JPH0290053U - - Google Patents
Info
- Publication number
- JPH0290053U JPH0290053U JP16817388U JP16817388U JPH0290053U JP H0290053 U JPH0290053 U JP H0290053U JP 16817388 U JP16817388 U JP 16817388U JP 16817388 U JP16817388 U JP 16817388U JP H0290053 U JPH0290053 U JP H0290053U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- rotating
- main shaft
- polishing
- interposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 16
- 238000005498 polishing Methods 0.000 claims description 15
- 238000010586 diagram Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16817388U JPH0290053U (es) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16817388U JPH0290053U (es) | 1988-12-28 | 1988-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0290053U true JPH0290053U (es) | 1990-07-17 |
Family
ID=31457119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16817388U Pending JPH0290053U (es) | 1988-12-28 | 1988-12-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0290053U (es) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6190870A (ja) * | 1984-10-09 | 1986-05-09 | Akiyama Akira | 両面研摩装置 |
-
1988
- 1988-12-28 JP JP16817388U patent/JPH0290053U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6190870A (ja) * | 1984-10-09 | 1986-05-09 | Akiyama Akira | 両面研摩装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW351690B (en) | Apparatus for grinding wafer | |
JPH0290053U (es) | ||
JPS6239968U (es) | ||
JPH0748368Y2 (ja) | 伸線用ダイスのアプローチ部研磨装置 | |
JPS6295867U (es) | ||
JPS63127867U (es) | ||
JPH0266942U (es) | ||
JPS6446159U (es) | ||
JPS58132640U (ja) | 研磨装置 | |
JPH01138655U (es) | ||
JPS63186549U (es) | ||
JPH0445664U (es) | ||
JPS6116263U (ja) | 研磨装置 | |
JPS61163152U (es) | ||
JPH0379262U (es) | ||
JPS63193655U (es) | ||
JPS62186427U (es) | ||
JPS61131263U (es) | ||
JPH0215257U (es) | ||
JPH0187864U (es) | ||
JPH0294056U (es) | ||
JPS61175353U (es) | ||
JPS6219159U (es) | ||
JPH01164056U (es) | ||
JPS63158753U (es) |