JPH0289849U - - Google Patents
Info
- Publication number
- JPH0289849U JPH0289849U JP16950788U JP16950788U JPH0289849U JP H0289849 U JPH0289849 U JP H0289849U JP 16950788 U JP16950788 U JP 16950788U JP 16950788 U JP16950788 U JP 16950788U JP H0289849 U JPH0289849 U JP H0289849U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lead frame
- leads
- tips
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16950788U JPH0289849U (fr) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16950788U JPH0289849U (fr) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289849U true JPH0289849U (fr) | 1990-07-17 |
Family
ID=31459631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16950788U Pending JPH0289849U (fr) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289849U (fr) |
-
1988
- 1988-12-28 JP JP16950788U patent/JPH0289849U/ja active Pending