JPH0296771U - - Google Patents

Info

Publication number

JPH0296771U

JPH0296771U JP483489U JP483489U JPH0296771U JP H0296771 U JPH0296771 U JP H0296771U JP 483489 U JP483489 U JP 483489U JP 483489 U JP483489 U JP 483489U JP H0296771 U JPH0296771 U JP H0296771U

Authority

JP

Japan

Prior art keywords

insulating substrate

conductor layer

wiring conductor

integrated circuit

metal frame

Prior art date

1989-01-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 12
• 239000002184 metal Substances 0.000 claims description 5
• 239000011248 coating agent Substances 0.000 claims description 2
• 238000000576 coating method Methods 0.000 claims description 2
• 239000011347 resin Substances 0.000 claims description 2
• 229920005989 resin Polymers 0.000 claims description 2
• 239000004020 conductor Substances 0.000 claims 8
• 238000005476 soldering Methods 0.000 claims 2
• 238000005452 bending Methods 0.000 description 1