JPH0289823U - - Google Patents

Info

Publication number
JPH0289823U
JPH0289823U JP16835488U JP16835488U JPH0289823U JP H0289823 U JPH0289823 U JP H0289823U JP 16835488 U JP16835488 U JP 16835488U JP 16835488 U JP16835488 U JP 16835488U JP H0289823 U JPH0289823 U JP H0289823U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
wafer
disk
indicate
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16835488U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16835488U priority Critical patent/JPH0289823U/ja
Publication of JPH0289823U publication Critical patent/JPH0289823U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例を示す図、第2図は従
来の半導体ウエハを示す図である。 図において、1は半導体ウエハ、3は小孔、を
示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 円板状の半導体ウエハ1の縁部近傍に、該ウエ
    ハの結晶方位を表示するための小径な小孔3を設
    けたことを特徴とする半導体ウエハ。
JP16835488U 1988-12-28 1988-12-28 Pending JPH0289823U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16835488U JPH0289823U (ja) 1988-12-28 1988-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16835488U JPH0289823U (ja) 1988-12-28 1988-12-28

Publications (1)

Publication Number Publication Date
JPH0289823U true JPH0289823U (ja) 1990-07-17

Family

ID=31457461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16835488U Pending JPH0289823U (ja) 1988-12-28 1988-12-28

Country Status (1)

Country Link
JP (1) JPH0289823U (ja)

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