JPH0291352U - - Google Patents
Info
- Publication number
- JPH0291352U JPH0291352U JP46989U JP46989U JPH0291352U JP H0291352 U JPH0291352 U JP H0291352U JP 46989 U JP46989 U JP 46989U JP 46989 U JP46989 U JP 46989U JP H0291352 U JPH0291352 U JP H0291352U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- contained
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46989U JPH0291352U (en:Method) | 1989-01-05 | 1989-01-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46989U JPH0291352U (en:Method) | 1989-01-05 | 1989-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0291352U true JPH0291352U (en:Method) | 1990-07-19 |
Family
ID=31199528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46989U Pending JPH0291352U (en:Method) | 1989-01-05 | 1989-01-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0291352U (en:Method) |
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1989
- 1989-01-05 JP JP46989U patent/JPH0291352U/ja active Pending