JPH0291341U - - Google Patents

Info

Publication number
JPH0291341U
JPH0291341U JP25289U JP25289U JPH0291341U JP H0291341 U JPH0291341 U JP H0291341U JP 25289 U JP25289 U JP 25289U JP 25289 U JP25289 U JP 25289U JP H0291341 U JPH0291341 U JP H0291341U
Authority
JP
Japan
Prior art keywords
lead frame
heating plate
conveyance path
semiconductor chips
die bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25289U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP25289U priority Critical patent/JPH0291341U/ja
Publication of JPH0291341U publication Critical patent/JPH0291341U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP25289U 1989-01-05 1989-01-05 Pending JPH0291341U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25289U JPH0291341U (enrdf_load_stackoverflow) 1989-01-05 1989-01-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25289U JPH0291341U (enrdf_load_stackoverflow) 1989-01-05 1989-01-05

Publications (1)

Publication Number Publication Date
JPH0291341U true JPH0291341U (enrdf_load_stackoverflow) 1990-07-19

Family

ID=31199114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25289U Pending JPH0291341U (enrdf_load_stackoverflow) 1989-01-05 1989-01-05

Country Status (1)

Country Link
JP (1) JPH0291341U (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154041A (ja) * 1984-12-26 1986-07-12 Toshiba Corp 半導体組立装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154041A (ja) * 1984-12-26 1986-07-12 Toshiba Corp 半導体組立装置

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