JPH029443U - - Google Patents
Info
- Publication number
- JPH029443U JPH029443U JP1988087701U JP8770188U JPH029443U JP H029443 U JPH029443 U JP H029443U JP 1988087701 U JP1988087701 U JP 1988087701U JP 8770188 U JP8770188 U JP 8770188U JP H029443 U JPH029443 U JP H029443U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- heat dissipation
- insertion hole
- conductive material
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W90/754—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087701U JPH029443U (enExample) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087701U JPH029443U (enExample) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029443U true JPH029443U (enExample) | 1990-01-22 |
Family
ID=31312302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988087701U Pending JPH029443U (enExample) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029443U (enExample) |
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1988
- 1988-06-30 JP JP1988087701U patent/JPH029443U/ja active Pending