JPH0289698A - Thin-type electronic equipment - Google Patents
Thin-type electronic equipmentInfo
- Publication number
- JPH0289698A JPH0289698A JP63243706A JP24370688A JPH0289698A JP H0289698 A JPH0289698 A JP H0289698A JP 63243706 A JP63243706 A JP 63243706A JP 24370688 A JP24370688 A JP 24370688A JP H0289698 A JPH0289698 A JP H0289698A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- thin electronic
- metal reinforcing
- thin
- reinforcing frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 238000010168 coupling process Methods 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000012212 insulator Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 abstract description 7
- 238000005859 coupling reaction Methods 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002542 deteriorative effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的１
（Ｈ業七の利用分野）
本発明は、電磁変換１ヘランスの２次側要素を内蔵し、
前記電磁変換トランスの１次側要素を備えたカードリー
ダ／ライター手段と゛小部、拮合方式により非接触で情
報伝達を行うＩｃカー１〜等の薄型電子１幾器に関する
。[Detailed description of the invention] [Objective of the invention 1 (Field of application of H industry 7) The present invention has a built-in secondary side element of electromagnetic conversion 1 Herans,
The present invention relates to a thin electronic device such as an IC car 1 which transmits information in a non-contact manner by combining a card reader/writer means with a primary side element of the electromagnetic conversion transformer.
（従来の技術）
最近の電子機器は、軽薄７．Ａ小化の方向に進んでいる
。１列えば、マイクロプロレツ１すとメ七りとを内蔵し
た薄型電子機器（以下、単にＩＣカー］ミという）もざ
らに薄型化か要求されている。ＩＣカードに１、薄型化
の観点より、白身の内部に電源を持つでいない。(Prior Art) Recent electronic devices are lightweight and 7. We are moving in the direction of A downsizing. For example, thin electronic devices (hereinafter simply referred to as IC cars) with built-in microprocessors are also required to be made thinner. 1. In order to make the IC card thinner, it does not have a power source inside its white body.
このため、電磁変換トランス８＋１いた非接触の電磁結
合方式によって、外部から電源を供給する方式がとられ
ている。For this reason, a method is adopted in which power is supplied from the outside using a non-contact electromagnetic coupling method using an electromagnetic conversion transformer 8+1.
また、ＩＣカードの外側のケースは、上述した電磁結合
の特性を悪化させないため、非磁性のプラスチック材か
使用されている。Furthermore, the outer case of the IC card is made of non-magnetic plastic material in order not to deteriorate the above-mentioned electromagnetic coupling characteristics.
（発明が解決しようとする課題）
上記のように、従来の薄型電子別器は、薄型−Ｃあり、
該機器のケースはプラスチック装である。(Problems to be Solved by the Invention) As mentioned above, the conventional thin electronic separate device is thin-C,
The case of the device is plastic packaging.
このため、取扱いによって、咳、別器が曲がり内部部品
が損傷するという問題かある。As a result, handling can cause problems such as coughing, bending of the separate device, and damage to internal parts.
本発明の目的は、電磁結合の特性を悪化せずに曲げ剛ｊ
ノ↓を向上させた薄型電子機器を提供することに市る。The object of the present invention is to reduce bending stiffness without deteriorating the characteristics of electromagnetic coupling.
Our goal is to provide thin electronic devices with improved performance.
［発明の構成１
（課題を解決するための手段）
上記目的を達成するために、本発明は下記の通り構成さ
れている。[Configuration 1 of the Invention (Means for Solving the Problems) In order to achieve the above object, the present invention is configured as follows.
請求項１の（合成は、電源又は信号が、電磁変換トラン
スの１次側要素である少なくとも１絹の１次側コア及び
１次側コイルを内蔵した外部装置がら電磁結合方式によ
り非接触で伝達され、萌記電磁変換ｌヘランスの２次側
要素である少なくとも１組の２次側コア及び２次側コイ
ルを内蔵した板状の薄型電子機器において、該薄型電子
機器の外周に、前記２次側コアの中心軸の周りに閉磁路
を形成しないように開放部を有する金属製補強部材を設
（プたことにある。The synthesis of claim 1 is characterized in that a power source or a signal is transmitted in a non-contact manner by an electromagnetic coupling method to an external device incorporating at least one silk primary core and primary coil, which are primary elements of an electromagnetic conversion transformer. In a plate-shaped thin electronic device incorporating at least one set of a secondary core and a secondary coil, which are secondary elements of the Moeki electromagnetic conversion lance, the secondary A metal reinforcing member having an open portion is provided so as not to form a closed magnetic path around the central axis of the side core.
請求項２の構成は、請求項１記載のａＩｉｌ型電子型孔
子機器て、前記薄型電子機器の周縁を、開放端を有する
金属補強枠で囲い、前記薄型電子機器に該補強枠を固程
させたことにある。According to a second aspect of the invention, in the ail type electronic Confucius device according to claim 1, the periphery of the thin electronic device is surrounded by a metal reinforcing frame having an open end, and the reinforcing frame is fixed to the thin electronic device. That's true.
請求項３の構成は、請求項２記載の博を電子は器にｄ３
いで、前記開放端を絶縁体で辻、情したことにある。The configuration of claim 3 is such that the structure of claim 2 is applied to an electron device by d3.
Then, I connected the open end with an insulator.
請求項４の構成は、請求項１記載の７カ型電子機器にお
いて、前記薄型電子機器の上下向に金属補強板を固着し
、該金属補強板に前記２次側コ」アの位置するモ下位置
（こ穴を設け前記を下面の穴から前記金属補強板の周縁
に向かって少なくと！：）１個のスリブｌへを設りたこ
とにある。According to a fourth aspect of the present invention, in the seven-inch electronic device according to the first aspect, a metal reinforcing plate is fixed to the top and bottom of the thin electronic device, and a motor on which the secondary side core is located is attached to the metal reinforcing plate. The lower position (this hole is provided and the above is provided from the hole on the lower surface toward the periphery of the metal reinforcing plate at least!) to one of the sleeves 1.
（作 用）
この構成（こ基づく本弁明の作用は、下記の通りである
。(Function) The function of this defense based on this structure is as follows.
請求項］の作用は、金属製補強部材を薄型電子は器に設
けることにより曲げ剛性を向上させた点と、前記金属補
強板か開放部により閉じていないため、ワンターンショ
ー１〜（閉磁路形成）を防止づる点にある。The effect of the claim is that the bending rigidity is improved by providing a metal reinforcing member on the thin electronic device, and that the metal reinforcing plate is not closed by the open part, so one-turn show 1 to (forming a closed magnetic path) is achieved. ).
請求項２の作用は、金属製補強部材である金属補強枠を
薄型電子は器の周縁に設け、該薄型電子機器の曲げ剛［
牛を向上さけ、ワンターンショートを防止づる点にある
。The effect of claim 2 is that a metal reinforcing frame, which is a metal reinforcing member, is provided at the periphery of the thin electronic device, thereby reducing the bending stiffness of the thin electronic device.
The purpose is to avoid raising the cow and prevent one-turn shorts.
請求項３の作用（よ、絶縁体て金属補強枠か輪状に連、
情されているので強度か増し、曲げ剛性をより向上させ
た点にある。The effect of claim 3 (the insulator is connected to the metal reinforcing frame in a ring shape,
This is due to the increased strength and improved bending rigidity.
６＾求頂４の作用は、ｉ？ハ“〕電子機器の［二十面に
金属補強板を４２けることにより、前記薄型電子は器の
厚さ方向の曲げ剛性を向上させた点にあり、前記金属補
強板に設けられた穴により２次側コア及び２次側」イル
の電磁結合方式を低下させない点と、スリン１〜により
ワンターンショートを防止した点、ざらに、Ｔｆｔ ’
￥！電子電子内器内部の升熱を敢熱り−る点にある。6^ The action of seeking 4 is i? By installing 42 metal reinforcing plates on the 20 sides of the electronic device, the thin electronic device has improved bending rigidity in the thickness direction of the device, and the holes provided in the metal reinforcing plate In general, Tft'
¥! The point lies in the fact that the heat inside the electronic and electronic components is heated up.
（実施例）
以Ｆ、本発明の実施例を添イ］図面にと４ついて、詳細
に説明する。(Embodiments) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
本発明に用いられる電磁変換ｉ〜ランス（よ第７図に示
すように構成され、１は電磁変換１〜ランス。The electromagnetic conversion lance used in the present invention is constructed as shown in FIG. 7, and 1 is the electromagnetic conversion lance.
２ ａ ４ＪＪ、 １次側ｊ？、２ｂｉ、、ｆ：１次側
」イル、３は当該機器の薄型電子機器であるＩ Ｃカー
ｔ−，３ａは２次側コア、３ｂは２次側コイル、３Ｃは
ケース。2 a 4JJ, primary side j? , 2bi, , f: primary side, 3 is the thin electronic device of the device, IC card t-, 3a is the secondary side core, 3b is the secondary side coil, and 3C is the case.
Ｇ【ま前記１次側コア２ａのギ（・ツブである。G [This is the gear of the primary core 2a.
１次側コア２ａ及ｆｆ１次側］−ｉ’ ル２ ｂ Ｉ；
ｔ、外部装置に設けられている。該外部装置は、＋Ｖｉ
記ＩＣカード３に供給する電源を有している。２次ｆｌ
！！Ｉコア３ａ及び２次側コイル３ｂは、前記ＩＣカー
１へ３に内蔵され、第８図に示す外観形状と７よってい
る。Primary side core 2a and ff primary side]-i' le 2 b I;
t, provided in an external device. The external device is +Vi
It has a power supply for supplying the IC card 3. secondary fl
! ! The I core 3a and the secondary coil 3b are built into the IC car 1 and have an external shape 7 as shown in FIG.
電磁変換１〜ランスの作用について説明づると、Ｉ Ｃ
カー１〜３をキャップＧに１Φ人し、２次側］ア３ａが
１次側ｊ７２ａの開放端部に近接した位置まで入れる。Electromagnetic conversion 1 - To explain the action of a lance, I C
Cars 1 to 3 are inserted into the cap G by 1Φ until the secondary side A 3a is close to the open end of the primary side J72a.
すると、１次側コア２ａ、１次側コイル２ｂ、２次側＝
］ア３ａ、２次側コイル３ｂか偶成する電磁変換１〜ラ
ンス１により、前記外部装置内の電源は非接触の電磁結
合方式によりＩＣカード３に供給される３゜
ＩＣカード３は最近の電子機器の軽薄類小化の傾向に伴
い、さらに薄型化か要求されている。また、前記”＋’
ｉ ｐツブＧは前述の電磁結合の効率向上のためにも小
さい方が望ましい。このため、このギトツブＧに挿入さ
れるＩＣカード３もａ型化が必四となる。Then, primary core 2a, primary coil 2b, secondary =
]A 3a, the secondary coil 3b and the electromagnetic transducer 1 to the lance 1, which are connected together, supply the power inside the external device to the IC card 3 by a non-contact electromagnetic coupling method. With the trend toward lighter, thinner, and smaller equipment, there is a demand for thinner devices. In addition, the above “+”
It is desirable that the i p tube G be smaller in order to improve the efficiency of the electromagnetic coupling described above. For this reason, the IC card 3 inserted into the socket G must also be of type A.
ざらに、ＩＣカート３のケース３Ｃは、上）小した電ｉ
ａ結合の持重を悪化さぜないため、非磁性のプラスチッ
クが使用されている。In general, the case 3C of the IC cart 3 is
Non-magnetic plastic is used to avoid deteriorating the weight of the a-bond.
第１図（ま、本発明の第１実施例をホするもので、４（
よｊ′ルミ等の軽量金属からなる金属補強枠。FIG. 1 (well, this shows the first embodiment of the present invention, 4 (
Metal reinforcing frame made of lightweight metal such as Yoj'lumi.
４Ｃ〕は０．１〜教ｍ程度のギャップのある開放端。4C] is an open end with a gap of about 0.1 to 100 m.
１１ｂは絶縁体である。金属補強枠４は、接着剤でケー
ス３Ｃの周縁に接着され、該補強枠４の開放端４ａは、
１色縁体４ｂによって連結されている。11b is an insulator. The metal reinforcing frame 4 is bonded to the periphery of the case 3C with adhesive, and the open end 4a of the reinforcing frame 4 is
They are connected by a one-color border 4b.
この金属補強枠４は絶縁体／１ｂにより磁気的に開放さ
れ−でいるので、ワンターンシ−１−１・を防け、当該
薄型電子機器の曲げ田型を向上きせることかてさ′る。Since the metal reinforcing frame 4 is magnetically opened by the insulator /1b, it is possible to prevent one-turn seams and improve the bending shape of the thin electronic device.
ワンターンショートとは、前ｊボしたように閉磁路形成
のことで、ワンターンシー１−１〜が生じると、磁束が
この閉磁路内へ流れる！−め、電Ｒｋ１情合効率が低下
り−る。このためワンターンショートは防ぐ必要がある
。A one-turn short is the formation of a closed magnetic path as mentioned above, and when a one-turn short occurs, magnetic flux flows into this closed magnetic path! -Meanwhile, the efficiency of electric Rk1 decreases. For this reason, it is necessary to prevent one-turn short circuits.
一方、第１実施例の他の変形例として、前記開放端７１
． ａ Ｇよ、第２図（ａ）また同図（ｂ ） （Ｄ、
Ｊ：、つな形状とすると、聞ＩＪＩｌ端４ａの接着強度
か増す。On the other hand, as another modification of the first embodiment, the open end 71
．． a G, Figure 2 (a) and Figure 2 (b) (D,
J: If it is made into a straight shape, the adhesive strength of the IJIl end 4a will increase.
同図（ａ）の開放端形状は、クランク状で、同図（ｂ）
の間１５’ｉ端形状は、ハラ１〜型形状で、共に絶縁体
／ｌＯｂ、４１ｂ（第２図の斜１ｊｉｊ部）と金属補強
枠４との接看面偵が増すので該接着部の接着強度か増す
。The open end shape in figure (a) is crank-shaped, and figure (b)
The end shape of the gap 15'i is a shell 1-type shape, and the contact surface between the insulator/lOb, 41b (diagonal 1jij part in FIG. 2) and the metal reinforcing frame 4 is increased, so the adhesive part is Increases adhesive strength.
更に、第１実施例の他の変形（シ１１として、ｕ’：
３図（ａ）、同図（ｂ）のように金属補強枠４０を口字
状としたり、第４図（ａ）、同図（ｂ）のように金属補
強枠４１．４２を部分的に周辺の２次側二１ア３ａに近
い部分（こ設ｃ−ｔｒも、当該薄型電子機器の持に２次
側」ア３ａの周）２２の曲げ強度を向上できる。Furthermore, another modification of the first embodiment (as 11, u':
The metal reinforcing frame 40 may be made into a mouth shape as shown in FIGS. 3(a) and 4(b), or the metal reinforcing frames 41 and 42 may be partially shaped as shown in FIGS. It is possible to improve the bending strength of the peripheral portion 22 near the secondary side 21a 3a (this arrangement c-tr is also the periphery of the secondary side 3a of the thin electronic device).
第５図（ａ）、同図（ｂ）は、本発明の第２実／Ｉｆ！
！ １９１ｊ ／Ｔ−示す−らので、２十［１の２次側
要素でおる電話；伝達用の２次側コア３ａ及び２次側コ
イル３ｂ。FIGS. 5(a) and 5(b) show the second embodiment/If! of the present invention.
! 191j /T-shows-etc. 20[1] secondary element telephone; secondary core 3a and secondary coil 3b for transmission.
並びに、イ菖弓伝ｊｔ用の２次側＝］ア３０８及び２次
１則−」イル３０ｂ８イ・Ｊしている。Also, the secondary side for Ishokyuden jt = ] A 308 and the second order 1 rule - I 30 b 8 I J.
５はアルミ等の軽量金属から４にる金属補強、仮。5 is metal reinforcement from lightweight metals such as aluminum to 4.
５ａは穴、５ｂはスミノットである。前記金属補強板５
はＩＣカード３のケース３Ｇの上下面に接右−剤にて接
１され、ＩＣカード３の板厚方向の曲げ１寸［を向上ざ
ｌでいる。穴５ａは、２次側コア３ａ、３０ａの真上及
びＣ１下にδ）けられ、電磁結合状（忠て゛の電磁結合
“１−４１牛を低下させないようにしでいる。また、ス
リブｊ−５ｂによりワンターンショートを防いでいる。5a is a hole, and 5b is a sminnot. The metal reinforcing plate 5
are attached to the upper and lower surfaces of the case 3G of the IC card 3 using a bonding agent, and the IC card 3 is bent by 1 dimension in the thickness direction of the IC card 3. The holes 5a are formed directly above the secondary cores 3a and 30a and below C1 to avoid lowering the electromagnetic coupling. 5b prevents one-turn short circuit.
そして、前記金属補強板５は前記ケース３Ｃの表裏両［
ｍの広い範囲を被っているので、該ケース３Ｃ内部の電
源回路及び２次側コア３ａ、３０ａからの発熱を該金属
補強板５により敢熱し、内部部品を保Ａづる動さかある
。The metal reinforcing plate 5 is attached to both the front and back sides of the case 3C.
Since the metal reinforcing plate 5 covers a wide range of m, heat generated from the power supply circuit and secondary cores 3a, 30a inside the case 3C is heated up by the metal reinforcing plate 5, thereby protecting the internal parts.
５ｊ二だ、第２実施例の変形例として、第６図（ａ）、
同図（ｂ）に示すように、ス１ノッ（〜５ｂは、電源法
）ヱ用の２次側コア３ａ用として上下１ｎ１に各々］個
所設け、信号伝達用の２次側」ツノ３０ａ用とし′Ｃ上
下面に各々１個所説Ｃプでもワンターンシー］−１〜は
防げる。5j2. As a modification of the second embodiment, Fig. 6(a),
As shown in the same figure (b), two holes are provided on the upper and lower sides of the secondary core 3a for the secondary side core 3a for the secondary side core 3a for signal transmission, and the secondary side horn 30a for signal transmission One turn sea] -1 can be prevented even if there is one C on each of the upper and lower surfaces.
以上述べた実施例は、史に要旨を変力じ４「い範囲８種
々に変形実施か可能−Ｃある。The embodiments described above can be modified and implemented in various ways without changing the gist.
例えば、金属補強板及び金属補強枠は、前記ケース３Ｇ
の非磁性プラスチックよりｂ引張強ざの犬さいプラスチ
ックとしてしよい。For example, the metal reinforcing plate and the metal reinforcing frame are the case 3G.
It has better tensile strength than non-magnetic plastics.
［発明の効果］
本発明は、以−ト説明したように１１・１成されＣいる
のて、次に記載するＺＪ果を秦す−る。[Effects of the Invention] The present invention has been completed in 11.1 as described above, and has the ZJ effect described below.
晶求頂１の薄型電子機器において（Ｊｌ、金属製補強部
子オか該薄４１“（電子機器に）Ｂ加されているので、
該漕ハリ電子機器の曲け°剛性か向上すると共に、ワン
ターンショートを防げる。In the thin electronic device (Jl, metal reinforcing part O) or the thin 41" B (to the electronic device) is added,
The bending rigidity of the electronic device is improved, and one-turn short circuits can be prevented.
請求項２の薄型電子機器においては、金属補強枠か該薄
型電子機器の周縁に１部開放端を有して、ＩＱ ＵＪら
れているので、ワンターンショー１〜か防げる。また該
薄型電子機器の板厚を増さずに該薄型電子ｂ！Ｚの曲げ
剛性が向上する。In the thin electronic device according to the second aspect of the present invention, since the metal reinforcing frame has a partially open end at the periphery of the thin electronic device to provide IQ UJ, one-turn shows can be prevented. Moreover, the thin electronic b! without increasing the board thickness of the thin electronic device! The bending rigidity of Z is improved.
請求項３の薄型電子機器においては、絶縁体により金属
補強枠の開放端が連結されているので、曲げ測ｉ牛か向
トする。In the thin electronic device according to the third aspect, since the open ends of the metal reinforcing frame are connected by the insulator, bending is not possible.
請求項４の薄型電子機器においては、上下面の金属補強
板により、該薄型電子は器の厚さ方向の曲げ剛性か向上
する。ざらに、前記金属補強板に設けられた穴により２
次側コア及び２次側コイルの電磁結合の１ｚ１１生を低
下させす、スリンｌ〜によりワンターンショートも防げ
る。また、該薄形電子別器内部からの発熱を前記金属補
強板より放熱することかできる。In the thin electronic device according to the fourth aspect, the bending rigidity of the thin electronic device in the thickness direction of the device is improved by the metal reinforcing plates on the upper and lower surfaces. Roughly, the hole provided in the metal reinforcing plate allows 2
One-turn short circuit can also be prevented by Surin l~, which reduces the electromagnetic coupling between the secondary core and the secondary coil. Further, heat generated from inside the thin electronic separate device can be radiated through the metal reinforcing plate.
第１図は、本発明の第１実施例を示す図で、同図（ａ）
は平面図、同図（ｂ）は、側ｒｌ′ｉｉ図である。第２
図（ａ）、同図（ｂ）は、第１図の要部の他の実施例を
示す要部側面図である。第３図。
第４図は、第１実施例の変形例を示す図て゛、第３図（
ａ）、第４図（ａ）は平面図、第３図（ｂ）。
第４図（ｂ）は側面図である。第５図は、第２実施例を
示す図で、同図（ａ）は平面図、同図（ｂ）は、側面図
である。第６図は、第２実施例の変形例を示す図で、同
図（ａ）は平面図、Ｉｉ’ｉ１図（ｂ）は側面図である
。第７図は、電磁変換（ヘランス断面図、第８図は、２
次側コア及び２次側＝１イルの↑ｚ１祝図て必る。
］・・・電Ｉ４１１〜ランス、２ａ・・・１次側コア、
２ｂ・・・１次側コイル、３ａ・・・２次側二１７．３
ｂ・・・２次側コイル、３Ｃ・・・ケース、３・・・薄
型電子機器、
４．４０，４１．４２・・・金属補強枠、４ａ・・・開
放端、
４ｂ、４０ｂ、４１ｂ・・・絶縁体、
５・・・金属補強板、５ａ・・・穴
５ｂ・・・スリン１へ。FIG. 1 is a diagram showing a first embodiment of the present invention, and FIG.
is a plan view, and FIG. 3(b) is a side rl'ii view. Second
Figures (a) and (b) are side views of main parts showing other embodiments of the main parts of Fig. 1. Figure 3. FIG. 4 shows a modification of the first embodiment.
a), FIG. 4(a) is a plan view, and FIG. 3(b). FIG. 4(b) is a side view. FIG. 5 is a diagram showing the second embodiment, in which FIG. 5(a) is a plan view and FIG. 5(b) is a side view. FIG. 6 is a diagram showing a modification of the second embodiment, in which FIG. 6(a) is a plan view and FIG. 6(b) is a side view. Figure 7 shows the electromagnetic conversion (Herans sectional view, Figure 8 shows the 2
Next core and secondary side = 1 ile ↑z1 congratulation map is required. ]... Electric I411 ~ Lance, 2a... Primary side core,
2b...Primary side coil, 3a...Secondary side 217.3
b... Secondary coil, 3C... Case, 3... Thin electronic device, 4.40, 41.42... Metal reinforcing frame, 4a... Open end, 4b, 40b, 41b. ...Insulator, 5...Metal reinforcing plate, 5a...Hole 5b...To Surin 1.
Claims (4)
である少なくとも１組の１次側コア及び１次側コイルを
内蔵した外部装置から電磁結合方式により非接触で伝達
され、前記電磁変換トランスの２次側要素である少なく
とも１組の２次側コア及び２次側コイルを内蔵した板状
の薄型電子機器において、該薄型電子機器の外周に前記
２次側コアの中心軸の周りに閉磁路を形成しないように
開放部を有する金属製補強部材を設けたことを特徴とす
る薄型電子機器。(1) Power or signals are transmitted in a non-contact manner by an electromagnetic coupling method from an external device containing at least one set of primary cores and primary coils, which are primary elements of an electromagnetic conversion transformer, and the electromagnetic conversion In a plate-shaped thin electronic device that incorporates at least one set of a secondary core and a secondary coil that are secondary elements of a transformer, the thin electronic device has an outer periphery around the central axis of the secondary core. A thin electronic device comprising a metal reinforcing member having an open portion so as not to form a closed magnetic path.
補強枠で囲い、前記薄型電子機器に該補強枠を固着させ
た請求項１記載の薄型電子機器。(2) The thin electronic device according to claim 1, wherein a peripheral edge of the thin electronic device is surrounded by a metal reinforcing frame having an open end, and the reinforcing frame is fixed to the thin electronic device.
型電子機器。(3) The thin electronic device according to claim 2, wherein the open ends are connected with an insulator.
、該金属補強板に前記２次側コアの位置する上下位置に
穴を設け前記上下面の穴から前記金属補強板の周縁に向
かって少なくとも１個のスリットを設けた請求項１記載
の薄型電子機器。(4) A metal reinforcing plate is fixed to the upper and lower surfaces of the thin electronic device, and holes are provided in the metal reinforcing plate at the upper and lower positions where the secondary core is located, and a peripheral edge of the metal reinforcing plate is formed from the hole in the upper and lower surfaces. 2. The thin electronic device according to claim 1, further comprising at least one slit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63243706A JPH0289698A (en) | 1988-09-27 | 1988-09-27 | Thin-type electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63243706A JPH0289698A (en) | 1988-09-27 | 1988-09-27 | Thin-type electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289698A true JPH0289698A (en) | 1990-03-29 |
Family
ID=17107775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63243706A Pending JPH0289698A (en) | 1988-09-27 | 1988-09-27 | Thin-type electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289698A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496385U (en) * | 1991-01-29 | 1992-08-20 | ||
| JPH04342912A (en) * | 1991-05-20 | 1992-11-30 | Mitsubishi Electric Corp | Circuit breaker |
| JPH0561900U (en) * | 1991-09-06 | 1993-08-13 | 株式会社トキメック | Contactless data carrier protector |
| JP2009144471A (en) * | 2007-12-17 | 2009-07-02 | Tokai Rika Co Ltd | Code irregularity collation type key system |
| JP2016509445A (en) * | 2013-02-22 | 2016-03-24 | ノキア テクノロジーズ オサケユイチア | Apparatus and method for wireless coupling |
| JP2023511671A (en) * | 2020-01-24 | 2023-03-22 | コンポセキュア，リミティド ライアビリティ カンパニー | Metal, ceramic or ceramic coated transaction card with window or window pattern and optionally backlight |
| WO2023210784A1 (en) * | 2022-04-28 | 2023-11-02 | 株式会社トーキン | Antenna device |
| US12079681B2 (en) | 2016-07-27 | 2024-09-03 | Composecure, Llc | RFID device |
| US12086669B2 (en) | 2017-10-18 | 2024-09-10 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US12093772B2 (en) | 2018-01-30 | 2024-09-17 | Composecure, Llc | DI capacitive embedded metal card |
-
1988
- 1988-09-27 JP JP63243706A patent/JPH0289698A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0496385U (en) * | 1991-01-29 | 1992-08-20 | ||
| JPH04342912A (en) * | 1991-05-20 | 1992-11-30 | Mitsubishi Electric Corp | Circuit breaker |
| JPH0561900U (en) * | 1991-09-06 | 1993-08-13 | 株式会社トキメック | Contactless data carrier protector |
| JP2009144471A (en) * | 2007-12-17 | 2009-07-02 | Tokai Rika Co Ltd | Code irregularity collation type key system |
| JP2016509445A (en) * | 2013-02-22 | 2016-03-24 | ノキア テクノロジーズ オサケユイチア | Apparatus and method for wireless coupling |
| US10211537B2 (en) | 2013-02-22 | 2019-02-19 | Nokia Technologies Oy | Apparatus and methods for wireless coupling |
| US12079681B2 (en) | 2016-07-27 | 2024-09-03 | Composecure, Llc | RFID device |
| US12086669B2 (en) | 2017-10-18 | 2024-09-10 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
| US12093772B2 (en) | 2018-01-30 | 2024-09-17 | Composecure, Llc | DI capacitive embedded metal card |
| JP2023511671A (en) * | 2020-01-24 | 2023-03-22 | コンポセキュア，リミティド ライアビリティ カンパニー | Metal, ceramic or ceramic coated transaction card with window or window pattern and optionally backlight |
| WO2023210784A1 (en) * | 2022-04-28 | 2023-11-02 | 株式会社トーキン | Antenna device |
| JP2023164235A (en) * | 2022-04-28 | 2023-11-10 | 株式会社トーキン | antenna device |
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