JPH0296764U - - Google Patents
Info
- Publication number
- JPH0296764U JPH0296764U JP576189U JP576189U JPH0296764U JP H0296764 U JPH0296764 U JP H0296764U JP 576189 U JP576189 U JP 576189U JP 576189 U JP576189 U JP 576189U JP H0296764 U JPH0296764 U JP H0296764U
- Authority
- JP
- Japan
- Prior art keywords
- view
- pattern
- sectional
- ict
- test pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP576189U JPH0296764U (enExample) | 1989-01-20 | 1989-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP576189U JPH0296764U (enExample) | 1989-01-20 | 1989-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0296764U true JPH0296764U (enExample) | 1990-08-01 |
Family
ID=31209413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP576189U Pending JPH0296764U (enExample) | 1989-01-20 | 1989-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0296764U (enExample) |
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1989
- 1989-01-20 JP JP576189U patent/JPH0296764U/ja active Pending