JPH0294679A - Manufacture of piezoelectric device displacement amplification mechanism - Google Patents
Manufacture of piezoelectric device displacement amplification mechanismInfo
- Publication number
- JPH0294679A JPH0294679A JP63247998A JP24799888A JPH0294679A JP H0294679 A JPH0294679 A JP H0294679A JP 63247998 A JP63247998 A JP 63247998A JP 24799888 A JP24799888 A JP 24799888A JP H0294679 A JPH0294679 A JP H0294679A
- Authority
- JP
- Japan
- Prior art keywords
- displacement
- lever arm
- piezoelectric element
- piezoelectric device
- amplification mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006073 displacement reaction Methods 0.000 title claims abstract description 77
- 230000007246 mechanism Effects 0.000 title claims abstract description 24
- 230000003321 amplification Effects 0.000 title claims abstract description 19
- 238000003199 nucleic acid amplification method Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 12
- 239000002184 metal Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Moving Of The Head To Find And Align With The Track (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は圧電素子変位増幅機構の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing a piezoelectric element displacement amplification mechanism.
第３図は圧電素子変位増幅機構の一例を示す斜視図であ
る。この圧電素子変位増幅機構は、取付基板２２と、２
本のレバーアーム２３と、レバーアーム２３と取付基板
２２とを接続するヒンジ２４と、圧電素子２５の各端面
に接着剤２８で接着されレバーアーム２３に圧電素子２
５の変位を伝達する変位伝達手段２６と、両レバーアー
ム２３の先端部にブリッジ状に接続された変位拡大手段
としての梁２９によって構成されている。FIG. 3 is a perspective view showing an example of a piezoelectric element displacement amplification mechanism. This piezoelectric element displacement amplification mechanism includes a mounting board 22 and a
The lever arm 23 of the book, the hinge 24 connecting the lever arm 23 and the mounting board 22, and the piezoelectric element 25 bonded to each end surface of the piezoelectric element 25 with an adhesive 28.
5, and a beam 29 as a displacement amplifying means connected to the tips of both lever arms 23 in a bridge shape.
第５図は、前記圧電素子変位増幅機構の製造工程を示す
工程図である。図中、符号２１は、金属板をプレス打抜
き法等によって製造した変位拡大金具であり、取付穴２
２ａを有する取付基板２２．２本のレバーアーム２３、
レバーアーム２３と取付基板２２を接続するヒンジ２４
、レバーアーム２３に圧電素子２５の変位を伝達する変
位伝達手段２６が一体構造としである。先ず、変位拡大
金具２１と圧電素子２５を準備し、エポキシ樹脂等の接
着剤２８で変位伝達手段２６に圧電素子２５の両端を接
着する０次に、薄い金属板をプレス打抜き法等によって
打抜き、両端を変位拡大金具２１の板厚に合せコ字状に
成型した梁２９とリベット３０を準備し、梁２９のコ字
状部をレバーアーム２３の先端に組み合せた後、レバー
アーム２３の先端および梁２９のコ字状部に設けられた
リベット穴２３ａおよび２９ａにリベット３０を貫通さ
せて油圧プレス機等によってリベット３０を所定寸法に
成型する。これにより、第３図に示す圧電素子変位増幅
機構が得られる。FIG. 5 is a process diagram showing the manufacturing process of the piezoelectric element displacement amplification mechanism. In the figure, reference numeral 21 is a displacement enlarging fitting manufactured from a metal plate by a press punching method, etc., and the mounting hole 2
a mounting board 22 with 2a; two lever arms 23;
Hinge 24 connecting lever arm 23 and mounting board 22
, a displacement transmitting means 26 for transmitting the displacement of the piezoelectric element 25 to the lever arm 23 is of an integral structure. First, the displacement magnification fitting 21 and the piezoelectric element 25 are prepared, and both ends of the piezoelectric element 25 are bonded to the displacement transmitting means 26 with an adhesive 28 such as epoxy resin.Next, a thin metal plate is punched out by a press punching method or the like. A beam 29 and a rivet 30 are prepared, both ends of which are molded into a U-shape to match the plate thickness of the displacement magnifying fitting 21, and the U-shaped portion of the beam 29 is assembled to the tip of the lever arm 23. The rivet 30 is passed through the rivet holes 23a and 29a provided in the U-shaped portion of the beam 29, and the rivet 30 is formed into a predetermined size using a hydraulic press or the like. As a result, the piezoelectric element displacement amplification mechanism shown in FIG. 3 is obtained.
上述した従来の圧電素子変位増幅機構の製造方法は、取
付基板とレバーアームとヒンジおよび変位伝達手段を一
体構造とした変位拡大金具を使用しているが、ヒンジは
圧電素子の変位を効率良く増幅するためその断面は極力
細く設計されているので、変位拡大金具の取扱い時、防
錆のためのメツキ作業時および運搬時等に作用する外力
によって容易に変形を生じるという欠点があり、寸法精
度が高く、出力変位の安定した圧電素子変位増幅機構を
製造する上での障害となっていた。The conventional method for manufacturing the piezoelectric element displacement amplification mechanism described above uses a displacement amplification fitting that has an integral structure of the mounting board, lever arm, hinge, and displacement transmission means, but the hinge efficiently amplifies the displacement of the piezoelectric element. Therefore, its cross section is designed to be as thin as possible, so it has the disadvantage that it is easily deformed by external forces that are applied when handling the displacement magnifying metal fittings, plating for rust prevention, transportation, etc., and the dimensional accuracy is low. This has been an obstacle to manufacturing a piezoelectric element displacement amplification mechanism with stable output displacement.
本発明の圧電素子変位増幅機構の製造方法は、取付基板
と、レバーアームと、ヒンジと、レバーアームとレバー
アーム間またはレバーアームと取付基板間を連結して接
続するタイバーとを一体として製造した変位拡大金具に
圧電素子を接着する工程と、前記タイバーを切断除去す
る工程とを有している。The method for manufacturing a piezoelectric element displacement amplification mechanism of the present invention includes integrally manufacturing a mounting board, a lever arm, a hinge, and a tie bar that connects and connects the lever arm and the lever arm or between the lever arm and the mounting board. The method includes a step of adhering a piezoelectric element to a displacement magnification fitting, and a step of cutting and removing the tie bar.
【作 用］
本発明は、レバーアームとレバーアーム間およびレバー
アームと取付基板の間を連結して接続するタイバーを設
けて変位拡大金具の外力に対する強度を向上させたもの
である。[Function] The present invention improves the strength of the displacement magnifying fitting against external forces by providing a tie bar that connects and connects the lever arms and the lever arm and the lever arm and the mounting board.
したがって、変位拡大金具の取扱い時、防錆のためのメ
ツキ作業時および運搬時等に作用する外力によって容易
に変形することがなくなる。Therefore, the displacement magnifying metal fitting is not easily deformed by external forces applied during handling, plating for rust prevention, transportation, and the like.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第１の実施例の工程図である０図中符
号１は、金属板をプレス打抜き法等によって製造された
変位拡大金具であり、取付穴２ａを有する取付基板２、
先端部にリベット穴３ａを有する２本のレバーアーム３
、レバーアーム３と取付基板２を接続するヒンジ４、レ
バーアーム３に圧電素子５の変位を伝達する変位伝達手
段６および２本のレバーアーム３の間を連結して接続す
るタイバー７が一体構造としである。先ず、変位拡大金
具ｌと圧電素子５を準備し、エポキシ樹脂等の接着剤８
で変位拡大金具１の変位伝達手段６の間に圧電素子５を
配して圧電素子５の両端を変位伝達手段６に接着する０
次に、変位拡大金具ｌの２本のレバーアーム３の間を連
結し接続しているタイバー７をプレス切断型等を使用し
て切断除去する。続いて薄い金属板をプレス打抜き法等
によって打抜き両端を変位拡大金具１の板厚に合せコ字
状に成型した梁９とリベット１０を準備し、梁９のコ字
状をレバーアーム３の先端に組み合せた後、レバーアー
ム３の先端および梁９のコ字状部に設けられたリベット
穴３ａ、９ａにリベット１０を貫通させて油圧プレス機
等によってリベットＩＯを所定寸法に成型して圧電素子
変位増幅機構の製造を完了する。FIG. 1 is a process diagram of the first embodiment of the present invention. Reference numeral 1 in FIG. 1 is a displacement enlarging fitting manufactured by press punching a metal plate, and a mounting board 2 having a mounting hole 2a;
Two lever arms 3 with rivet holes 3a at their tips
, a hinge 4 that connects the lever arm 3 and the mounting board 2, a displacement transmitting means 6 that transmits the displacement of the piezoelectric element 5 to the lever arm 3, and a tie bar 7 that connects and connects the two lever arms 3 are integrally constructed. It's Toshide. First, prepare the displacement magnification fitting l and the piezoelectric element 5, and apply an adhesive 8 such as epoxy resin.
The piezoelectric element 5 is arranged between the displacement transmitting means 6 of the displacement magnifying fitting 1, and both ends of the piezoelectric element 5 are glued to the displacement transmitting means 6.
Next, the tie bar 7 connecting and connecting the two lever arms 3 of the displacement magnifying fitting l is cut and removed using a press cutter or the like. Next, a beam 9 and a rivet 10 are prepared by punching out a thin metal plate using a press punching method or the like, and molding the beam 9 and rivet 10 into a U-shape with both ends matching the plate thickness of the displacement enlarging fitting 1. After assembling, the rivet 10 is passed through the rivet holes 3a and 9a provided in the tip of the lever arm 3 and the U-shaped part of the beam 9, and the rivet IO is molded to a predetermined size using a hydraulic press or the like to form the piezoelectric element. Completed manufacturing of displacement amplification mechanism.
変位量１０．、発生力２１ｋｇｆの圧電素子を使用し、
変位量３２０μｍ、発生力１５０ｇｆの圧電素子拡大機
構を１００個試作した結果は下表の通りであり、運搬時
および取り扱いによるヒンジの変形は発生しなかった。Displacement amount 10. , using a piezoelectric element with a generating force of 21 kgf,
The results of 100 prototype piezoelectric element expansion mechanisms with a displacement of 320 μm and a generated force of 150 gf are shown in the table below, and no deformation of the hinge occurred during transportation or handling.
第４図は、圧電素子の変位を伝達し拡大するレバーアー
ムによって構成した圧電素子変位増幅機構の一例を示す
ものである。FIG. 4 shows an example of a piezoelectric element displacement amplification mechanism constituted by a lever arm that transmits and magnifies the displacement of a piezoelectric element.
第２図は本発明の第２の実施例の工程図である０図中符
号１１は、金属板をワイヤーカット放電法等によって製
造した変位拡大金具であり、取付人１２ａを有するＬ字
状の取付基板１２、レバーアーム１３、レバーアーム１
３とＬ字状の取付基板１２とをその先端部で接続するヒ
ンジ１４、レバーアーム１３に圧電素子１５の変位を伝
達する変位伝達手段１６およびレバーアーム１３と取付
基板１２の間を接続して連結するタイバー１７が一体構
造としである。先ず、変位拡大金具１１．と圧電素子１
５を準備し、エポキシ樹脂等の接着剤１８でＬ字状の取
付基板１２の底部と変位伝達手段１６の間に圧電素子１
５を配して圧電素子１５の一端を取付基板１２の底部に
、他端を変位伝達手段１６に接着する０次に変位拡大金
具１１のレバーアーム１３と取付基板１２を連結して接
続しているタイバー１７をプレス切断型等を使用して切
断除去して第４図に示す圧電素子変位増幅機構が得られ
る。FIG. 2 is a process diagram of the second embodiment of the present invention. The reference numeral 11 in FIG. Mounting board 12, lever arm 13, lever arm 1
3 and the L-shaped mounting board 12 at their tips, a displacement transmitting means 16 that transmits the displacement of the piezoelectric element 15 to the lever arm 13, and a hinge 14 that connects the lever arm 13 and the mounting board 12. The connecting tie bars 17 have an integral structure. First, displacement magnification fitting 11. and piezoelectric element 1
5, and attach the piezoelectric element 1 between the bottom of the L-shaped mounting board 12 and the displacement transmission means 16 using an adhesive 18 such as epoxy resin.
5, one end of the piezoelectric element 15 is bonded to the bottom of the mounting board 12, and the other end is bonded to the displacement transmitting means 16. Next, the lever arm 13 of the displacement magnifying fitting 11 and the mounting board 12 are connected by connecting them. The piezoelectric element displacement amplification mechanism shown in FIG. 4 is obtained by cutting and removing the tie bars 17 using a press cutter or the like.
変位量１０μ、発生力２１ ｋｇｆの圧電素子を使用し
、変位ｆｉｌｏｏμｍ、発生力１２００ｇｆの圧電素子
変位拡大機構を１００個試作した結果は下表の通りであ
り、運搬時および取り扱いによるヒンジの変形は発生し
なかった。Using a piezoelectric element with a displacement of 10 μm and a generated force of 21 kgf, we created 100 piezoelectric element displacement magnification mechanisms with a displacement of filooμm and a generated force of 1200 gf. The results are shown in the table below. The deformation of the hinge during transportation and handling is It did not occur.
［発明の効果］
以上説明したように本発明は、変位拡大金具のレバーア
ームと、レバーアームとレーバーアーム間またはレバー
と取付基板との間を連結して接続するタイバーを一体構
造として設けた変位拡大金具を使用し、圧電素子を変位
拡大金具に接着して接続した後、タイバーを切断除去す
ることにより、変位拡大金具の取り扱い、防錆のための
メツキ作業時および運搬時等に作用する外力によって容
易に変形することが無くなり、寸法精度が高く、出力変
位の安定した圧電素子変位増幅機構を製造できる効果が
ある。[Effects of the Invention] As explained above, the present invention provides a displacement device in which the lever arm of the displacement magnifying fitting and the tie bar that connects and connects the lever arm and the lever arm or between the lever and the mounting board are provided as an integral structure. After bonding and connecting the piezoelectric element to the displacement magnification metal fitting using the expansion metal fitting, the tie bar is cut and removed to eliminate external forces that may be applied during handling of the displacement expansion metal fitting, plating for rust prevention, transportation, etc. Therefore, it is possible to manufacture a piezoelectric element displacement amplification mechanism that does not easily deform, has high dimensional accuracy, and has stable output displacement.
第１図は本発明の圧電素子変位拡大機構の製造方法の第
１の実施例の工程図、第２図は本発明の圧電素子変位拡
大機構の製造方法の第２の実施例の工程図、第３図およ
び第４図は圧電素子変位拡大機構の一例を示す斜視図、
第５図は圧電素子変位拡大機構の従来の製造方法の工程
図である。
１、１１・・・・・・変位拡大金具、２．２・・・・・
・取付基板、Ｚａ、 １２ａ・・・取付穴、 ３．
３・・・・・・レバーアーム３ａ、 １３ａ・・・リベ
ット穴、 ４．４・・・・・・ヒンジ、５．１５・・・
・・・圧電素子、 ６．６・・・・・・変位伝達手段
７．１７・・・・・・タイバー ８，１８・・・・
・・接着剤、９・・・・・・・・・梁、 ９
ａ・・・・・・・・・リベット穴、ＩＯ・・・・・・・
・・リベット。
変位ａ大會具１FIG. 1 is a process diagram of a first embodiment of a method for manufacturing a piezoelectric displacement amplifying mechanism of the present invention, and FIG. 2 is a process diagram of a second embodiment of a method of manufacturing a piezoelectric element displacement amplifying mechanism of the present invention. 3 and 4 are perspective views showing an example of a piezoelectric element displacement magnifying mechanism;
FIG. 5 is a process diagram of a conventional manufacturing method of a piezoelectric element displacement magnifying mechanism. 1, 11... Displacement magnification fitting, 2.2...
・Mounting board, Za, 12a...Mounting hole, 3.
3... Lever arm 3a, 13a... Rivet hole, 4.4... Hinge, 5.15...
...Piezoelectric element, 6.6...Displacement transmission means 7.17...Tie bar 8,18...
...Adhesive, 9...Beam, 9
a・・・・・・Rivet hole, IO・・・・・・・
··rivet. Displacement a large tool 1
Claims (1)
付基板に接続するヒンジと、レバーアームに圧電素子の
変位を伝達する変位伝達手段とを含み、厚電素子の変位
を増幅する圧電素子変位増幅機構の製造方法において、 取付基板と、レバーアームと、レバーアームとレバーア
ーム間またはレバーアームと取付基板間を連結して接続
するタイバーとを一体として製造した変位拡大金具に圧
電素子を接着する工程と、前記タイバーを切断除去する
工程とを含むことを特徴とする圧電素子変位増幅機構の
製造方法。1. A piezoelectric element displacement amplification mechanism for amplifying the displacement of a thick electric element, including a mounting board, a lever arm, a hinge connecting the lever arm to the mounting board, and a displacement transmitting means for transmitting the displacement of the piezoelectric element to the lever arm. In the manufacturing method, a step of bonding a piezoelectric element to a displacement magnification fitting manufactured as an integral unit of a mounting board, a lever arm, and a tie bar connecting and connecting between the lever arm and the lever arm or between the lever arm and the mounting board; A method of manufacturing a piezoelectric element displacement amplification mechanism, comprising the step of cutting and removing the tie bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63247998A JPH0775264B2 (en) | 1988-09-30 | 1988-09-30 | Method for manufacturing piezoelectric element displacement amplification mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63247998A JPH0775264B2 (en) | 1988-09-30 | 1988-09-30 | Method for manufacturing piezoelectric element displacement amplification mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0294679A true JPH0294679A (en) | 1990-04-05 |
| JPH0775264B2 JPH0775264B2 (en) | 1995-08-09 |
Family
ID=17171670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63247998A Expired - Lifetime JPH0775264B2 (en) | 1988-09-30 | 1988-09-30 | Method for manufacturing piezoelectric element displacement amplification mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0775264B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3387101B2 (en) * | 1997-08-04 | 2003-03-17 | セイコーエプソン株式会社 | Actuator, clock and alarm device using the same |
-
1988
- 1988-09-30 JP JP63247998A patent/JPH0775264B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3387101B2 (en) * | 1997-08-04 | 2003-03-17 | セイコーエプソン株式会社 | Actuator, clock and alarm device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0775264B2 (en) | 1995-08-09 |
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