JPH0289792U - - Google Patents
Info
- Publication number
- JPH0289792U JPH0289792U JP16855488U JP16855488U JPH0289792U JP H0289792 U JPH0289792 U JP H0289792U JP 16855488 U JP16855488 U JP 16855488U JP 16855488 U JP16855488 U JP 16855488U JP H0289792 U JPH0289792 U JP H0289792U
- Authority
- JP
- Japan
- Prior art keywords
- connecting device
- perspective
- view
- insulating substrate
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 210000000078 claw Anatomy 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
Landscapes
- Connecting Device With Holders (AREA)
- Multi-Conductor Connections (AREA)
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16855488U JPH0289792U (ko) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16855488U JPH0289792U (ko) | 1988-12-27 | 1988-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289792U true JPH0289792U (ko) | 1990-07-17 |
Family
ID=31457834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16855488U Pending JPH0289792U (ko) | 1988-12-27 | 1988-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289792U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018082093A (ja) * | 2016-11-17 | 2018-05-24 | サンコール株式会社 | 半導体素子取付用基板端子板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036658U (ko) * | 1973-07-30 | 1975-04-17 | ||
| JPS6040991B2 (ja) * | 1980-05-19 | 1985-09-13 | 沖電気工業株式会社 | ワイヤドツトヘツド |
-
1988
- 1988-12-27 JP JP16855488U patent/JPH0289792U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036658U (ko) * | 1973-07-30 | 1975-04-17 | ||
| JPS6040991B2 (ja) * | 1980-05-19 | 1985-09-13 | 沖電気工業株式会社 | ワイヤドツトヘツド |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018082093A (ja) * | 2016-11-17 | 2018-05-24 | サンコール株式会社 | 半導体素子取付用基板端子板の製造方法 |