JPH0292944U - - Google Patents
Info
- Publication number
- JPH0292944U JPH0292944U JP161189U JP161189U JPH0292944U JP H0292944 U JPH0292944 U JP H0292944U JP 161189 U JP161189 U JP 161189U JP 161189 U JP161189 U JP 161189U JP H0292944 U JPH0292944 U JP H0292944U
- Authority
- JP
- Japan
- Prior art keywords
- package body
- semiconductor device
- tip
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP161189U JPH0292944U (de) | 1989-01-12 | 1989-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP161189U JPH0292944U (de) | 1989-01-12 | 1989-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292944U true JPH0292944U (de) | 1990-07-24 |
Family
ID=31201645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP161189U Pending JPH0292944U (de) | 1989-01-12 | 1989-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292944U (de) |
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1989
- 1989-01-12 JP JP161189U patent/JPH0292944U/ja active Pending