending JPH0296797U (en) 1989-01-20 1989-01-20

Country Status (1)

Country Link
JP (1) JPH0296797U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590034A (en) * 1991-09-30 1993-04-09 Toshiba Corp Magnetic core for oscillation
JPH11345714A (en) * 1998-03-30 1999-12-14 Toshiba Corp Noise reducing element and semiconductor circuit element using the noise reducing element
JP2006253283A (en) * 2005-03-09 2006-09-21 Taisei Corp Electromagnetic shielding wire-through mechanism of cable
JP2013526775A (en) * 2010-05-10 2013-06-24 コリア インスティチュ−ト オブ マシナリ− アンド マテリアルズ Broadband electromagnetic wave absorber and manufacturing method thereof
JP2014022750A (en) * 2012-07-19 2014-02-03 Boeing Co Linear electromagnetic device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590034A (en) * 1991-09-30 1993-04-09 Toshiba Corp Magnetic core for oscillation
JPH11345714A (en) * 1998-03-30 1999-12-14 Toshiba Corp Noise reducing element and semiconductor circuit element using the noise reducing element
JP2006253283A (en) * 2005-03-09 2006-09-21 Taisei Corp Electromagnetic shielding wire-through mechanism of cable
JP2013526775A (en) * 2010-05-10 2013-06-24 コリア インスティチュ−ト オブ マシナリ− アンド マテリアルズ Broadband electromagnetic wave absorber and manufacturing method thereof
JP2014022750A (en) * 2012-07-19 2014-02-03 Boeing Co Linear electromagnetic device

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