JPH0295263U - - Google Patents
Info
- Publication number
- JPH0295263U JPH0295263U JP353989U JP353989U JPH0295263U JP H0295263 U JPH0295263 U JP H0295263U JP 353989 U JP353989 U JP 353989U JP 353989 U JP353989 U JP 353989U JP H0295263 U JPH0295263 U JP H0295263U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- reflecting means
- envelope
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005286 illumination Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第1図はこの考案の一実施例を示すものであり
、同図aは正面図、同図bは側断面図、第2図は
第1図に示す発光ダイオードを照光スイツチに収
容した状態を示す要部の側断面図、第3図は従来
の発光ダイオードを示す側断面図、第4図は第3
図に示す発光ダイオードを照光スイツチに収容し
た状態を示す要部の側断面図である。 20……発光ダイオード、21……樹脂モール
ド、22……反射部材、23……LED素子、2
4……発光部。
、同図aは正面図、同図bは側断面図、第2図は
第1図に示す発光ダイオードを照光スイツチに収
容した状態を示す要部の側断面図、第3図は従来
の発光ダイオードを示す側断面図、第4図は第3
図に示す発光ダイオードを照光スイツチに収容し
た状態を示す要部の側断面図である。 20……発光ダイオード、21……樹脂モール
ド、22……反射部材、23……LED素子、2
4……発光部。
Claims (1)
- 透光性外囲器と、この外囲器内に収容された反
射手段と、この反射手段に発光ダイオード素子の
発光部を対向して配設したことを特徴とする発光
ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP353989U JPH0295263U (ja) | 1989-01-18 | 1989-01-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP353989U JPH0295263U (ja) | 1989-01-18 | 1989-01-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0295263U true JPH0295263U (ja) | 1990-07-30 |
Family
ID=31205262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP353989U Pending JPH0295263U (ja) | 1989-01-18 | 1989-01-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0295263U (ja) |
-
1989
- 1989-01-18 JP JP353989U patent/JPH0295263U/ja active Pending