JPH0287811A - Production of piezoelectric parts - Google Patents
Production of piezoelectric partsInfo
- Publication number
- JPH0287811A JPH0287811A JP24013988A JP24013988A JPH0287811A JP H0287811 A JPH0287811 A JP H0287811A JP 24013988 A JP24013988 A JP 24013988A JP 24013988 A JP24013988 A JP 24013988A JP H0287811 A JPH0287811 A JP H0287811A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- exterior resin
- piezoelectric
- terminals
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims abstract description 89
- 239000011347 resin Substances 0.000 claims abstract description 89
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 238000000465 moulding Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 235000019809 paraffin wax Nutrition 0.000 description 1
- 230000005298 paramagnetic effect Effects 0.000 description 1
- 235000019271 petrolatum Nutrition 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は圧電部品の製造方法に関し、より詳細には、エ
ネルギー閉じ込め型圧電共振子を用いた圧電フィルタな
どの圧電部品を製造する上で好適な圧電部品の製造方法
に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a piezoelectric component, and more specifically, a method suitable for manufacturing a piezoelectric component such as a piezoelectric filter using an energy trap type piezoelectric resonator. The present invention relates to a method of manufacturing a piezoelectric component.
［従来の技術］
従来、種々のパッケージ形状を有する圧電部品、例えば
、フラットパックタイプのパッケージ形状などを有する
圧電部品が汎用されている。上記パッケージ形状を有す
る圧電部品は、通常、圧電素子と端子とで構成されてお
り、圧電素子は、圧電基板と、共振子電極部と、該電極
部より延る外部接続用電極とを有し、該外部接続用電極
には端子が接続されている。そして、圧電素子を外装樹
脂で被覆し、成形加工することにより圧電部品が製造さ
れている。より詳細には、第２図（Ａ）に示すように、
圧電部品の製造に際しては、作業性を高めるため、平板
状の端子（２４）（２６）が用いられている。該端子Ｔ
２４０２６）は、半田（２７）により、圧電基板（２１
）の一方の面に形成された共振子電極部（２２）から延
びる外部接続用電極（２３）と、圧電基板（２１）の他
方の面に形成されたアース電極部（２５）とに、それぞ
れ接続されている。上記構成からなる圧電素子（２８）
の共振子＠極部（２２）とその周辺部にワックス（２９
）を塗布し、端子（２４０２６）部分を除いて樹脂溶液
にディッピングし、第２図（Ｂ）に示されるように、半
硬化状態で軟化可能な外装樹脂（３０ａ）で被覆する０
次いで、第２図（Ｃ）に示されるように、上記外装樹脂
（３０ａ）の対向面を平行に成形加工し、外装樹脂（３
０ａ）を加熱硬化させ、所定の形状に成形された外装樹
脂層（３０ｂ）を形成する。その際、前記ワックス（２
９）を加熱硬化と共に外装樹脂（３０ａ）に吸収させ、
振動空間（３１）を形成する。[Prior Art] Conventionally, piezoelectric components having various package shapes, for example, piezoelectric components having a flat pack type package shape, have been widely used. A piezoelectric component having the above package shape is usually composed of a piezoelectric element and a terminal, and the piezoelectric element has a piezoelectric substrate, a resonator electrode part, and an external connection electrode extending from the electrode part. , a terminal is connected to the external connection electrode. A piezoelectric component is manufactured by covering the piezoelectric element with an exterior resin and molding the piezoelectric element. More specifically, as shown in FIG. 2(A),
In manufacturing piezoelectric components, flat terminals (24) and (26) are used to improve workability. The terminal T
24026) is a piezoelectric substrate (21) using solder (27).
) and an external connection electrode (23) extending from the resonator electrode part (22) formed on one surface of the piezoelectric substrate (21), and a ground electrode part (25) formed on the other surface of the piezoelectric substrate (21), respectively. It is connected. Piezoelectric element (28) having the above configuration
Wax (29) is placed on the resonator @ pole part (22) and its surrounding part.
), then dip the terminal (24026) except the part in a resin solution, and cover it with a semi-cured and softenable exterior resin (30a) as shown in FIG. 2(B).
Next, as shown in FIG. 2(C), the facing surfaces of the exterior resin (30a) are molded to be parallel to each other, and the exterior resin (30a) is molded in parallel.
0a) is heat-cured to form an exterior resin layer (30b) molded into a predetermined shape. At that time, the wax (2
9) is heated and cured and absorbed into the exterior resin (30a),
A vibration space (31) is formed.
そして、表面実装可能な圧電部品とするため、前記端子
（２４）（２６）の端部を所定の屈曲形状に成形してい
る。In order to make the piezoelectric component surface-mountable, the ends of the terminals (24) and (26) are formed into a predetermined bent shape.
上記のようにして製造された圧電部品の実装は、一般に
、第３図に示されるように、回路基板（３２）の導体パ
ターン（３３）と端子（２４）（２６）端部とを半田（
３４）などで接続することにより行なわれるので、上記
端子（２４）（２６）の成形加工に際しては、前記端子
（２４０２６）の端部底面を外装樹脂層（３０ｂ）の底
面と略同−平面上に位置させ、インライン性を確保でき
るように成形加工する必要がある。As shown in FIG. 3, the piezoelectric components manufactured as described above are generally mounted by soldering (
34), etc., so when molding the terminals (24) and (26), the bottom surface of the end of the terminal (24026) should be placed approximately on the same plane as the bottom surface of the exterior resin layer (30b). It is necessary to mold the material so that it can be positioned in the same direction and ensure in-line properties.
［発明が解決しようとする課題］
しかしながら、上記の製造方法によると、加熱硬化によ
り前記外装樹脂層（３０ｂ）を形成した後、平板状端子
（２４０２６）を所定形状に成形加工するため、例えば
、外装樹脂層（３０ｂ）の底面と、回路基板（３２）上
の導体パターン（３３）に平面付けされる端子（２４）
（２６）の端部底面とが略同−平面上に位置するとは限
らず、端子＋２４）（２６）の端部底面の折曲位置がバ
ラツキ、インライン性を確保することが困難である。従
って、回路基板（３２）の導体パターン（３３）上に上
記端子（２４Ｎ２６）の端部底面を載置しても、導体パ
ターン（３３）と端子（２４）（２Ｂ）の端部底面との
間や回路基板（３２）と外装樹脂層（３０ｂ）との間に
間隙部が生じるため、回路基板（３２）への表面実装性
および信頼性を低下させるという問題がある。[Problems to be Solved by the Invention] However, according to the above manufacturing method, after forming the exterior resin layer (30b) by heat curing, the flat terminal (24026) is molded into a predetermined shape. Terminals (24) flatly attached to the bottom of the exterior resin layer (30b) and the conductor pattern (33) on the circuit board (32)
The bottom surface of the end portion of terminal (26) is not necessarily located on substantially the same plane, and the bending position of the bottom surface of the end portion of terminal +24) (26) varies, making it difficult to ensure in-line property. Therefore, even if the end bottom surface of the terminal (24N26) is placed on the conductor pattern (33) of the circuit board (32), the conductor pattern (33) and the end bottom surface of the terminal (24) (2B) are Since a gap is formed between the circuit board (32) and the exterior resin layer (30b), there is a problem that the surface mountability and reliability of the circuit board (32) are deteriorated.
また樹脂成形工程と端子成形工程とを必要とするため、
工程数が多く経済的でないだけでなく、外装樹脂層（３
０ｂ）を形成した後、平板状の端子（２４）（２６）を
屈曲形状に成形加工するため、外装樹脂層（３０ｂ）が
、その後の端子（２４）（２６）の成形加工により破損
する恐れがある。Also, since it requires a resin molding process and a terminal molding process,
Not only is it uneconomical due to the large number of steps, but also the outer resin layer (3
0b), the flat terminals (24) and (26) are molded into a bent shape, so there is a risk that the exterior resin layer (30b) will be damaged by the subsequent molding of the terminals (24) and (26). There is.
本発明は、上記の点に鑑みてなされたものであり、加工
方法を簡略化し、表面実装性および信頼性に優れると共
に、安価で外装樹脂層の破損などを防止しうる圧電部品
の製造方法を提供することを目的とする。The present invention has been made in view of the above points, and provides a method for manufacturing a piezoelectric component that simplifies the processing method, has excellent surface mountability and reliability, is inexpensive, and can prevent damage to the exterior resin layer. The purpose is to provide.
［課題を解決するための手段］
本発明は、予め所定形状に成形された端子を圧電素子に
取付け、外装樹脂で被覆した後、該外装樹脂を成形する
圧電部品の製造方法により、上記課題を解決するもので
ある。[Means for Solving the Problems] The present invention solves the above problems by using a piezoelectric component manufacturing method in which a terminal previously formed into a predetermined shape is attached to a piezoelectric element, coated with an exterior resin, and then the exterior resin is molded. It is something to be solved.
［作 用］
上記構成の本発明によれば、予め所定形状に成形された
端子を圧電素子に取付け、外装樹脂で被覆した後、該外
装樹脂を成形するので、外装樹脂の成形加工時に、端子
の端部底面を、成形加工された外装樹脂層の底面と略同
−平面上に位置させることができ、端子の端部底面と外
装樹脂層の底面とのインライン性を確保できる。また外
装樹脂層を形成した後、端子を成形加工することなく、
予め所定形状に成形された端子を用いるので、端子の成
形加工が不要であるだけでなく、外装、樹脂層を破損す
ることがない。[Function] According to the present invention having the above-mentioned configuration, a terminal formed in a predetermined shape is attached to a piezoelectric element, and after being covered with an exterior resin, the exterior resin is molded. The bottom surface of the end portion of the terminal can be positioned substantially on the same plane as the bottom surface of the molded exterior resin layer, and in-line property between the bottom surface of the end portion of the terminal and the bottom surface of the exterior resin layer can be ensured. In addition, after forming the exterior resin layer, there is no need to mold the terminals.
Since the terminals are pre-formed into a predetermined shape, not only is there no need to mold the terminals, but there is no damage to the exterior or resin layer.
［実施例］
以下に、添付図面に基づいて本発明の一実施例を説明す
る。[Example] An example of the present invention will be described below based on the accompanying drawings.
第１図は、本発明の圧電部品の製造方法を示す一工程図
であり、本発明は、所定形状に予め成形加工された端子
を圧電素子に取付ける端子取付工程（＾）と、外装樹脂
で被覆する被覆工程（Ｂ）と、該樹脂を成形加工する樹
脂成形工程（Ｃ）とを含んでいる。なお、この例では、
圧電部品として圧電フィルタが用いられている。FIG. 1 is a process diagram showing a method for manufacturing a piezoelectric component according to the present invention. The method includes a coating step (B) of coating, and a resin molding step (C) of molding the resin. Note that in this example,
A piezoelectric filter is used as a piezoelectric component.
上記端子取付工程（Ａ）で用いられる圧電素子（１）は
、圧電基板（２）の一方の面に形成された共振子電極部
（３）と、この共振子電極部（３）から延設された外部
接続用電極（４）と、圧電基板（２）の他方の面に形成
されたアース電極部（５）とを有しており、上記外部接
続用電極（４）およびアース電極部（５）に、それぞれ
予め所定形状に成形加工された端子＋６１ （７１を導
電性ペーストやハンダ（８）などにより接続する。なお
、この例では、上記端子（６）（刀の端部はＬ字状に成
形加工されている。The piezoelectric element (1) used in the terminal attachment step (A) includes a resonator electrode part (3) formed on one surface of the piezoelectric substrate (2) and a resonator electrode part (3) extending from the resonator electrode part (3). The external connection electrode (4) and the ground electrode part (5) are formed on the other surface of the piezoelectric substrate (2). 5), the terminals +61 (71), each of which has been molded into a predetermined shape, are connected using conductive paste, solder (8), etc. In this example, the terminals (6) (the edge of the sword is It is molded into a shape.
また上記被覆工程（Ｂ）では、振動空間を確保するため
、共振子電極部（３）とその周辺部を振動空間形成用材
料（９）で被覆した後、圧電素子（１）のうち端子（６
）（１部を除き外装樹脂（１０ａ）で被覆する。In addition, in the covering step (B), in order to secure a vibration space, after covering the resonator electrode part (3) and its surrounding area with the vibration space forming material (9), the terminal ( 6
) (All but one part are covered with exterior resin (10a).
振動空間形成用材料（９）と外装樹脂（１０ａ）の種類
および量は、両者の特性に応じて適宜選択され、共振子
電極部（３）と樹脂成形工程（Ｃ）で形成された外装樹
脂層（１０ｂ）との間に振動空間（１１）を形成しうる
材料であればいずれも使用できる。上記振動空間形成用
材料（９）としては、例えば、ポリエチレン、ポリプロ
ピレン、パラフィンワックス、カルナバワックス、マイ
クロクリスタリンワックスなどの合成または天然ワック
スが例示される。このような振動空間形成用材料（９）
は、常温で固体ないし半固体であり、加熱により容易に
軟化し、比教的低温で溶融する特性を有している。また
外装樹脂（１０ａ）としては、ポリエチレン、ポリプロ
ピレン、ポリエステル、アクリル樹脂、スチレン系樹脂
、ポリカーボネートなどの熱可塑性樹脂、フェノール樹
脂、エポキシ樹脂、不飽和ポリエステル、ジアリルフタ
レート樹脂などの熱硬化性樹脂など、種々の樹脂が使用
できる。The types and amounts of the vibration space forming material (9) and the exterior resin (10a) are appropriately selected depending on the characteristics of both, and the resonator electrode part (3) and the exterior resin formed in the resin molding process (C) are Any material that can form a vibration space (11) between the layer (10b) and the layer (10b) can be used. Examples of the vibration space forming material (9) include synthetic or natural waxes such as polyethylene, polypropylene, paraffin wax, carnauba wax, and microcrystalline wax. Such vibration space forming material (9)
is solid or semi-solid at room temperature, easily softens when heated, and has the property of melting at relatively low temperatures. Examples of the exterior resin (10a) include thermoplastic resins such as polyethylene, polypropylene, polyester, acrylic resin, styrene resin, and polycarbonate, thermosetting resins such as phenol resin, epoxy resin, unsaturated polyester, diallyl phthalate resin, etc. Various resins can be used.
なお、上記振動空間形成用材ｆｌ［９１は、樹脂成形工
程（Ｃ）またはその後の加熱に伴い上記外装樹脂（１０
ａ）に吸収され、共振子電極部（３）と外装樹脂層（１
０ｂ）との間に＠動空間（１１）が形成される。なお、
この振動空間（１１）の層は、適宜の大きさに形成する
ことができるが、通常、数ミクロンあれば十分である。In addition, the vibration space forming material fl[91 is used in the resin molding process (C) or the subsequent heating process to form the exterior resin (10
a), and the resonator electrode part (3) and the exterior resin layer (1
0b), a @ moving space (11) is formed. In addition,
The layer of this vibration space (11) can be formed to have an appropriate size, but normally a few microns is sufficient.
また振動空間形成用材料（９）による被覆は、上記振動
空間形成用材料（９）の滴下、印刷、塗布などの種々の
手段で行なうことができ、外装樹脂（１０ａ）による被
覆は、樹脂溶液へのディッピング、塗布などの塗布手段
の他、モールド成形などの成形手段により行なってもよ
い、なお、外装樹脂（１０ａ）として熱可塑性樹脂を用
い、モールド成形により外装樹脂（１０ａ）で圧電素子
（１）を、被覆する場合、前記樹脂成形工程（Ｃ）は必
ずしも必要ではなく、上記外装樹脂（１０ａ）による被
覆工程（８）と樹脂成形工程（Ｃ）とを同時に行なって
もよい。Further, coating with the vibration space forming material (9) can be performed by various means such as dropping, printing, or coating the vibration space forming material (9), and coating with the exterior resin (10a) can be performed using a resin solution. In addition to application methods such as dipping and coating, the method may also be performed by forming methods such as molding. Note that using a thermoplastic resin as the exterior resin (10a), the piezoelectric element ( When covering 1), the resin molding step (C) is not necessarily necessary, and the covering step (8) with the exterior resin (10a) and the resin molding step (C) may be performed simultaneously.
上記の圧電素子（１）を被覆する外装樹脂（１０ａ）は
、樹脂成形工程（Ｃ）において所定の形状に成形するた
め、少なくとも軟化可能な状態であればよく、熱硬化性
樹脂にあっては成形可能な半硬化状態であればよい、ま
た外装樹脂（１０ａ）の被覆量は樹脂成形工程（Ｃ）に
おいて端子（６）（刀の端部底面と外装樹脂層（ｉｏｂ
）の底面とが同一平面上に位置させ、インライン性を確
保するのに十分な量であればよく、通常、外装樹脂（１
０ａ）の厚みが端子（６）（７１の端部底面よりも厚み
方向に大きくなるように被覆される。Since the exterior resin (10a) that covers the piezoelectric element (1) is molded into a predetermined shape in the resin molding step (C), it is sufficient that it is at least in a softenable state, and that it is not a thermosetting resin. The coating amount of the exterior resin (10a) is determined in the resin molding step (C) as long as it is in a semi-cured state that can be molded.
) is positioned on the same plane as the bottom surface of the exterior resin (1
The terminal (6) (71) is coated so that the thickness of the terminal (0a) is larger in the thickness direction than the bottom surface of the end portion of the terminal (6) (71).
そして、上記樹脂成形工程（Ｃ）では、前記外装樹脂（
１０ａ）を所定形状に成形加工する。その際、外装樹脂
（１０ａ）のうち端子（６）（７１の端部底面に対応す
る上下面を一対の成形型（１２ａ）（１２ｂ）を用いて
加圧し、所定形状の外装樹脂層（１０ｂ）を形成する。In the resin molding step (C), the exterior resin (
10a) is molded into a predetermined shape. At that time, the upper and lower surfaces of the exterior resin (10a) corresponding to the bottom surfaces of the terminals (6) (71) are pressurized using a pair of molds (12a) (12b), and the exterior resin layer (10b) is shaped into a predetermined shape. ) to form.
より詳細には、端子＋６１ （７１の端部底面と外装樹
脂層（１０ｂ）の底面とを同一平面上に位置させるため
、成形型（１２ａ）のうち端子（６１（７１の端部に対
応する箇所には、凸部（１３）が形成されており、上記
外装樹脂（１０ａ）を成形型（１２ａ）（１２ｂ）で加
圧し、上記凸部（１３）で端子（６）（７１の端部を押
圧しながら成形することにより、所定形状の外装樹脂層
（ｉｏｂ）を形成している。上記のようにして樹脂成形
すると、端子＋６１ Ｉｎの端部底面が成形型（１２ｂ
）に押圧され、端子［６１＋７１の端部が凸部（１３）
と成形型（１２ｂ）とでより挾持された状態で、外装樹
脂（１０ａ）を前記一対の成形型（１２ａＨ１２ｂ）で
加圧成形することができるので、外装樹脂（１０ａ）の
加圧、圧縮に伴い、外装樹脂層（１０ｂ）の底面を端子
（６１（７１の端部底面と同一平面上に位置させること
ができ、バラツキがなくインライン性および表面実装性
に、優れた圧電部品が得られる。More specifically, in order to position the bottom surface of the end of terminal +61 (71) and the bottom surface of the exterior resin layer (10b) on the same plane, the terminal (61 (corresponding to the end of 71) Convex portions (13) are formed at the locations, and the exterior resin (10a) is pressurized with molds (12a) (12b), and the convex portions (13) are used to form terminals (6) (ends of 71). By molding while pressing, an exterior resin layer (iob) of a predetermined shape is formed.When the resin is molded as described above, the bottom surface of the end of the terminal +61 In is molded into the mold (12b
), and the end of the terminal [61+71 becomes the convex part (13)
Since the exterior resin (10a) can be pressure-molded with the pair of molds (12aH12b) while being held tightly between the exterior resin (10a) and the mold (12b), it is possible to pressurize and compress the exterior resin (10a). Accordingly, the bottom surface of the exterior resin layer (10b) can be positioned on the same plane as the end bottom surface of the terminal (61 (71), and a piezoelectric component with no variation and excellent in-line performance and surface mountability can be obtained.
また上記樹脂成形工程（Ｃ）または該工程を経た後、加
熱することにより、前記のように、共振子電極部（３）
と外装樹脂層（１０ｂ）との間に前記振動空間（１１）
が形成される。Further, by heating the resin molding step (C) or after the resin molding step, the resonator electrode portion (3) can be formed as described above.
The vibration space (11) is between the and the exterior resin layer (10b).
is formed.
なお、上記凸部（１３）は一対の成形型（１２ａ）（１
２ｂ）のうちいずれか一方に形成されていればよい、ま
た凸部（１３）は、前記端子！６＋ （７１の端部底面
を成形型（１２ａＨ１２ｂ）のいずれか一方に弾性的に
押圧または付勢する弾性部材または付勢部材で形成され
でいてもよい。Note that the convex portion (13) is formed by a pair of molds (12a) (1
2b), and the convex portion (13) may be formed on either one of the terminals! 6+ (It may be formed of an elastic member or a biasing member that elastically presses or biases the end bottom surface of 71 against either one of the molds (12aH12b).
また樹脂成形工程は使用される外装樹脂（１０ａ）の種
類などに応じて適宜の圧力、温度で行なうことができる
、その際、外装樹脂（１０ａ）として熱硬化性樹脂を使
用するときは、樹脂を硬化させる必要がある。In addition, the resin molding process can be carried out at an appropriate pressure and temperature depending on the type of exterior resin (10a) used. In this case, when a thermosetting resin is used as the exterior resin (10a), the resin needs to be cured.
また、この例では、上記樹脂成形工程（Ｃ）の後、端子
切断工程（０）で端子＋６１ （７１の端部を所定長さ
に切断している。このようにすると、極めて小さな圧電
部品であっても、前記成形型（１２ａＨ１２ｂ）の凸部
（１３）により端子（６）（刀の端部を確実に押圧でき
るので、バラツキがなくインライン性に優れる圧電部品
を生産性よく製造することができる。なお、上記端子切
断工程（Ｄ）は、必ずしも必要ではなく、予め所定形状
および所定長さに成形加工された端子を用いてもよい。In addition, in this example, after the resin molding step (C), the end of the terminal +61 (71) is cut to a predetermined length in the terminal cutting step (0). Even if there is, the convex part (13) of the mold (12aH12b) can reliably press the terminal (6) (edge part of the sword), so piezoelectric components with consistent and excellent in-line properties can be manufactured with high productivity. Note that the terminal cutting step (D) is not necessarily necessary, and a terminal previously formed into a predetermined shape and length may be used.
上記のようにして製造された圧電部品は、例えは、回路
基板の導体パターンに端子（６１［７１の端部を載置し
ても、導体パターンと端子＋６１ ＋７１の端部底面と
の間や回路基板と外装樹脂層（１０ｂ）との間に間隙部
が存在せず、安定した状態で載置でき、導体パターンと
端子（６１（７１の端部とを導電性ペーストや半田など
の導電性接合剤で直接平面付けにより接続することがで
き、表面実装性に優れている。For example, even if the ends of the terminals (61 [71) are placed on the conductor pattern of the circuit board, the piezoelectric component manufactured as described above has a gap between the conductor pattern and the bottom of the ends of the terminals There is no gap between the circuit board and the exterior resin layer (10b), so it can be placed in a stable state. It can be connected by direct plane attachment using a bonding agent, and has excellent surface mountability.
なお、本発明は、回路基板の導体パターンに端子を平面
付けする場合に限らず、種々のパラゲージ形状を有する
圧電部品に適用することができ、端子は上記形状に限ら
ず、実装性を損わない範囲で、適宜の形状、例えばＬ字
状などに予め成形加工されていてもよい、また本発明は
、２＠子置型圧電品に限らす３端子型圧電部品にも適用
でき、端子は、圧電部品の用途に応じて、圧電部品の片
側、両側などの適所に形成されていてもよい。The present invention is not limited to the case where terminals are flatly attached to the conductor pattern of a circuit board, but can be applied to piezoelectric components having various paramagnetic shapes, and the terminals are not limited to the above-mentioned shapes. The present invention can also be applied to a three-terminal piezoelectric component, which is limited to a two-terminal type piezoelectric component. Depending on the use of the piezoelectric component, it may be formed at an appropriate location, such as on one side or both sides of the piezoelectric component.
また前記振動空間は必ずしも必要ではなく、圧電素子の
ｍ遣に応じて、圧電素子が弾性を有するシリコーン樹脂
等と外装樹脂とで順次被覆、外装されていてもよい。Further, the vibration space is not necessarily necessary, and the piezoelectric element may be sequentially coated or exteriorized with an elastic silicone resin or the like and an exterior resin, depending on the usage of the piezoelectric element.
また圧電素子としては、厚みすべり振動モードに限らず
、厚み縦振動モード、幅振動モードや厚みねじり振動モ
ード等、種々のエネルギー閉じ込め型モードが利用でき
、本発明は、２段のバンドパスフィルタ、中間周波数用
共振子、トラップ、発振子や歪センサなどの圧電部品に
適用することができる。In addition, the piezoelectric element can be used in various energy trapping modes such as not only the thickness shear vibration mode, but also the thickness longitudinal vibration mode, the width vibration mode, and the thickness torsional vibration mode. It can be applied to piezoelectric components such as intermediate frequency resonators, traps, oscillators, and strain sensors.
なお、圧電基板としては、圧電性を示す単結晶、多結晶
、セラミックスなど、種々の材料が使用できる。Note that various materials that exhibit piezoelectricity, such as single crystal, polycrystal, and ceramics, can be used as the piezoelectric substrate.
［発明の効果コ
以上のように、本発明によれば、予め所定形状に成形さ
れた端子を圧電素子に取付け、外装樹脂で被覆した後、
該外装樹脂を成形するので、加工方法を簡略化でき、安
価で、表面実装性および信頼性に優れると共に、外装樹
脂層の破損などを防止することができる。[Effects of the Invention] As described above, according to the present invention, after attaching a terminal formed in a predetermined shape to a piezoelectric element and covering it with an exterior resin,
Since the exterior resin is molded, the processing method can be simplified, it is inexpensive, and has excellent surface mountability and reliability, and damage to the exterior resin layer can be prevented.
第１図は、本発明の圧電部品の製造方法を示す一工程図
、
第２図は、圧電部品の従来の製造方法の概要を示す工程
図、
第３図は表面実装状態を示す概略図である。
（１）・・・圧電素子、＋６１ ［７１・・・端子、（
１０ａ）・・・外装樹脂、（１０ｂ）−・・外装樹脂層
、（１２ａ）（１２ｂ）・・・成形型第
図Fig. 1 is a process diagram showing the method of manufacturing a piezoelectric component of the present invention, Fig. 2 is a process diagram showing an overview of a conventional method of manufacturing a piezoelectric component, and Fig. 3 is a schematic diagram showing a surface-mounted state. be. (1)...Piezoelectric element, +61 [71...Terminal, (
10a)... Exterior resin, (10b)... Exterior resin layer, (12a) (12b)... Molding mold diagram
Claims (1)
外装樹脂で被覆した後、該外装樹脂を成形することを特
徴とする圧電部品の製造方法。Attach a terminal pre-formed to a predetermined shape to a piezoelectric element,
A method for manufacturing a piezoelectric component, which comprises coating the piezoelectric component with an exterior resin and then molding the exterior resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24013988A JPH0287811A (en) | 1988-09-26 | 1988-09-26 | Production of piezoelectric parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24013988A JPH0287811A (en) | 1988-09-26 | 1988-09-26 | Production of piezoelectric parts |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14886592A Division JPH05160660A (en) | 1992-05-15 | 1992-05-15 | Production of piezoelectric parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0287811A true JPH0287811A (en) | 1990-03-28 |
Family
ID=17055075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24013988A Pending JPH0287811A (en) | 1988-09-26 | 1988-09-26 | Production of piezoelectric parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0287811A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823013A (en) * | 1981-08-04 | 1983-02-10 | Seiko Epson Corp | Multilayered liquid-crystal display device |
| JPS62241344A (en) * | 1986-04-14 | 1987-10-22 | Oki Electric Ind Co Ltd | Manufacture of resin sealed type semiconductor device and molding die |
-
1988
- 1988-09-26 JP JP24013988A patent/JPH0287811A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5823013A (en) * | 1981-08-04 | 1983-02-10 | Seiko Epson Corp | Multilayered liquid-crystal display device |
| JPS62241344A (en) * | 1986-04-14 | 1987-10-22 | Oki Electric Ind Co Ltd | Manufacture of resin sealed type semiconductor device and molding die |
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