JPH0293018A - Formation of hardened and polished surface having grooves - Google Patents

Abstract

PURPOSE:To produce parts which have a hardened and polished surface accurately formed with grooves by irradiating the surface of the work partially with laser beams to alternately form hardened parts and non-hardened parts, then subjecting the surface of the work to polishing. CONSTITUTION:A laser oscillator 2 is operated to turn on and off the oscillation sate thereof. An X-Y table 4 is operated to move according to the oscillation condition of the oscillator 2. A laser light emitting part 3 is operated to oscillate at a high speed in such a manner that a plate 1 provided on the table 4 is irradiated with the laser light at about 1 to 2mm width. The surface of the plate 1 partially hardened to stripe shape in such a manner is subjected uniformly to surface grinding or polishing to fore the grooves 5 from about several micron depths to several tens micron on the non-hardened surface. The grooves 5 consisting of the side wall surfaces of the grooves 5 and the hardened surfaces which are connected with smooth arc shapes are accurately formed in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of forming a grooved hardened and polished surface.

[Conventional technology]

Conventionally, forming a hardened and polished surface with grooves has been carried out by the method described below.

(1) Groove cutting is performed using a milling machine, metal saw, etc. to form a groove, and then, after hardening, finishing is performed by grinding.

(2) Hardening is performed, and then grooves are formed using a slicer and then finished by grinding.

(3) After hardening, the surface is finished by grinding and grooves are formed by etching.

[Problem to be solved by the invention]

The conventional method for forming a hardened and polished surface with grooves described above is as follows:
All methods require at least three steps: hardening, groove formation, and grinding, and have the disadvantage of requiring a large number of steps. Furthermore, when the grooves are formed by the methods shown in (1) and (2), the boundary between the hardened surface and the side wall surface of the groove becomes an acute edge, which has the disadvantage that it is easy to cause flashing.

Furthermore, in the method shown in (+), since hardening is performed after forming the grooves, there is a drawback that misfiring is likely to occur.

The present invention solves the drawbacks of the above-mentioned conventional techniques by creating a groove that requires a small number of steps, does not cause misfiring, and can form a groove that connects the hardened surface and the side wall surface of the groove in a smooth arc shape. The purpose is to realize a method for forming a certain hardened and polished surface.

[Means to solve the problem]

The method for forming a hardened and polished surface with grooves of the present invention involves partially irradiating a target component surface with a laser beam, and alternately hardening the hardened portion by the laser beam irradiation and the non-hardened portion. and then, a step of grinding or polishing the target component surface.

[For production]

Partially irradiate the target part surface with a laser beam to harden the irradiated part, alternately forming hardened parts with high hardness and unhardened parts with low hardness. . Then, when this part surface is uniformly ground or polished, the portions with lower hardness are ground or polished more than the portions with higher hardness, so grooves are formed in the portions with lower hardness. Ru. In this case, the side wall surface of the groove to be formed and the hardened surface are connected in a smooth arc shape.

(Embodiment) FIG. 1 is a diagram showing the configuration of an embodiment of a hardening device used in the present invention.

This embodiment is comprised of a laser oscillator 2 controlled by a control device (not shown), a laser beam emitting section 3 consisting of a beam bender and a high-speed swing device, and an XY table 4.

A flat plate 1 is fixed on the surface of the XY table 4, on which a hardened and polished surface with grooves is to be formed, and which is used as a guide rail.

Next, the operation of this embodiment will be explained.

The control device turns on/off the oscillation state of the laser oscillator 2, moves the XY table 4 according to the oscillation state of the laser oscillator 2, and controls the laser beam emitting section 3. The plate 1 provided on the XY table 4 is oscillated at high speed so that the laser beam is irradiated with a width of 1 mm to 2 mm. For this reason, the surface of the plate 1 was hardened with a laser beam at regular intervals and widths. Next, the surface of the plate 1, which had been partially hardened in stripes as described above, was uniformly ground. At this time, since the hardness of the unhardened surface was smaller than the hardness of the hardened portion and had better grindability, grooves 5 with a depth of several microns to several tens of microns were formed. FIG. 2 is a side view of the plate 1 showing the state of the grooves 5 formed. In this way, a hardened and polished surface with grooves could be produced in just two steps.

FIG. 3 is a diagram showing the appearance of a cylindrical shaft 6 in which a groove 5 is formed according to another embodiment of the present invention. In the embodiment shown in FIG. 1, the case where grooves are formed on the surface of the flat plate 1 has been described, but in this embodiment, the grooves are formed under the laser beam emitting part 3 which is swinging at high speed. By rotating and feeding the shaft 6 in one direction, the shaft 6 was partially hardened in a spiral shape, and then cylindrical grinding was performed to form the groove 5 in the unhardened portion.

In any of the above embodiments, the grooves were formed by grinding after hardening, but the grooves can be formed in the same way by performing a polishing process such as lapping.

〔Effect of the invention〕

Since the present invention is configured as described above, it produces effects as described below.

Since creating the grooves and grinding or polishing are performed at the same time, the number of steps can be reduced. Even when a plurality of grooves are produced, they are simultaneously produced by the same grinding or polishing process, which is particularly effective when producing a large number of grooves.

Since the hardened surface and the side wall surface of the groove are connected in a smooth arc shape, when the hardened and polished surface with the groove is used as a sliding surface, it will not get caught on the mating part.

Since the hardening is performed by irradiating with a laser beam, partial hardening can be performed with good accumulation, and misfiring can be reduced. Furthermore, by changing the laser beam irradiation time, surface treatment time, etc., there is an effect that the pitch of the grooves to be formed and the shape of the grooves can be easily changed.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the configuration of an embodiment of the quenching apparatus used in the present invention, FIG. 2 is a side view of the plate 1 in FIG. 1, and FIG. FIG. 3 is a diagram showing the appearance of a shaft with grooves formed thereon. 1... Plate, 2... Laser oscillator,
3...Laser light emitting section 4-X Y table, 5
... Groove, 6... Axis. Patent applicant Canon Electronics Co., Ltd.

Claims (1)

[Claims] 1. A step of partially irradiating the target component surface with a laser beam and alternately forming hardened portions and non-hardened portions by the laser beam irradiation, and after this,
A method for forming a hardened and polished surface with grooves, which comprises the step of grinding or polishing the target component surface.