JPH0295821A - Injection mold of optical disc board - Google Patents
Injection mold of optical disc boardInfo
- Publication number
- JPH0295821A JPH0295821A JP24960088A JP24960088A JPH0295821A JP H0295821 A JPH0295821 A JP H0295821A JP 24960088 A JP24960088 A JP 24960088A JP 24960088 A JP24960088 A JP 24960088A JP H0295821 A JPH0295821 A JP H0295821A
- Authority
- JP
- Japan
- Prior art keywords
- sic
- main body
- mold
- injection mold
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 title claims abstract description 13
- 239000007924 injection Substances 0.000 title claims abstract description 13
- 230000003287 optical effect Effects 0.000 title claims description 12
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 230000003746 surface roughness Effects 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 13
- 229910003460 diamond Inorganic materials 0.000 abstract description 5
- 239000010432 diamond Substances 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 5
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract 1
- 239000011369 resultant mixture Substances 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 229910001315 Tool steel Inorganic materials 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、光ディスク基板の射出成形型に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an injection mold for optical disc substrates.
[従来の技術]
光ディスクは、PC(ポリカーボネート)、アクリル等
の合成樹脂からなる樹脂基板やガラスからなるガラス基
板に、金属や金属化合物の薄膜を記録・読み出し層とし
てコーティングし、かつ保、411Aを形成して構成さ
れている。[Prior Art] Optical discs are made by coating a resin substrate made of synthetic resin such as PC (polycarbonate) or acrylic, or a glass substrate made of glass with a thin film of metal or metal compound as a recording/reading layer, and then forming a 411A film. formed and composed.
ガラス基板は、加工精度のよいものが得られるが、ガラ
ス板を切断し、表面をダイヤモンド砥石等で研削して研
摩しなければならず、コストが大幅にアップする欠点が
ある。Glass substrates can be manufactured with good processing precision, but the glass plate must be cut and the surface must be ground and polished using a diamond grindstone or the like, which has the drawback of significantly increasing costs.
一方、樹脂基板は、主に射出成形によって安価に製造さ
れるが、光ディスクが再生専用型(ROM)から追記型
(FROM)、更に書き換え型(RAM)に進歩するに
つれて加工精度が要求され、かつ反りや表面の平坦度が
重要視されるようになった。On the other hand, resin substrates are manufactured at low cost mainly by injection molding, but as optical disks progress from read-only (ROM) to write-once (FROM) and then to rewritable (RAM), processing precision is required. Warpage and surface flatness are now considered important.
従来、上記樹脂基板を射出成形する射出成形型は、例え
ば特殊ステンレス工具鋼等の金属製である。Conventionally, an injection mold for injection molding the resin substrate is made of metal such as special stainless tool steel.
[発明が解決しようとする課題]
しかしながら、上記従来の光ディスクの射出成彫型にお
いては、射出成形時に加熱されるので、熱変形により反
りが生ずる欠点があった。又、短時間(約lO万ショト
)で摩耗したり、腐食したり、傷がつき易い問題があっ
た。[Problems to be Solved by the Invention] However, the conventional injection molding mold for optical discs described above has the disadvantage that warping occurs due to thermal deformation because it is heated during injection molding. In addition, there was a problem that it was easily worn out, corroded, and scratched in a short period of time (approximately 10,000 shots).
そこで、本発明は、反りが小さいと共に、長寿命の光デ
ィスク基板の射出成形型の提供を目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an injection molding mold for an optical disk substrate that has a long life and less warpage.
[課題を解決するための手段]
前記課題を解決するため、本発明は、SiC焼結体又は
5t−SiC反応焼結体の表面にCVD法による緻密な
SiC膜を被膜したものである。[Means for Solving the Problems] In order to solve the above problems, the present invention coats the surface of a SiC sintered body or a 5t-SiC reaction sintered body with a dense SiC film by CVD.
sic膜の厚さは、5〜2000μmとすることが好ま
しく、又、少なくとも成形面の表面粗さを0.02μl
DRmaxとすることが好ましい。The thickness of the SIC film is preferably 5 to 2000 μm, and the surface roughness of the molding surface is at least 0.02 μl.
It is preferable to set it as DRmax.
[作 用〕
上記手段によれば、射出成形時の熱変形が小さくなると
共に、耐摩耗性、耐食性に優れかつ傷がつきにくくなる
。[Function] According to the above-mentioned means, thermal deformation during injection molding is reduced, and wear resistance and corrosion resistance are excellent, and scratches are less likely to occur.
又、表面がCVD法により被覆されているので滑らかと
なる。Moreover, since the surface is coated by CVD, it becomes smooth.
SiC膜の厚さは、上記範囲が好ましく、5μm未満で
あると表面が滑らかにならず、2000μmを越えると
SiC膜に歪が残り、剥離し易くなる。The thickness of the SiC film is preferably within the above range; if it is less than 5 μm, the surface will not be smooth, and if it exceeds 2000 μm, strain will remain in the SiC film, making it easy to peel off.
少なくとも成形面の表面粗さは、ダイヤモンド砥粒研摩
により0.02μm以下とすることが好ましく、0.0
2μmを越えると成形製品に型の面粗さがそのまま転写
され傷として残る。The surface roughness of at least the molded surface is preferably 0.02 μm or less by diamond abrasive polishing, and 0.0
If it exceeds 2 μm, the surface roughness of the mold will be directly transferred to the molded product and remain as a scratch.
[実施例] 以下、本発明の詳細な説明する。[Example] The present invention will be explained in detail below.
第1実施例
0.1umのSiC粉末に外車で0.7重量%のB4C
粉末と3重量%のカーボンを含むフェノール樹脂を添加
し、アルコールを加えてボールミルで混合粉砕した。こ
の混合物をラバープレスで成形後2000℃で焼成し、
外径100+um 、内径35mm、厚さ10mmの円
輪板状のコア本体1及びキャビティ本体2(第1図参照
)を作った。そして、各本体1.2の内面(成形面)に
CVD法(化学気相成長法)により厚さ250μmのm
密なSiC膜(図示せず)を形成した後、ダイヤモンド
砥粒研摩により成形面の表面粗さを0.02μmR□8
とした。First Example: 0.1 um SiC powder with 0.7 wt% B4C
Powder and phenolic resin containing 3% by weight of carbon were added, alcohol was added, and the mixture was mixed and ground in a ball mill. This mixture was molded using a rubber press and then fired at 2000°C.
A circular plate-shaped core body 1 and cavity body 2 (see FIG. 1) having an outer diameter of 100 um, an inner diameter of 35 mm, and a thickness of 10 mm were made. Then, the inner surface (molding surface) of each main body 1.2 was coated with a thickness of 250 μm using the CVD method (chemical vapor deposition method).
After forming a dense SiC film (not shown), the surface roughness of the molded surface was reduced to 0.02μmR□8 by diamond abrasive polishing.
And so.
次いで、各本体1,2を、第1図、第2図に示すように
、背面に2条のスパイラル状をなす放熱溝3a、4aを
有するコア本体取付板3、キャビティ本体取付板4に、
リング状の押え金具5.6により複数のボルト7を介し
て取り付けてコア型8、キャビティ型9とし、射出成形
型を作った。Next, as shown in FIGS. 1 and 2, each of the bodies 1 and 2 is mounted on a core body mounting plate 3 and a cavity body mounting plate 4, each having two spiral heat dissipation grooves 3a, 4a on the back surface.
A ring-shaped holding fitting 5.6 was attached via a plurality of bolts 7 to form a core mold 8 and a cavity mold 9, thereby making an injection mold.
本体取付板3,4及び押え金具5.6は、特殊ステンレ
ス工具鋼等の金属からなるもので、キャビティ型9の押
え金具6の外端面(第1図においては下面)は、樹脂が
押し込まれるキャビティ10を形成するため、キャビテ
ィ本体2の成形面より適宜に突出されている。The main body mounting plates 3, 4 and the holding fitting 5.6 are made of metal such as special stainless tool steel, and the outer end surface (lower surface in FIG. 1) of the holding fitting 6 of the cavity mold 9 is into which resin is pushed. In order to form the cavity 10, it is appropriately protruded from the molding surface of the cavity body 2.
上記射出成形型を使用してpc樹脂により光ディスク基
板を射出成形したところ、加熱時のコア本体1、キャビ
ティ本体2の反りが、従来の特殊ステンレス工具鋼製の
ものに比して115以下になった。When an optical disc substrate was injection molded using PC resin using the above injection molding mold, the warpage of the core body 1 and cavity body 2 during heating was 115 or less compared to conventional special stainless tool steel tools. Ta.
又、上記射出成形型は、摩耗しにくく、かつ傷もつきに
くく、耐食性に優れ保管中の請も無く、寿命が従来のも
のの5倍以上となった。Furthermore, the injection mold is resistant to wear and damage, has excellent corrosion resistance, and has no problems during storage, and has a lifespan more than five times that of conventional molds.
第2実施例
5μmのSiC粉末にフェノール樹脂lO重二%添加し
て混合成形し、200℃で硬化させ1500℃で焼成し
た。その後1500℃で熔融シリコンと反応させ、実施
例1と同寸法のコア本体及びキャビティ本体を作った。Second Example 2% of phenol resin was added to 5 μm SiC powder, mixed and molded, cured at 200°C, and fired at 1500°C. Thereafter, it was reacted with molten silicon at 1500° C. to produce a core body and a cavity body having the same dimensions as in Example 1.
そして、各本体の内面にCVD法により厚さ250μm
の緻密なS i cgを形成した後、ダイヤモンド砥粒
研摩により0.02μmR□8の表面粗さとして光ディ
スク基板を射出成形したところ、実施例1と同様の作用
効果が得られた。Then, the inner surface of each body is coated with a thickness of 250 μm using the CVD method.
After forming a dense S i cg, diamond abrasive polishing was performed to obtain a surface roughness of 0.02 μmR□8, and an optical disk substrate was injection molded, and the same effects as in Example 1 were obtained.
[発明の効果]
以上のように本発明によれば、射出成形時の熱変形が小
さくなるので、従来の成形型に比し反りを175以下に
することができる。[Effects of the Invention] As described above, according to the present invention, thermal deformation during injection molding is reduced, so warpage can be reduced to 175 or less compared to conventional molds.
又、摩耗しにく(かつ傷がつきにくく、更に耐食性に優
れているため、再研摩寿命を従来のものの5倍以上に延
ばすことができる。In addition, since it is resistant to wear (and scratches) and has excellent corrosion resistance, the re-polishing life can be extended by more than five times compared to conventional products.
更に、表面がCVD法による緻密なSiC膜によって被
覆され、滑らかとなっているので、成形時の寸法精度が
よくなる。Furthermore, since the surface is coated with a dense SiC film formed by CVD and is smooth, dimensional accuracy during molding is improved.
図は本発明の一実施例を示すもので、第1図及び第2図
は光ディスク基板の射出成形型の縦断面図及び底面図で
ある。
1・・・コア本体 2・・・キャビティ本体3・
・・コア本体取付板
4・・・キャビティ本体取付板
5.6・・・押え金具 8・・・コア型9・・・キャ
ビティ型 10・・・キャビティ出願人 東芝セラ
ミックス株式会社The figures show one embodiment of the present invention, and FIGS. 1 and 2 are a longitudinal sectional view and a bottom view of an injection mold for an optical disk substrate. 1... Core body 2... Cavity body 3.
...Core body mounting plate 4...Cavity body mounting plate 5.6...Press fitting 8...Core mold 9...Cavity mold 10...Cavity applicant Toshiba Ceramics Corporation
Claims (3)
にCVD法による緻密なSiC膜を被覆したことを特徴
とする光ディスク基板の射出成形型。(1) An injection mold for an optical disk substrate, characterized in that the surface of a SiC sintered body or a Si-SiC reaction sintered body is coated with a dense SiC film by CVD.
とを特徴とする請求項1記載の光ディスク基板の射出成
形型。(2) The injection mold for an optical disk substrate according to claim 1, wherein the SiC film has a thickness of 5 to 2000 μm.
m_a_xとしたことを特徴とする請求項1又は2記載
の光ディスク基板の射出成形型。(3) The surface roughness of the molding surface is at least 0.02μmR_
The injection mold for an optical disc substrate according to claim 1 or 2, characterized in that m_a_x.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24960088A JPH0295821A (en) | 1988-10-03 | 1988-10-03 | Injection mold of optical disc board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24960088A JPH0295821A (en) | 1988-10-03 | 1988-10-03 | Injection mold of optical disc board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0295821A true JPH0295821A (en) | 1990-04-06 |
Family
ID=17195431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24960088A Pending JPH0295821A (en) | 1988-10-03 | 1988-10-03 | Injection mold of optical disc board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0295821A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015162585A3 (en) * | 2014-04-25 | 2015-12-30 | Sabic Global Technologies B.V. | Molds and methods of making molds having conforming heating and cooling systems |
-
1988
- 1988-10-03 JP JP24960088A patent/JPH0295821A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015162585A3 (en) * | 2014-04-25 | 2015-12-30 | Sabic Global Technologies B.V. | Molds and methods of making molds having conforming heating and cooling systems |
CN106457392A (en) * | 2014-04-25 | 2017-02-22 | 沙特基础工业全球技术有限公司 | Molds and methods of making molds having conforming heating and cooling systems |
CN106457392B (en) * | 2014-04-25 | 2018-08-31 | 沙特基础工业全球技术有限公司 | Mold and its manufacturing method with conformal heating and cooling system |
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