JPH0289878U - - Google Patents
Info
- Publication number
- JPH0289878U JPH0289878U JP16953888U JP16953888U JPH0289878U JP H0289878 U JPH0289878 U JP H0289878U JP 16953888 U JP16953888 U JP 16953888U JP 16953888 U JP16953888 U JP 16953888U JP H0289878 U JPH0289878 U JP H0289878U
- Authority
- JP
- Japan
- Prior art keywords
- pads
- pad
- substrate
- wiring pattern
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16953888U JPH0289878U (un) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16953888U JPH0289878U (un) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289878U true JPH0289878U (un) | 1990-07-17 |
Family
ID=31459692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16953888U Pending JPH0289878U (un) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289878U (un) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008004809A (ja) * | 2006-06-23 | 2008-01-10 | Mitsubishi Electric Corp | 実装基板 |
-
1988
- 1988-12-28 JP JP16953888U patent/JPH0289878U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008004809A (ja) * | 2006-06-23 | 2008-01-10 | Mitsubishi Electric Corp | 実装基板 |
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