JPH0289844U - - Google Patents

Info

Publication number

JPH0289844U

JPH0289844U JP17053688U JP17053688U JPH0289844U JP H0289844 U JPH0289844 U JP H0289844U JP 17053688 U JP17053688 U JP 17053688U JP 17053688 U JP17053688 U JP 17053688U JP H0289844 U JPH0289844 U JP H0289844U

Authority

JP

Japan

Prior art keywords

semiconductor device

heat dissipation

package

dissipation fin

lead terminal

Prior art date

1988-12-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 4
• 230000017525 heat dissipation Effects 0.000 claims description 3
• 239000000463 material Substances 0.000 claims description 2
• 239000000853 adhesive Substances 0.000 description 2
• 230000001070 adhesive effect Effects 0.000 description 2
• 210000000078 claw Anatomy 0.000 description 1
• 239000000470 constituent Substances 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (1)