JPH0289815U - - Google Patents
Info
- Publication number
- JPH0289815U JPH0289815U JP1988170601U JP17060188U JPH0289815U JP H0289815 U JPH0289815 U JP H0289815U JP 1988170601 U JP1988170601 U JP 1988170601U JP 17060188 U JP17060188 U JP 17060188U JP H0289815 U JPH0289815 U JP H0289815U
- Authority
- JP
- Japan
- Prior art keywords
- electrode lead
- insulating resin
- resin body
- electronic component
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims 1
- 239000010956 nickel silver Substances 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988170601U JPH0289815U (ru) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988170601U JPH0289815U (ru) | 1988-12-27 | 1988-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289815U true JPH0289815U (ru) | 1990-07-17 |
Family
ID=31461692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988170601U Pending JPH0289815U (ru) | 1988-12-27 | 1988-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289815U (ru) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002025852A (ja) * | 2000-07-07 | 2002-01-25 | Matsushita Electric Ind Co Ltd | 電子部品 |
| JP2007059477A (ja) * | 2005-08-22 | 2007-03-08 | Nichicon Corp | 固体電解コンデンサ |
| JP2009123897A (ja) * | 2007-11-14 | 2009-06-04 | Tdk Corp | セラミック電子部品、セラミック電子部品の製造方法、及びセラミック電子部品の梱包方法 |
| JP2012227214A (ja) * | 2011-04-15 | 2012-11-15 | Taiyo Yuden Co Ltd | チップ状電子部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592369A (ja) * | 1982-06-28 | 1984-01-07 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS6134736B2 (ru) * | 1978-10-30 | 1986-08-09 | Teijin Ltd |
-
1988
- 1988-12-27 JP JP1988170601U patent/JPH0289815U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134736B2 (ru) * | 1978-10-30 | 1986-08-09 | Teijin Ltd | |
| JPS592369A (ja) * | 1982-06-28 | 1984-01-07 | Fujitsu Ltd | 半導体装置の製造方法 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002025852A (ja) * | 2000-07-07 | 2002-01-25 | Matsushita Electric Ind Co Ltd | 電子部品 |
| JP2007059477A (ja) * | 2005-08-22 | 2007-03-08 | Nichicon Corp | 固体電解コンデンサ |
| JP4637682B2 (ja) * | 2005-08-22 | 2011-02-23 | ニチコン株式会社 | 固体電解コンデンサ |
| JP2009123897A (ja) * | 2007-11-14 | 2009-06-04 | Tdk Corp | セラミック電子部品、セラミック電子部品の製造方法、及びセラミック電子部品の梱包方法 |
| JP4670856B2 (ja) * | 2007-11-14 | 2011-04-13 | Ｔｄｋ株式会社 | セラミック電子部品の梱包方法 |
| JP2012227214A (ja) * | 2011-04-15 | 2012-11-15 | Taiyo Yuden Co Ltd | チップ状電子部品 |